A method of manufacturing a diamond-based thin film resistor element
A diamond film, thin film resistor technology, applied in resistor manufacturing, resistors, electrical components and other directions, can solve problems not mentioned etc.
Active Publication Date: 2020-11-13
UNIV OF SCI & TECH BEIJING
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Problems solved by technology
A few foreign companies such as EMC and Smiths Interconnect have reported products that use CVD diamond as a thin film chip resistor carrier, but they have not mentioned how to realize this structure and whether they have the ability to prepare in batches
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[0033] 1. Choose an unpolished silicon wafer with a size of φ35mm×1mm as the substrate, and use diamond powder grinding to assist alcohol cleaning to process the sample, and then dry it and put it into a microwave plasma CVD deposition system;
[0034] 2. Using a microwave plasma CVD system to plate a diamond film on the surface of the silicon wafer. A typical deposition process is: working gas hydrogen / methane, power 2.8-3.0kW, substrate temperature 800°C, methane concentration 3%, deposition time 100h. The actual deposition thickness is about 260-280μm;
[0035] 3. Grinding and polishing the diamond film with the substrate, the surface roughness Ra of the diamond film reaches 50nm, and the film thickness is approximately 200±20μm;
[0036] 4. Scribing the diamond film with a diamond-specific laser cutting machine. The size of a single diamond unit is 1.4×1.4mm, the slit width is about 50 μm, and the cutting depth is 250-280 μm;
[0037] 5. Using a microwave plasma CVD devi...
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Abstract
The invention discloses a preparation method of a diamond-based thin film chip resistor element, and belongs to the field of manufacturing of electronic components. A diamond film is deposited on an original carrier in a CVD mode, and then grinding, polishing, scribing and etching treatment processes are sequentially completed; then a thin film resistor is constructed on the surface of the patterned CVD diamond film, and the resistance of the thin film resistor is adjusted through a heat treatment process; then electrodes are prepared on the surface of the resistor; and finally, the original carrier of the CVD diamond film is removed to obtain the diamond-based thin film resistor element with the size and the resistivity meeting the requirements. The element is based on diamond as a carrier, and has the characteristics of stable chemical property, high heat conductivity and the like. The laser scribing is adopted to assist the plasma etching process in the intermediate process, so thata series of problems of high subsequent processing difficulty of the CVD diamond film, generation of a conductive carbon film after processing and the like are solved, and the batch production of therelatively low-cost CVD diamond film-based thin film chip resistor is realized. While the relative cost is reduced, the product quality and the production efficiency are ensured.
Description
technical field [0001] The invention belongs to the field of electronic component manufacturing, in particular to a method for manufacturing a thin film chip resistor element Background technique [0002] Chip electronic components have been widely used in electronic products. According to statistics, the chip rate of various electronic components has reached more than 70%. Among various types of chip electronic components, chip resistors have the largest demand, accounting for more than 45% of the entire chip components. The global annual demand for chip resistors has exceeded 1 trillion pieces. Chip resistors are used to achieve precise impedance matching, and to regulate current and reduce voltage in electronic circuits. Chip resistors mainly include thick film and thin film chip resistors. Among them, thin film chip resistors are a new generation of chip resistors with the fastest development, the widest application range and the most promising prospects in recent year...
Claims
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IPC IPC(8): H01C17/075
CPCH01C17/075
Inventor 魏俊俊李成明陈良贤刘金龙高旭辉
Owner UNIV OF SCI & TECH BEIJING