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Low melting point snbi alloy-copper composite electronic paste and its preparation and printing method

A technology of electronic paste and low melting point, which is applied in the direction of cable/conductor manufacturing, equipment for manufacturing conductive/semiconductive layers, conductive materials dispersed in non-conductive inorganic materials, etc., which can solve the problem of high sintering temperature and copper powder Easily oxidized, poor conductivity and other problems, to achieve the effect of simple process route, easy to obtain raw materials, and low production cost

Active Publication Date: 2020-06-19
扬州虹运电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a low-melting point SnBi alloy-copper composite electronic paste, which solves the problems of poor electrical conductivity, poor sintering adhesion, wettability and mechanical properties, and excessively high sintering temperature of the copper composite electronic paste in the prior art. , Copper powder is easy to oxidize

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Step 1, preparing a copper sulfate solution with a mass volume ratio of 10 g / L at room temperature, adding trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution to a total of 10 g / L, stirring and mixing to obtain a gel-like mixture A; Then add NaOH solution in the gel mixture A to adjust the pH to 10, stir to obtain the main salt mixed solution B; then add catalyst nickel sulfate 0.8g / L in the main salt mixed solution B, and reducer sodium hypophosphite 30g / L L, buffering agent boric acid 30g / L, utilize NaOH solution to adjust pH to 10, obtain plating solution mixed solution C;

[0056] Step 2, put the graphene nanosheets into the prepared mixed solution C of the plating solution, and then add the additive polyethylene glycol 0.6g / L and potassium ferrocyanide 0.2g / L; the temperature is controlled at 40°C, and the pH The control is 10, magnetic stirring, ultrasonic dispersion, and the graphene nanosheets are filtered out; they are washed with deio...

Embodiment 2

[0062] Prepare the copper sulfate solution that mass volume ratio is 13g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to add up to 13g / L in this copper sulfate solution, stir and mix to obtain gel-like mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 13, stir to obtain the main salt mixed solution B; then add catalyst nickel nitrate 1g / L, reducing agent sodium hypophosphite 33g / L, buffer Boric acid 33g / L, utilize NaOH solution to adjust PH to 13, obtain plating solution mixed solution C;

[0063] Step 2, put the graphene nanosheets into the prepared mixed solution C of the plating solution, and then add the additive polyethylene glycol 0.8g / L and potassium ferrocyanide 0.4g / L; the temperature is controlled at 50°C, and the pH The control is 13, magnetic stirring, ultrasonic dispersion, and the graphene nanosheets are filtered out; they are washed with deionized water several times to neutrality, and finally dried in a vac...

Embodiment 3

[0069] Prepare the copper sulfate solution that mass volume ratio is 15g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to add up to 15g / L in this copper sulfate solution, stir and mix to obtain gel-like mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 15, stir to obtain the main salt mixed solution B; then add catalyst nickel sulfate 1.2g / L, reducing agent sodium hypophosphite 35g / L, buffer Agent boric acid 35g / L, utilize NaOH solution to adjust pH to 15, obtain plating solution mixed solution C;

[0070] Step 2, put the graphene nanosheets into the prepared mixed solution C of the plating solution, and then add the additive polyethylene glycol 1g / L and potassium ferrocyanide 0.6g / L; the temperature is controlled at 60°C, and the pH is controlled 15, magnetically stirred, ultrasonically dispersed, and filtered to take out the graphene nanosheets; using deionized water to wash for several times until neutral, and finally dr...

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Abstract

The invention discloses low-melting-point SnBi alloy-copper composite electronic slurry, which comprises the following components by weight: 55-85% of mixed conductive phase, 5-15% of tin-bismuth alloy powder, 10-25% of organic carrier, and additives consisting of 0-0.5% of La and 0-4.5% of Ga, with the total percent being 100%. The invention also discloses a preparing method of the low-melting-point SnBi alloy-copper composite electronic slurry and a printing method of the low-melting-point SnBi alloy-copper composite electronic slurry. The low-melting-point SnBi alloy-copper composite electronic slurry and the preparing and printing applications thereof have the advantages of simple process route, easy availability of raw materials, low production cost, no lead and cadmium components, and no pollution.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and relates to a low melting point SnBi alloy-copper composite electronic paste, the invention also relates to a preparation method of the low melting point SnBi alloy-copper composite electronic paste, and the low melting point SnBi alloy - Printing method of copper composite electronic paste. Background technique [0002] As a kind of thick film paste, electronic paste is an important part of electronic information materials. As a high-tech electronic functional material, it is widely used in thick film integrated circuits, surface packaging, microelectronics technology, solar cells, printing and high-tech Electronic industry such as resolution conductors. With the continuous development of modern electronic information technology towards high integration, miniaturization, intelligence and greening, the requirements for the performance of electronic paste are getting higher and higher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/0026
Inventor 屈银虎梅超左文婧刘晓妮周思君张学硕何炫袁建才
Owner 扬州虹运电子材料有限公司
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