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PCB microetching solution and preparation method thereof

A micro-etching liquid and solution technology, which is applied in the field of circuit board processing, can solve the problems of low dissolved copper, easy oxidation of the board surface, and decreased copper etching rate.

Active Publication Date: 2022-04-29
XINFENG ZHENGTIANWEI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufacturing process of printed circuit boards, many processes need to use micro-etching to increase the bonding force, but the currently used sulfuric acid hydrogen peroxide system micro-etching solution has micro-etching instability, easy oxidation of the board surface after micro-etching, and the amount of dissolved copper. Low, not resistant to chloride ion problems
The copper ion tolerance of the existing copper etching solution is not high. Generally, the commercial product needs to replace the bath solution when it reaches 35g / L. Frequent bath changes bring a relatively large challenge to the production cost. trouble
When the copper ion content in the solution is increased by adding a special copper ion complexing agent, the copper etching rate will drop rapidly, and the copper etching rate decrease will be meaningless in industrial production

Method used

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  • PCB microetching solution and preparation method thereof
  • PCB microetching solution and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A kind of PCB microetching liquid, comprises the component of following content: the hydrogen peroxide of 60wt% of 30ml / L, the sulfuric acid of 98wt% of 100ml / L, the 1-methylimidazole of 5ml / L, the 5- Tolyl benzotriazole, 0.35g / L aminotrimethylene phosphonic acid, 2g / L sodium citrate, 3g / L carboxylated enzymatic lignin, 3g / L ammonized alkali lignin, 4g / L L of aminated lignin, 1.5g / L potassium pyrophosphate, 1g / L tripropylene phosphite, 30ml / L polytetrafluoroethylene dispersion, the solvent is deionized water.

[0037] The preparation method is as follows:

[0038] 1) Weigh 20 parts of polytetrafluoroethylene powder, 15 parts of butyl acetate, 10 parts of propylene glycol methyl ether acetate, 3 parts of n-hexane, and 0.5 parts of dispersant for later use;

[0039] 2) butyl acetate, propylene glycol methyl ether acetate, and n-hexane are mixed uniformly to obtain a mixed solvent;

[0040] 3) Add dispersant and polytetrafluoroethylene powder to the mixed solvent in sequ...

Embodiment 2

[0047] A PCB microetching solution, comprising the following components: 80ml / L of 30wt% hydrogen peroxide, 50ml / L of 98wt% sulfuric acid, 1ml / L of 2-phenylimidazole, 4.5g / L of amino Trimethylene phosphonic acid, 3g / L sodium lactate, 3g / L sodium acetate, 4g / L calcium citrate, 2.5g / L carboxylated alkali lignin, 0.3g / L sodium pyrophosphate, 8ml / L poly Tetrafluoroethylene dispersion, the solvent is deionized water.

[0048] The preparation method is as follows:

[0049] 1) Weigh 22 parts of polytetrafluoroethylene powder, 10 parts of butyl acetate, 5 parts of propylene glycol methyl ether acetate, 10 parts of n-hexane, and 0.25 parts of dispersant for later use;

[0050] 2) butyl acetate, propylene glycol methyl ether acetate, and n-hexane are mixed uniformly to obtain a mixed solvent;

[0051] 3) Add dispersant and polytetrafluoroethylene powder to the mixed solvent in sequence while stirring;

[0052] 4) Ultrasound for 0.5h after stirring to obtain a polytetrafluoroethylene ...

Embodiment 3

[0058] A kind of PCB microetching liquid, comprises the component of following content: the hydrogen peroxide of 50wt% of 40ml / L, the sulfuric acid of 98wt% of 80ml / L, the 5-methylbenzotriazole of 1ml / L, 0.5ml / L of benzothiazole, 0.5ml / L of 2-mercaptobenzoxazole, 3g / L of aminotrimethylene phosphonic acid, 2g / L of sodium gluconate, 2g / L of potassium citrate, 2g / L of Calcium gluconate, 1.5g / L aminated alkali lignin, 2.5g / L sulfonated enzymatic lignin, 0.3g / L potassium pyrophosphate, 0.2g / L sodium pyrophosphate, 12ml / L polytetrafluoroethylene Vinyl fluoride dispersion, the solvent is deionized water.

[0059] The preparation method is as follows:

[0060] 1) Weigh 20 parts of polytetrafluoroethylene powder, 25 parts of butyl acetate, 8 parts of propylene glycol methyl ether acetate, 8 parts of n-hexane, and 0.8 parts of dispersant for later use;

[0061] 2) butyl acetate, propylene glycol methyl ether acetate, and n-hexane are mixed uniformly to obtain a mixed solvent;

[006...

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PUM

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Abstract

The invention provides a novel PCB microetching solution, comprising: 30-80ml / L of hydrogen peroxide solution, 50-120ml / L of sulfuric acid, 0.5-10ml / L of cyclic amine derivatives, 0.2-5g / L of Amino trimethylene phosphonic acid, 2‑10g / L organic acid salt, 2‑10g / L water-soluble lignin, 0.2‑3g / L phosphorous additive, 5‑30ml / L polytetrafluoroethylene dispersion, solvent for water. The PCB micro-etching solution of the present invention can maintain the micro-etching rate under high-concentration copper content, and the amount of dissolved copper can reach more than 110g / L. The present invention also provides a preparation method of a novel PCB microetching solution, comprising the following steps: preparation of a polytetrafluoroethylene dispersion, preparation of dilute sulfuric acid, adding cyclic amine derivatives, aminotrimethylene phosphonic acid, organic acid salts and Phosphorus-containing additives are mixed evenly, adding polytetrafluoroethylene dispersion liquid, water-soluble lignin and mixing evenly, adding hydrogen peroxide and mixing evenly. In the microetching solution obtained by the method of the invention, each chemical component in the solution is stable, and at the same time, the copper etching amount and etching efficiency are guaranteed.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a PCB microetching solution and a preparation method thereof. Background technique [0002] Printed circuit board PCB (Printed Circuit Board) is the provider of electrical connection of electronic components. Its development has a history of more than 100 years, and its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. In the manufacturing process of printed circuit boards, many processes need to use micro-etching to increase the bonding force, but the currently used sulfuric acid hydrogen peroxide system micro-etching solution has micro-etching instability, easy oxidation of the board surface after micro-etching, and the amount of dissolved copper. Low, not resistant to chloride ion problems. The copper ion tolerance of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 许永章张本汉喻荣祥
Owner XINFENG ZHENGTIANWEI ELECTRONICS TECH