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Photocuring adhesive composition for shading and edge sealing of display module and preparation method thereof

A display module and adhesive technology, applied in the direction of adhesive types, polyurea/polyurethane adhesives, modified epoxy resin adhesives, etc., can solve the problem of increasing process complexity, reducing production efficiency, affecting work efficiency issues

Inactive Publication Date: 2020-07-07
塔威新材料科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

PUR technology often needs to be heated to above 90C for use. After dispensing, there is still a certain time for holding pressure and initial strength formation, which greatly affects work efficiency, especially for the assembly of large-size TV module equipment.
Dual curing such as UV / heat or UV / moisture curing system, whether it is heat or moisture, greatly reduces production efficiency and increases process complexity. For this reason, we have designed a light-shielding edge banding for display modules Curing adhesive composition and preparation method to solve the above problems

Method used

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  • Photocuring adhesive composition for shading and edge sealing of display module and preparation method thereof
  • Photocuring adhesive composition for shading and edge sealing of display module and preparation method thereof
  • Photocuring adhesive composition for shading and edge sealing of display module and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Prepare adhesive composition according to following formula:

[0061]

[0062] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0063] Wherein, a preparation method of a photocurable adhesive composition for light-shielding edge banding of a display module comprises the following steps:

[0064] S1. Take out three parts of component B and component C respectively, mix them evenly with a disperser, and add carbon black to them;

[0065] S2. After mixing and dispersing evenly, it is ground by a three-roll machine until the particle size is less than 20 μm, and then it is discharged as a premix;

[0066] S3, add the premix in the above S2 and the remaining components (total 100g) into a plastic bucket with a capacity of 150g in turn, put it into a mixer with a model of SpeedMixer DAC 150.1FVZr, at 2500 rpm, high speed Disperse and mix for 10 minutes;

[0067] S4, the obtained mixture is filtered with a 10 micron filter screen...

Embodiment 2

[0095] Prepare adhesive composition according to following formula:

[0096]

[0097]All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0098] The viscosity of the obtained adhesive composition is 20000mPa.s / 25°C,

[0099] Shore A hardness after curing is ShD 47

[0100] Optical density: 1.6

[0101] Glue bonding strength (150 microns): 1.5MPa.

[0102] Bond strength after high temperature and high humidity aging (150 microns), 65C, 90% relative humidity for 120 hours: 1.40MPa, the glue has no bubbles and no cracking;

[0103] Glue curing depth: 250 microns;

[0104] Glue surface dryness test: the dryness of the surface after cooling is excellent.

Embodiment 3

[0106] Prepare adhesive composition according to following formula:

[0107]

[0108]

[0109] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0110] The viscosity of the obtained adhesive composition is 1300mPa.s / 25°C,

[0111] Shore A hardness after curing is ShD 50

[0112] Optical Density: 2.0

[0113] Glue bonding strength (150 microns): 3.3MPa.

[0114] Bond strength after high temperature and high humidity aging (150 microns), 65C, 90% relative humidity for 120 hours: 2.40MPa, the glue has no bubbles and no cracking.

[0115] Glue curing depth: 200 microns

[0116] Glue surface dryness test: the dryness of the surface after cooling is excellent.

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Abstract

The invention discloses a photocuring adhesive composition for shading and edge sealing of a display module and a preparation method of the photocuring adhesive composition. Based on 100 parts by weight of the adhesive composition, the photocuring adhesive composition comprises the following components in parts by weight: a component A: 25-70 parts of aliphatic urethane acrylate prepolymer; a component B: 5-20 parts of an epoxy acrylate prepolymer; a component C: 10-40 parts of one or more aliphatic acrylate monomers; a component D: 12-45 parts of a monofunctional acrylate monomer containing anitrogen atom structure; a component E: 0.2-5 parts of a tackifying auxiliary agent containing a sulfur or phosphorus atom structure; a component F: 1.0-8 parts of two or more cracking type photoinitiators; and a component G: 0.05-3 parts of carbon black or a carbon black premix taking a UV monomer as a carrier. According to the invention, the problems of optical density and deep curing can be considered; the adhesive composition has excellent adhesive strength for glass and stainless steel, is very suitable for assembling large-size television module materials, improves the problem that thesurface of cured glue is sticky, is more environment-friendly and healthy, and is convenient for construction and convenient for customers to use.

Description

technical field [0001] The invention relates to the technical field of compositions, in particular to a photocurable adhesive composition for light-shielding edge sealing of a display module and a preparation method. Background technique [0002] The rapid development of modern technology has promoted the progress of touch technology, especially the update iteration of consumer display electronic equipment. Display modules are generally classified into LCD liquid crystal modules or OLED modules. With the advancement and development of technology, display devices are becoming thinner and larger in size. In the production and assembly process of display modules, high-performance glue is required for bonding in many places, which puts forward new requirements for adhesive auxiliary materials. In order to pursue a thinner and more beautiful appearance design, the original mechanical fixing or plate fixing mode is directly replaced by adhesive. [0003] Taking the large-size T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J163/10C09J11/04H01L51/52
CPCC09J175/14C09J11/04C08L2203/206C08L2201/08H10K50/8426C08L63/10C08K3/04
Inventor 牟世伟柳成良范建军
Owner 塔威新材料科技(上海)有限公司
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