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Preparation method of copper based graphene composite with high heat conductivity

A composite material and graphene technology, applied in electrolytic coatings, current conduction devices, electrodes, etc., can solve the problems of insignificant performance improvement, poor film compactness, and high equipment requirements, and achieve improved nucleation rate, low cost, and ratio reasonable effect

Active Publication Date: 2019-11-05
CHANGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The powder metallurgy method prepares copper-based graphene materials by low-temperature hot-pressing sintering, which has many process parameters and the shape of the sintered bulk metal is limited, and generally needs to be strengthened by heat treatment; the preparation of copper-based graphene by hydrothermal method has a controllable process and crystallization. The purity is high, but the requirements for equipment are high and the technology is difficult; the vapor phase deposition method is a method for preparing copper-based graphene by depositing a graphene layer on the surface of a substrate through temperature change. It is suitable for the production of thin film materials, and the process is simple. The layer is uniform, but the deposition layer is thin and the choice of substrate materials is limited; the electrodeposition method is to prepare copper-based graphene materials through the electrochemical redox method with the deposition solution of a specific composition as the intermediary, which has high process efficiency and deposition The advantages of uniform layer and controllable size, etc., the disadvantage is that the wettability between metal and graphene is poor, the crystal grains are coarse, the compactness of the film is poor, and the performance improvement is not obvious

Method used

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  • Preparation method of copper based graphene composite with high heat conductivity

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Experimental program
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Effect test

Embodiment 1

[0027] The composition ratio of the graphene copper electrodeposition solution is: copper sulfate pentahydrate 200g / L, graphene 0.05g / L, and the balance is deionized water; the concentration of additives is: thiourea 2mg / L, boric acid 1g / L , polyethylene glycol fatty acid ester 10mg / L; activate the plate, pickling to remove oil and rust, remove the surface oxide film, the activation solution composition is: 50mL sulfuric acid and 350ml deionized water; the process environment of the deposition solution is: temperature 20°C, pH=0.5; the electrical parameters of DC electrodeposition are: current density is 180mA / cm 2 , the duty cycle is 70%, the deposition frequency is 300Hz, and the electrodeposition time is 0.5h. In this case and under the process conditions, the deposited layer is uniform in thickness, about 30 μm thick, bright in surface and average in density. The thermal conductivity of the prepared deposited layer can reach 390W / m.k, and the tensile strength can reach 313...

Embodiment 2

[0030] The composition ratio of the graphene copper electrodeposition solution is: copper sulfate pentahydrate 200g / L, graphene 1.0g / L, and the balance is deionized water; the concentration of additives is: thiourea is 5mg / L, boric acid is 4g / L , polyethylene glycol fatty acid ester 20mg / L; activate the plate, pickling to remove oil and rust, remove the surface oxide film, the activation solution composition is: 50mL sulfuric acid and 350ml deionized water; the process environment of the deposition solution is: temperature 30°C, pH=1.0; the electrical parameters of DC electrodeposition are: current density is 180mA / cm 2 , the duty cycle is 70%, the deposition frequency is 500Hz, and the electrodeposition time is 0.5h. In this case and under the process conditions, the thickness of the deposition layer deposited is uniform, the thickness is about 40 μm, the surface is bright, and the compactness is good. The thermal conductivity of the prepared deposition layer can reach 636W / m...

Embodiment 3

[0033] The composition ratio of the graphene copper electrodeposition solution is: copper sulfate pentahydrate 200g / L, graphene 2g / L, and the balance is deionized water; the additive concentration is: thiourea is 10mg / L, boric acid is 6g / L, Polyethylene glycol fatty acid ester 30mg / L; Activate the plate, pickling to remove oil and rust, remove the surface oxide film, the activation solution composition is: 50mL sulfuric acid and 350ml deionized water; the process environment of the deposition solution is: the temperature is 30°C, pH=1.5; the electrical parameters of direct current electrodeposition are: the current density is 180mA / cm 2 , the duty cycle is 70%, the deposition frequency is 500Hz, and the electrodeposition time is 1h. In this case and under the process conditions, the thickness of the deposition layer deposited is uniform, the thickness is about 80 μm, the surface is bright, and the compactness is good. The thermal conductivity of the prepared deposition layer c...

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Abstract

The invention belongs to the field of heat conduction materials, and specifically discloses a preparation method of a copper based graphene composite with high heat conductivity. According to the preparation method, a novel sediment composition is used for direct-current electrodeposition, a certain quantity of additives are added to sediments, and the reasonable electrodeposition frequency is selected to prepare the novel copper based graphene composite with high strength and high heat conductivity. According to the copper based graphene composite prepared by using an electrodeposition preparation technique, the heat conductivity can reach 390 to 1112 W / m.k, the tensile strength reaches 300 to 450 MPa, and the application to the field of heat conduction can be met.

Description

technical field [0001] The invention belongs to the field of heat conduction materials, and in particular relates to a preparation method of a high heat conduction copper-based graphene composite material. Background technique [0002] With the development of science and technology, the large-scale application of cooling film has become a reality, and it is closely related to people's life. Commonly used mobile phones, computers, etc. have the application of heat dissipation film inside. The traditional heat dissipation film mainly uses copper, graphite and other materials as the heat dissipation film. Copper is used as the heat dissipation film, which has excellent mechanical and conductive properties, but there are often heat dissipation problems, which will cause the equipment to affect the work efficiency due to overheating after working for a period of time. Although graphite has excellent thermal conductivity, its mechanical and processing properties are relatively po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/58C25D15/00
CPCC25D3/58C25D15/00C25D3/38C25D5/34C25D1/00C25D17/007C25D17/10
Inventor 魏伟贾飞龙储富强魏坤霞杜庆柏胡静
Owner CHANGZHOU UNIV
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