Underfill adhesive with high thermal conductivity and preparation method thereof

A technology of bottom filling glue and high thermal conductivity, which is applied in the direction of heat exchange materials, chemical instruments and methods, adhesives, etc., can solve the problem of limited improvement of thermal conductivity, so as to promote thermal conductivity, facilitate electronic conduction, and smooth conduction Effect

Active Publication Date: 2020-11-03
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this general method has limited improvement in thermal conductivity

Method used

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  • Underfill adhesive with high thermal conductivity and preparation method thereof
  • Underfill adhesive with high thermal conductivity and preparation method thereof
  • Underfill adhesive with high thermal conductivity and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] The preparation technology of this diamine type benzoxazine resin is as follows:

[0031] In the first step, diamine monomer, phenolic compound and paraformaldehyde are added into the reaction vessel, and the molar ratio of diamine monomer, phenolic compound and paraformaldehyde is (1~1.2):(2~2.4): (4~4.4); Simultaneously, add xylene as reaction solvent;

[0032] In the second step, keep stirring at a temperature of 80-150° C. for 4-15 hours to carry out Mannich reaction (Mannich reaction), and cool to room temperature after the reaction;

[0033] In the third step, add ethanol, wash, filter, and vacuum-dry the precipitate in sequence to obtain a crude product; dissolve the crude product in dichloromethane, add 1mol / L sodium hydroxide solution for alkali washing, and then wash with deionized water , separation, adding anhydrous sodium sulfate to the organic layer, standing for 24 hours, and filtering, the filtrate was removed by rotary evaporation to remove the organic...

Embodiment 1

[0037] Prepare the underfill according to the following ratio:

[0038]

[0039] The preparation method is as follows: after mixing the above raw materials uniformly by weight, grind them three times on three rollers, roll them into a paste, and then carry out vacuum defoaming to obtain the filling glue of the embodiment.

Embodiment 2

[0041] Prepare the underfill according to the following ratio:

[0042]

[0043]

[0044] Refer to Example 1 for the preparation method of the underfill in this embodiment.

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Abstract

The invention discloses an underfill adhesive with high thermal conductivity and a preparation method thereof. The underfill adhesive comprises 10-60 parts by mass of epoxy resin, 5-30 parts by mass of a curing agent, 10-30 parts by mass of diamine benzoxazine resin, 0.1-5 parts by mass of a curing accelerator, 40-90 parts by mass of an inorganic filler, 0.1-5 parts by mass of a coupling agent and0-5 parts by mass of a coloring agent. The inorganic filler comprises large-particle-size aluminum oxide with the particle size ranging from 10 to 30 micrometers and small-particle-size aluminum oxide with the particle size ranging from 0.1 to 5 micrometers, and the mass part ratio of the large-particle-size aluminum oxide to the small-particle-size aluminum oxide is 6:4-9:1. According to the invention, the alumina filler and the diamine benzoxazine resin with different sizes are added at the same time and promote each other, so that the thermal conductivity and glass transition temperature of a resin system can be significantly improved.

Description

technical field [0001] The invention belongs to an adhesive, and in particular relates to a bottom filling adhesive with high thermal conductivity and a preparation method thereof. Background technique [0002] The use of electronic products will cause the temperature of the chip to rise. Excessively high temperatures will affect the signal stability, reliability and service life of electronic components. For example, excessive temperatures can endanger semiconductor junctions, damage circuit connections, increase conductor resistance, and cause mechanical and thermal stress damage. Therefore, it should be ensured that the heat generated by electronic components can be discharged in time, so there is a demand for underfill with high thermal conductivity. [0003] Currently commonly used underfills include ordinary bisphenol A epoxy resin combined with anhydride and silica fillers, which are cured by amine curing agents and generally have low thermal conductivity. In order ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/34C09J11/04C09J11/08C09K5/14
CPCC09J163/00C09J161/34C09J11/04C09J11/08C09K5/14C08K2003/2227C08K2201/005C08K2201/014C08L61/34C08K3/22C08K5/54C08K3/04C08L63/00
Inventor 伍得廖述杭王义苏峻兴
Owner WUHAN CHOICE TECH CO LTD
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