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Monocrystalline silicon wafer back thinning grinding wheel and preparation method thereof

A backside thinning and grinding wheel technology, which is applied in applications, household utensils, ceramic products, etc., can solve problems such as scratches and lowering, and achieve the effects of small damage layer, reduced agglomeration, and good wettability

Active Publication Date: 2020-02-07
郑州伯利森新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to solve the problem that the agglomeration of abrasives in the grinding wheel will scratch the surface of the silicon wafer during the thinning process of the silicon wafer, and to provide a fine-grained and ultra-fine grain size that reduces the agglomeration of the abrasive and improves the dispersion of the abrasive. Preparation method of particle size vitrified bond grinding wheel

Method used

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  • Monocrystalline silicon wafer back thinning grinding wheel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] SS1. Hydrolyze 40ml tetraethyl orthosilicate, 20ml absolute ethanol, and 12ml deionized water in a beaker to form a silica sol;

[0036] SS2. 11.65g of sodium nitrate, 13.12g of calcium nitrate, 13.89g of magnesium nitrate, 14.68g of lithium nitrate, 34.59g of aluminum nitrate, and 12.07g of boric acid were dissolved in 500ml of water, and stirred to form a salt solution;

[0037] SS3. Add the silica sol prepared in step SS1 to the salt solution prepared in step SS2, and stir evenly;

[0038] SS4. 25g diamond and 22g polyvinyl alcohol are added to the mixed solution prepared in step SS3, and the ultrasonic dispersion is uniform to form a suspension;

[0039] SS5. Add 55g of acrylamide, 10.5g of N,N-methylenebisacrylamide, and 2.5g of ammonium persulfate to the suspension prepared in step SS4 to form a gel;

[0040] SS6. Dry the gel prepared in step SS5 in a drying oven at 150° C. for 8 hours to form a xerogel;

[0041] SS7. Calcining the xerogel prepared in step SS6 a...

Embodiment 2

[0049] SS1. Hydrolyze 40ml tetraethyl orthosilicate, 20ml absolute ethanol, and 12m deionized water in a beaker to form a silica sol;

[0050] SS2. 11.65g of sodium nitrate, 13.12g of calcium nitrate, 13.89g of magnesium nitrate, 14.68g of lithium nitrate, 34.59g of aluminum nitrate, and 12.07g of boric acid were dissolved in 500ml of water, and stirred to form a salt solution;

[0051] SS3. Add the silica sol prepared in step 1 to the salt solution prepared in step 2, and stir evenly;

[0052] SS4. Add 31.5g of boron-containing diamond, 3.5g of cubic silicon carbide, and 35g of polyvinyl alcohol into the mixed solution prepared in step 3, and disperse evenly by ultrasonic to form a suspension;

[0053] SS5. Add 55g of acrylamide, 10.5g of N,N-methylenebisacrylamide, and 2.5g of ammonium persulfate to the suspension prepared in step 4 to form a gel;

[0054] SS6. Dry the gel prepared in step 5 in a drying oven at 150° C. for 8 hours to form a xerogel;

[0055] SS7. Calcining t...

Embodiment 3

[0063] SS1. Hydrolyze 40ml tetraethyl orthosilicate, 20ml absolute ethanol, and 12m deionized water in a beaker to form a silica sol;

[0064] SS2. 11.65g of sodium nitrate, 13.12g of calcium nitrate, 13.89g of magnesium nitrate, 14.68g of lithium nitrate, 34.59g of aluminum nitrate, and 12.07g of boric acid were dissolved in 500ml of water, and stirred to form a salt solution;

[0065] SS3. Add the silica sol prepared in step SS1 to the salt solution prepared in step 2, and stir evenly;

[0066] SS4. Add 18g of diamond and 20g of polyvinyl alcohol to the mixed solution prepared in step 3, and disperse evenly by ultrasonic to form a suspension;

[0067] SS5. Add 55g of acrylamide, 10.5g of N,N-methylenebisacrylamide, and 2.5g of ammonium persulfate to the suspension prepared in step 4 to form a gel;

[0068] SS6. Dry the gel prepared in step SS5 in a drying oven at 150° C. for 8 hours to form a xerogel;

[0069] SS7. Calcining the xerogel prepared in step SS6 at 600° C. for ...

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Abstract

The invention discloses a monocrystalline silicon wafer back thinning grinding wheel and a preparation method thereof. According to the preparation method, firstly, a binder raw material is dissolvedin deionized water, then a grinding material, a dispersing agent, monomers, a crosslinking agent and an initiator are added respectively, gel is formed under a certain temperature, and mixed powder which contains the grinding material coated with the binder is formed through drying and calcination; then a pore-forming agent and a wetting agent are added respectively to prepare a molding material,the molding material is made into a molding block in a certain shape through cold press molding, and the molding block is sintered under a certain temperature to be made into a grinding wheel block; and the grinding wheel block is finished, and then the silicon wafer thinning grinding wheel is prepared through bonding. The ceramic binder grinding wheel prepared through the method has the advantages that the binder has good wettability on the grinding material, aggregation of the fine-granularity and ultrafine-granularity grinding material can be remarkably lowered, the dispersity of the grinding material in the binder is good, and the grinding wheel causes little damage to a silicon wafer.

Description

technical field [0001] The invention belongs to the technical field of abrasive tool preparation, and relates to a grinding wheel and a preparation method thereof, in particular to a grinding wheel for thinning the back of a single crystal silicon wafer and a preparation method thereof. Background technique [0002] For single crystal silicon wafers required for IC devices, the backside needs to be ground to a specified thickness and then divided into individual components. Single crystal silicon wafers, which are hard and brittle materials, are prone to edge chipping and scratches due to their high brittleness. Removal is converted to plastic removal. However, it is very difficult to manufacture ultra-fine-grained grinding wheels by traditional technology. The common manufacturing process of vitrified bonded grinding wheels is to mix abrasives, bonding agents, pore-forming agents, etc. in a mixer, and then add wetting agents. Then cold press molding, sintering, bonding, p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/52C04B35/622C04B35/626C04B38/06B24D3/18B24D18/00
CPCC04B35/52C04B35/622C04B35/62675C04B35/62685C04B38/067B24D3/18B24D18/0009C04B2235/3201C04B2235/3208C04B2235/3206C04B2235/3203C04B2235/3217C04B2235/3418C04B2235/3409C04B2235/602C04B2235/656C04B2235/6567C04B2235/5436C04B2235/3826Y02P70/50
Inventor 史冬丽马尧
Owner 郑州伯利森新材料科技有限公司