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Large-pipe-diameter Ni-V rotary target material containing microelements and preparation method of large-pipe-diameter Ni-V rotary target material

A technology with trace elements and large tube diameter, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve problems such as cracking of nickel-vanadium tubes, improve utilization rate, and improve grain boundary binding force , The effect of improving the yield

Active Publication Date: 2019-11-19
NANJING DAMAI SCI&TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: One of the purposes of the present invention is to provide a large-diameter Ni-V rotating target containing trace elements, which can improve the performance of the rotating target by adding trace elements C, B, Ti, and Mg; The second purpose is to provide a method for preparing a large-diameter Ni-V rotating target containing trace elements, which can overcome the problems of nickel-vanadium tube cracking, inclusions, defects, eccentricity and processing difficulties during the preparation process. Vanadium rotating target

Method used

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  • Large-pipe-diameter Ni-V rotary target material containing microelements and preparation method of large-pipe-diameter Ni-V rotary target material
  • Large-pipe-diameter Ni-V rotary target material containing microelements and preparation method of large-pipe-diameter Ni-V rotary target material
  • Large-pipe-diameter Ni-V rotary target material containing microelements and preparation method of large-pipe-diameter Ni-V rotary target material

Examples

Experimental program
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Effect test

Embodiment 1

[0050] In this embodiment, the components and contents of the large-diameter Ni-V rotating target containing trace elements are, by mass percentage, respectively: C 0.02%, B 0.03%, Ti 0.005%, Mg 0.01%, V 6% and The balance is Ni and unavoidable impurities.

[0051] The preparation method of the large-diameter Ni-V rotating target comprises the following steps:

[0052] (1) Vacuum smelting: prepare raw materials graphite, boron particles, metal titanium, metal magnesium, metal vanadium, electrolytic nickel, wherein the purity of the raw materials is 99.9% of graphite, 99.9% of boron particles, 99.9% of metal titanium, 99.9% of Metal magnesium, 99.9% metal vanadium, 99.96% electrolytic nickel;

[0053] Clean the surface oil and oxides of electrolytic nickel and metal vanadium, dry and weigh them, then bake the electrolytic nickel at 600°C and keep it warm for 6 hours; Graphite is put into a vacuum melting crucible, electrified and smelted, the smelting temperature is 1500°C, a...

Embodiment 2

[0065] The components and contents of the large-diameter Ni-V rotating target in this embodiment are, by mass percentage, respectively: C0.03%, B 0.01%, Ti 0.003%, Mg 0.03%, V 7%, and the balance Ni and unavoidable impurities.

[0066] The preparation method of the large-diameter Ni-V rotating target in this example is basically the same as that in Example 1, except that:

[0067] In step (1), the electrolytic nickel is baked at 580°C and kept warm for 5 hours; the melting temperature is 1450°C, the melting time is 70 minutes, and the refining time is 10 minutes:

[0068] In step (3), the ingot is heated to 1090° C., and after 20 minutes of heat preservation, forging is carried out. The starting forging temperature is 1090° C., and the final forging temperature is 1000° C.; the deformation of pier thickness is 55%, and the deformation of post-drawing is 55%;

[0069] In step (4), the central through hole with a diameter of 20 mm is machined, and a tapered hole with a 30° tap...

Embodiment 3

[0075] The components and contents of the large-diameter Ni-V rotating target in this embodiment are, by mass percentage, respectively: C 0.05%, B 0.08%, Ti 0.001%, Mg 0.05%, V 8% and the balance Ni and unavoidable impurities.

[0076] The preparation method of the large-diameter Ni-V rotating target in this example is basically the same as that in Example 1, except that:

[0077] In step (1), the electrolytic nickel is baked at 610°C for 8 hours; the melting temperature is 1400°C, the melting time is 90 minutes, and the refining time is 20 minutes:

[0078] In step (3), the ingot is heated to 1110°C, and after holding the heat for 40 minutes, it is forged. The starting forging temperature is 1110°C, and the final forging temperature is 990°C; the deformation of the pier thickness is 65%;

[0079] In step (4), machining a diameter is a central through hole of 30mm, and machining a tapered hole into a 40° taper at one end thereof;

[0080] In step (5), the induction heating t...

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Abstract

The invention discloses a large-pipe-diameter Ni-V rotary target material containing microelements and the preparation method of the large-pipe-diameter Ni-V rotary target material. The rotary targetmaterial comprises the following components of, in percentage by mass, 0.01%-0.05% of C, 0.01%-0.08% of B, 0.001%-0.006% of Ti, 0.01%-0.05% of Mg, 6%-8% of V, and the balance Ni and inevitable impurities; and the preparation method comprises the following steps of vacuum melting, hot forging, machining, hot extrusion, acid pickling treatment, solid solution treatment, cold rolling or boring, annealing treatment, the machining or binding. According to the target material and the method, on the basis of Ni-V, trace elements of the C, the B, the Ti and the Mg are added for component optimization,the contents of oxygen, sulfur and the like are reduced, the generation of cracks can be inhibited, the grain boundary binding force and strength of the target material are improved, and crystal grains are refined, so that the yield is improved; and the rejection rate is reduced by optimizing hot working process parameters.

Description

technical field [0001] The invention relates to a magnetron sputtering target material and its preparation, in particular to a large diameter Ni-V rotating target material containing trace elements and its preparation method. Background technique [0002] With the development of science and technology, the development of coating technology is becoming more and more perfect, and the magnetron sputtering coating technology, which occupies an important position in the coating field, is also being further improved, and the target is the most critical basic consumable in the process of magnetron sputtering coating. Only high-utilization, high-quality, and most suitable targets can fully meet the demand and drive the development of science and technology. [0003] At present, the nickel-vanadium target magnetron sputtering coating technology has a relatively large market in the domestic solar energy field, but most of the nickel-vanadium targets are planar targets, and rotating ta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C22C1/02C22C19/03C22F1/10
CPCC22C1/023C22C19/03C22F1/10C23C14/3414C23C14/35
Inventor 吴宇宁卿海标周其刚
Owner NANJING DAMAI SCI&TECH IND CO LTD
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