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Ultraviolet light-emitting element and all-inorganic packaging method

An encapsulation method and inorganic technology, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems affecting the use effect of UV-LED, the yellowing failure of organic substances, and the decrease of the light transmittance of the lens, and achieve low cost and air tightness. Good, size reduction effect

Active Publication Date: 2020-12-04
HGC (WUHAN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the use of organic glue for semi-inorganic packaging still cannot completely avoid the problem of yellowing and failure of organic matter
Materials such as solder paste or nano-silver glue used in all-inorganic packaging are inorganic after curing, but materials such as solder paste or nano-silver glue are made of flux plus tin beads or silver particles. During the packaging and curing stage, tin cannot be avoided. The flux in the paste or nano-silver glue volatilizes into the UV-LED cavity. When used for a long time, the organic matter in the cavity will yellow and decay, and adhere to the lens in the cavity, causing a serious decrease in the light transmittance of the lens and affecting the UV-LED. The effect of using

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An all-inorganic encapsulation method, specifically as follows:

[0034] S01 substrate grinding and polishing

[0035] A 4-inch sapphire is selected as the substrate 1, and the substrate 1 is ground and polished to reduce its roughness. Firstly, the substrate 1 is ground and thinned to 0.3-0.8mm by using a plane precision polishing machine, asphalt polishing mold and cerium oxide polishing powder with an average particle size of 60nm; then, using a plane precision polisher, a polyurethane polishing film and an average particle A 30nm alkaline polishing solution (composed of 20% silica hydrosol, alkaline agent and surfactant) was used to roughly polish the substrate 1 for 2 minutes, and then a flat precision polishing machine, a fiber polishing film and an average grain size were used. The alkaline polishing solution with a diameter of 30nm (composed of 20% silica hydrosol, alkaline agent and surfactant) was used to polish the substrate 1 for 2 minutes, and finally the ...

Embodiment 2

[0052] An all-inorganic encapsulation method, specifically as follows:

[0053] S01 Form copper clad ceramic substrate

[0054] A copper-clad alumina ceramic substrate 6 is selected, and the surface is sequentially plated with a nickel layer and a gold layer as the metal coating layer 7 of the substrate 6 . The ceramic substrate 6 is sintered with alumina powder. After a series of steps such as laser opening, sputtering copper plating, covering photoresist, exposure and development, electroplating or electroless plating to thicken the copper layer, and etching to remove the film, the pads of the substrate 6 are completed. 602 and the copper dam 601 are fabricated to form the copper-clad ceramic substrate 6. A metal coating is formed on the upper surface of the dam 601 of the substrate 6 by means of electroplating, first with 5 μm of nickel, and then with 0.3 μm of gold.

[0055] S02 Die Bonding

[0056] The UV-LED chip 9 is selected, the electrode of the UV-LED chip 9 is Au...

Embodiment 3

[0071] An all-inorganic encapsulation method, specifically as follows:

[0072] S01 substrate grinding and polishing

[0073] A 4-inch sapphire is selected as the substrate, and the substrate is ground and polished to reduce its roughness. Firstly, the substrate is ground and thinned to 0.3-0.8mm by using a plane precision polishing machine, asphalt polishing mold and cerium oxide polishing powder with an average particle size of 60nm. Then, a plane precision polisher, polyurethane polishing film and average particle size of 30nm alkaline polishing solution (composed of 20% silica hydrosol, alkaline agent and surfactant) was used to roughly polish the substrate for 2 minutes, and then a flat precision polishing machine, fiber polishing film and average particle size of 30nm alkaline polishing solution (composed of 20% silica hydrosol, alkaline agent and surfactant) is used to polish the substrate for 2 minutes, and finally the surface roughness of the substrate is less than 1...

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Abstract

The invention provides an ultraviolet light-emitting element and an all-inorganic packaging method, and the method comprises the steps: manufacturing a lens with a metal coating and a substrate, fixing a UV-LED chip on the substrate, and achieving the fixed connection of the lens and the substrate through a resistance welding technology. The lens structure is ingeniously designed, accurate positioning and tight combination of the lens and the substrate are achieved through the electric resistance welding process, the manufacturing process is simple, cost is low, pollution is small, and mass production can be achieved. The invention further provides an ultraviolet light-emitting element which is large in light-emitting area, large in light-emitting angle and high in reliability, due to thefact that no organic matter is used, the use performance of the UV-LED can be greatly improved, the service life of the UV-LED can be greatly prolonged, and real all-inorganic packaging is achieved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an ultraviolet light-emitting element and an all-inorganic packaging method. Background technique [0002] On August 16, 2017, the "Minamata Convention" came into effect. The Convention requires the parties to ban the production, import and export of mercury-containing products (fluorescent lamps for general lighting purposes containing more than 5 mg of mercury) from January 1, 2020. The signing and adoption of the Minamata Convention has accelerated the UV-LED market to take off around the world, including Japan, China, the European Union and other markets. Both household and industrial traditional lamps need to be replaced by UV-LED. [0003] The traditional UV-LED is packaged with organic glue, and the ultraviolet radiation emitted by the UV-LED chip will cause the colloid to yellow and reduce the service life of the UV-LED packaged device. [0004] In recent years, technologie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/58
CPCH01L33/486H01L33/54H01L33/58H01L2933/005H01L2933/0058
Inventor 孙雷蒙杨丹李坤刘芳
Owner HGC (WUHAN) TECH CO LTD