Chemical nickel palladium gold production line and production technology

A production process, chemical nickel technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of rising production costs and labor costs, production lines that cannot be produced at the same time, and circuit boards that are prone to scratches , to achieve the effect of saving manpower, shortening the production line, avoiding pollution and scratches

Pending Publication Date: 2019-06-07
深圳互连微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the nickel-palladium-gold production process needs to be transferred between various production lines. This process requires a lot of manpower, and the circuit board is prone to damage such as scratches. At the same time, in order to avoid the contamination of the circuit board during the transfer process, the Re-cleaning is required before the next stage of treatment. The above problems will not only prolong

Method used

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  • Chemical nickel palladium gold production line and production technology
  • Chemical nickel palladium gold production line and production technology
  • Chemical nickel palladium gold production line and production technology

Examples

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Comparison scheme
Effect test

Embodiment 1

[0119] The structural representation of the electroless nickel-plating palladium-gold production line that the present embodiment provides is as figure 1 , figure 2 , image 3 with Figure 4 as shown, figure 1 The structural representation of the chemical nickel-palladium-gold production line provided by the present invention includes:

[0120] Conveyor mechanism (not shown in the figure), comprises: the pretreatment area horizontal conveying device that is used for horizontally conveying plating piece, the chemical nickel palladium gold zone horizontal conveying device that is used for horizontally conveying plating piece, is used for the back of horizontal conveying plated piece The horizontal conveying device in the treatment area; the first vertical conveying device, the first vertical conveying device is used to vertically lift the plated parts from the horizontal conveying device in the chemical nickel palladium gold area and immerse them in the chemical nickel tank ...

Embodiment 2

[0127] Adopt the electroless nickel-palladium-gold production line in embodiment 1 to carry out chemical nickel-palladium-gold process production:

[0128] Put the plated parts into the production line in order: sandblasting, grinding, primary cleaning, degreasing, micro-etching, secondary cleaning, pickling and three pre-cleaning treatments;

[0129] Then directly carry out pre-soaking, activation, four times of cleaning, nickel plating, five times of cleaning, palladium plating, six times of cleaning, gold plating, seven times of cleaning, gold surface sealing and eight times of chemical nickel palladium gold treatment;

[0130] Finally, it is directly processed after drying.

[0131] During chemical nickel palladium gold treatment:

[0132] The plating solution formula for hard plate electroless nickel plating is: nickel sulfate 10g / L, sodium hypophosphite 25g / L, lactic acid 10g / L, ammonia water 10g / L, ethylenediamine tetramethylene phosphonate sodium (EDTMPS) 20g / L, Hydr...

Embodiment 3

[0150] Carry out chemical nickel-palladium-gold process production according to the method for embodiment 2, and the difference of embodiment 2 is:

[0151] Plating solution formula for hard plate electroless nickel plating: nickel sulfate 10g / L, sodium hypophosphite 25g / L, lactic acid 8g / L, ammonia water 10g / L, sodium ethylenediamine tetramethylene phosphonate (EDTMPS) 30g / L, hydroxyl Ethylidene diphosphonic acid (HEDP) 15g / L, ammonium chloride 15g / L, glycine 10g / L, praseodymium sulfate 91ppm, yttrium sulfate 13ppm.

[0152] The plating solution formula for electroless nickel plating on flexible boards is: nickel sulfate 10g / L, sodium hypophosphite 25 / L, lactic acid 10g / L, malic acid 10g / L, ammonia water 10g / L, glycine 10g / L, lead acetate 10ppm, OP -10 15g / L, saccharin 10g / L, diazolidinyl urea 5g / L.

[0153] Plating solution formula for chemical reduction palladium plating: palladium sulfate 1g / L, sodium hypophosphite 10g / L, ethylenediamine 10g / L, triammonium citrate 10g / L, ...

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Abstract

The invention provides a chemical nickel palladium gold production line. The chemical nickel palladium gold production line comprises a conveying mechanism, a pre-treatment area, a chemical nickel palladium gold area and a post-treatment area, wherein the pre-treatment area, the chemical nickel palladium gold area and the post-treatment area are sequentially adjacently arranged on a moving route of the conveying mechanism. According to the chemical nickel palladium gold production line, the pre-treatment, chemical nickel palladium gold and the post-treatment in chemical nickel palladium gold production are integrated in one production line, so that the labor is saved, and the processes are decreased; in addition, the manufacturing and use cost of the production line are reduced. Additionally, the invention provides a chemical nickel palladium gold technology. The technology involves chemical nickel plating of a soft board, a chemical nickel plating of a hard board, palladium reducing,palladium replacing, gold reducing and gold replacing; and three nickel bathes, three palladium bathes and three gold bathes are formed in the production line. The production line integrates all demands in the chemical nickel palladium gold production technology; and the manufacturing cost and the use coat are decreased.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless nickel-palladium-gold production line and a production process. Background technique [0002] As the functions and signals of integrated circuits continue to increase, a large number of I / O requirements and signal transmission quality have become the current trend, and the requirements for high frequency are increasing, and the surface treatment technology required for circuit board and chip welding is also increasing. Needs to be greatly improved. The increase in high frequency also needs to improve the electron migration ability that the product needs to withstand, and the chemical nickel palladium gold (ENEPIG) has good adhesion ability, and the nickel layer can effectively prevent the diffusion of copper atoms. Nickel-palladium-gold forms an intermetallic compound (IMC) which is quite smooth after being given energy, which can effectively block the...

Claims

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Application Information

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IPC IPC(8): C23C18/32C23C18/42
Inventor 张毅张新学刘龙平肖开球李兴海贺炳祥
Owner 深圳互连微电子材料有限公司
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