Dielectric composite film as well as preparation method and application thereof

A composite film and dielectric film technology, applied in the field of dielectric composite film and its preparation, can solve the problems of limited improvement of polymer properties, large specific surface area of ​​nano-fillers, difficult to disperse, etc., to solve the problems of poor thermal stability and excellent mechanical properties. performance, the effect of preventing self-healing breakdown short-circuit failure

Pending Publication Date: 2020-02-21
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this regard, at present, it is generally achieved by adding highly insulating materials to the polymer, such as BNNSs (boron nitride nanosheets), Al 2 o 3 , MgO, TiO 2 and SiO 2 etc. Although the addition of these materials can reduce the conduction loss to a certain extent, it is difficult to achieve uniform dispersion in the polymer matrix due to the large specific surface area of ​​the nanofiller itself and poor compatibility with the polymer, and Limited performance improvement for polymers

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  • Dielectric composite film as well as preparation method and application thereof
  • Dielectric composite film as well as preparation method and application thereof
  • Dielectric composite film as well as preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] A preparation method of a dielectric composite film, which adopts polyimide (PI) as a substrate, and utilizes an ion exchange method to realize growth on the surface of the PI film to form aluminum oxide (Al 2 o 3 ) insulating metal oxide layer. Specifically include the following steps:

[0035] 1) Dissolve the PI polymer in N, N-dimethylacetamide (DMAc) solvent and stir it to fully dissolve to obtain a stable polyamic acid (PAA) solution with a certain concentration; PAA) solution is cast on a clean glass substrate, placed in an oven at a temperature of 250 to 350°C for heat treatment for 1 to 2 hours, to obtain a single-layer PI polymer film;

[0036] 2) Peel off the PI polymer film obtained in step 1) from the glass substrate, put it into distilled water and alcohol for ultrasonic cleaning, and remove surface oil and impurities;

[0037] 3) Completely immerse the film treated in step 2) in NaOH alkaline solution with a concentration of 0.5-2mol / L, keep it for 5-30...

Embodiment 2

[0044] A preparation method of a dielectric composite film, which adopts polyimide (PI) as a substrate, and utilizes an ion exchange method to realize growth on the surface of the PI film to form aluminum oxide (Al 2 o 3 ) insulating metal oxide layer. Specifically include the following steps:

[0045] 1) Dissolve the PI polymer in N, N-dimethylacetamide (DMAc) solvent and stir it to fully dissolve to obtain a stable polyamic acid (PAA) solution with a certain concentration; PAA) solution is cast on a clean glass substrate, placed in an oven at a temperature of 250 to 350°C for heat treatment for 1 to 2 hours, to obtain a single-layer PI polymer film;

[0046] 2) Put the PI polymer film obtained in step 1) into distilled water and alcohol for ultrasonic cleaning to remove surface oil and impurities;

[0047] 3) Completely immerse the film treated in step 2) in NaOH alkaline solution with a concentration of 0.5-2mol / L, keep it for 5-30min, take it out, and wash it repeatedly...

Embodiment 3

[0053] The invention discloses a preparation method of a dielectric composite film, which uses polyimide (PI) as a substrate, and utilizes an ion exchange method to grow and form a magnesium oxide (MgO) insulating metal oxide layer on the surface of the PI film. Specifically include the following steps:

[0054] 1) Dissolve the PI polymer in N, N-dimethylacetamide (DMAc) solvent and stir it to fully dissolve to obtain a stable polyamic acid (PAA) solution with a certain concentration; PAA) solution is cast on a clean glass substrate, placed in an oven at a temperature of 250 to 350°C for heat treatment for 1 to 2 hours, to obtain a single-layer PI polymer film;

[0055] 2) Peel off the PI polymer film obtained in step 1) from the glass substrate, put it into distilled water and alcohol for ultrasonic cleaning, and remove surface oil and impurities;

[0056] 3) Completely immerse the film treated in step 2) into Ca(OH) with a concentration of 0.5-2mol / L 2 In the alkaline solu...

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Abstract

The invention discloses a dielectric composite film as well as a preparation method and application thereof. The preparation method includes the following steps: performing hydrolysis treatment on a polymer dielectric film to open a polymer chain of the upper surface layer of the polymer dielectric film; immersing the treated film into a metal salt solution, taking out the immersed film, performing washing by using water, and removing moisture of the surface; and performing heat treatment to form an insulating metal oxide layer on the surface of the polymer dielectric film. According to the above technical solution, the dense and uniform insulating metal oxide layer is formed at the surface of the polymer dielectric film by using the chemical method, the insulating metal oxide layer can realize effective regulation and control from a nanometer level to a micron level, and the insulating metal oxide layer is tightly combined with the polymer dielectric film, and can effectively inhibitthe surface charge injection and internal charge transfer and diffusion of the polymer dielectric film under the high-temperature high-electric-field condition, and reduce the conductivity loss of thepolymer dielectric film; and the insulating metal oxide layer can realize the excellent isolation self-healing function, improve the energy storage characteristic of the film and guarantee the continuous and stable operation under the high-temperature high-electric-field condition.

Description

technical field [0001] The invention relates to the technical field of dielectric materials, in particular to a dielectric composite film and its preparation method and application. Background technique [0002] In the 21st century, the development and utilization of new energy and actively seeking new energy-saving technologies are effective means to deal with the energy crisis and environmental pressure. Clean and renewable energy is the first choice to replace traditional fossil fuels, such as solar energy, wind energy and geothermal energy. However, these renewable resources are intermittent and uncontrollable, and need to be collected and stored. Compared with various electrical storage devices such as supercapacitors and batteries, dielectric electrostatic capacitors have the characteristics of ultra-high energy density (MW level), fast energy transfer rate, long cycle life, and no pollution, making them suitable for a wide range of applications, such as Hybrid electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/06C08L79/08C08L67/02C08L71/00C08J5/18H01G4/33H01G4/18
CPCC08J5/18C08J7/06C08J2367/02C08J2371/00C08J2379/08H01G4/18H01G4/33
Inventor 汪宏董久锋牛玉娟
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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