ZnGa2O4 ultraviolet detector and preparation method thereof
An ultraviolet detector and oxygen technology, applied in the field of ultraviolet detectors, can solve the problems of large dark current of ultraviolet detectors, low quality of thin-film crystals, poor device performance, etc., and achieve steep absorption cut-off edge, reduce oxygen defects, and low dark The effect of current
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[0048] The present invention also provides a method for preparing the above-mentioned ultraviolet detector, comprising the following steps:
[0049] A) Using organozinc compound as zinc source, organogallium compound as gallium source, and high-purity oxygen as oxygen source, ZnGa is deposited on the substrate surface by metal organic compound chemical vapor deposition 2 o 4 film;
[0050] B) in ZnGa 2 o 4 Negative photolithography is used to form an interdigitated electrode mask on the film material, and the colloidal mask is removed after sputtering metal gold to obtain a metal interdigitated electrode;
[0051] C) Press In grains on the interdigitated electrodes to obtain ZnGa with MSM structure 2 o 4 UV detector.
[0052] The present invention first utilizes metal organic compound chemical vapor deposition method to deposit ZnGa on the substrate surface 2 o 4 film. The specific method is as described above, and will not be repeated here.
[0053] get ZnGa 2 o 4...
Embodiment 1
[0060] Put the cleaned sapphire substrate into the MOCVD growth chamber, adjust the growth temperature to 850°C, and the pressure to 1×10 3 Pa. Diethylzinc was used as the zinc source, trimethylgallium was used as the gallium source, the carrier gas flow rate of the zinc source was 5 sccm, and the carrier gas flow rate of the gallium source was 10 sccm. The flow rate of oxygen is 300 sccm, which is much larger than that of zinc and gallium sources. Grow for 2 hours, turn off the organic source and oxygen, lower the substrate temperature to room temperature at 0.6°C / s, and obtain ZnGa with a thickness of about 300nm 2 o 4 film.
[0061] In ZnGa 2 o 4 On the film material, 50 pairs of interdigitated electrode masks with a pitch of 10 μm and a length of 500 μm were formed using negative resist lithography. The obtained sample was put into a small-sized coating machine, and metal gold was sputtered at a pressure of 8 Pa and a current of 6 mA. The colloidal mask is then remo...
Embodiment 2
[0068] Put the cleaned sapphire substrate into the MOCVD growth chamber, adjust the growth temperature to 900°C, and the pressure to 1×10 3 Pa. Diethylzinc was used as the zinc source, trimethylgallium was used as the gallium source, the carrier gas flow rate of the zinc source was 5 sccm, and the carrier gas flow rate of the gallium source was 10 sccm. The flow rate of oxygen is 300 sccm, which is much larger than that of zinc and gallium sources. Grow for 2 hours, turn off the organic source and oxygen, lower the substrate temperature to room temperature at 0.6°C / s, and obtain ZnGa with a thickness of about 300nm 2 o 4 film.
[0069] In ZnGa 2 o 4 On the film material, 50 pairs of interdigitated electrode masks with a pitch of 10 μm and a length of 500 μm were formed using negative resist lithography. The obtained sample was put into a small-sized coating machine, and metal gold was sputtered at a pressure of 8 Pa and a current of 6 mA. The colloidal mask is then remo...
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