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A Connection Method Based on Micro-arc Discharge

A connection method and a technology of micro-arc discharge, which is applied in the direction of circuits, welding equipment, welding equipment, etc., can solve the problems of film conduction circuit disconnection, low joint strength, and difficult connection, and achieve shortening time, firm welding, and increased friction. Effect

Active Publication Date: 2022-05-20
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wire bonding can be used to weld Pt, Pd and other hard wires. However, for some alloy wires with high hardness, strength and high melting point, it is difficult to soften during the welding process and it is not easy to form a connection.
For micro-laser welding, it can be used to weld PtIr alloys or Pt wires. However, due to the high heat of the laser during micro-laser welding, ceramic substrates with different thermal expansion coefficients and shrinkage rates and metal films with micron-scale thickness will wrinkle or is shattered, causing an open circuit in the conductive circuit of the film
Micro-resistance welding can be used to weld Pt wire and its alloy materials, however, the joint strength of micro-resistance welding is low and the consistency is poor

Method used

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  • A Connection Method Based on Micro-arc Discharge
  • A Connection Method Based on Micro-arc Discharge
  • A Connection Method Based on Micro-arc Discharge

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Such as Figure 6 As shown, the lead wire 9 is a platinum-tungsten alloy wire with a diameter of 40 μm and a length of 1 cm. Its tail end is a tip 91 , and the angle B between the tip 91 is 60°. The pad 8 is rectangular, the material of the substrate 81 of the pad 8 is aluminum oxide ceramics, the material of the coating 82 of the pad 8 is gold, the size of the pad 8 is 1mm×0.25mm, and the pad 8 is a gold pad. The platinum-tungsten alloy wire is perpendicular to the gold pad, and the initial gap between the platinum-tungsten alloy wire and the gold pad is 100 μm. During the welding process, the Z-axis moving mechanism 6 maintains a moving speed of 1 μm / ns. The welding power source is a DC power source, the voltage of the DC power source is 100V, and the current is 0.05A. The arc discharge time is 500ns.

[0060] Pass the platinum-tungsten alloy wire through the ceramic nozzle 7 and install the ceramic nozzle 7 on the force application device 5, the force application ...

Embodiment 2

[0064] Such as Figure 8 As shown, the difference between the second embodiment and the first embodiment is that the tail end of the lead wire 9 is a flat end 92, and the length d of the flat end 92 is 80 μm; A 3A fuse is installed in the circuit of the power supply to prevent damage to the AC power supply.

[0065] Pass the platinum-tungsten alloy wire through the ceramic nozzle 7 and install the ceramic nozzle 7 on the force application device 5, the force application device 5 is clamped on the Z-axis moving mechanism 6, and grind the tail end of the platinum-tungsten alloy wire into a flat end 92, then fix the gold pad on the workbench 2, install the workbench 2 on the XY-axis motion platform 1, move the XY-axis motion platform 1 so that the platinum-tungsten alloy wire is perpendicular to the gold pad and make the platinum-tungsten alloy wire The initial gap between the flat end 92 and the gold pad is 100 μm. Two copper wires are used. The two ends of one copper wire are ...

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Abstract

The invention discloses a connection method based on micro-arc discharge, which comprises the following steps: installing and forming a lead wire, installing a pad so that there is a certain initial gap between the lead wire and the pad, starting a welding power supply; gradually reducing the lead wire and the welding pad. The gap between the pads creates an arc discharge; when the lead wire is connected to the pad, immediately turn off the welding power supply. The invention provides a method for realizing the direct connection between the lead wire and the electrode with high melting point, high hardness and rigidity. Since there are more molten metals, the contact area between the metal and the lead wire is larger, thereby increasing the friction force between the lead wire and the metal, and increasing welding The strength and performance of the welded joint have been significantly improved, and the weld is stronger. At the same time, there is no need to coat gold paste for refiring, which makes the process simple and shortens the time required for connection. The connection can be realized at room temperature without heating. , less damage to components, and strong process controllability.

Description

technical field [0001] The invention relates to the technical field of micro-nano connection, in particular to a connection method based on micro-arc discharge. Background technique [0002] Electrode leads are an essential part of signal transmission for semiconductor electronic components. The electrode lead wire of the gas sensor requires the electrode material to have good electrical conductivity. At the same time, since the sensitive body of the gas sensor needs to be sintered at high temperature during the preparation process, the electrode lead material is required to have good high temperature oxidation resistance. Furthermore, the operating environment of the gas sensor usually has a corrosive atmosphere, and the electrode material is required to have good chemical corrosion resistance. In addition, the electrode lead wire needs to support the sensitive body, and can withstand the shock test of vibration and 50g acceleration of gravity, so the electrode lead wire a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K31/02B23K37/00B23K37/04H01L21/603
CPCB23K31/02B23K37/00B23K37/0435H01L24/85H01L2224/85236H01L2224/85801
Inventor 潘明强涂明会刘吉柱王阳俊陈立国孙立宁
Owner SUZHOU UNIV