Protective film frame, preparation method thereof and protective film assembly

A protective film and frame technology, which is applied in the photomechanical process of photomechanical processing of originals, patterned surface, ion implantation and plating, etc. It is suitable for large-scale production, the preparation method is simple, and the scattering rate is low.

Pending Publication Date: 2021-03-05
SIEN QINGDAO INTEGRATED CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The mask plate that produces white mist must remove the protective film, clean the photomask plate and replace it with a new protective film, and then inspect the photomask plate for defects, which may lead to the scrapping of the photomask plate;
[0005] The exposed substrate will cause repetitive defects due to the Haze of the photomask, which will seriously affect the yield of the substrate

Method used

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  • Protective film frame, preparation method thereof and protective film assembly
  • Protective film frame, preparation method thereof and protective film assembly
  • Protective film frame, preparation method thereof and protective film assembly

Examples

Experimental program
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Effect test

Embodiment 1

[0053] This embodiment provides a protective film frame, which includes a frame structure and a cladding layer covering the surface of the frame structure. Refer to attached figure 1 , the frame structure 110 of the protective film frame is used to support the protective film 120, and the cladding layer coated on the surface of the frame structure is formed of chromium or titanium dioxide.

[0054] The photomask plays a very important role in the photolithography process. It contains the chip pattern features of the entire substrate (silicon wafer), and performs 1:1 pattern replication during photolithography. figure 1 A photomask 100 and a masking layer 101 thereon are shown. In this embodiment, the photomask 100 is usually fused silica, and the masking layer 101 thereon is usually a chromium layer. The masking layer 101 forms the pattern formed on a substrate. Since the photomask 100 is the benchmark and blueprint for photolithographically reproduced patterns, any defect o...

Embodiment 2

[0065] This embodiment provides a method for preparing a protective film frame, such as figure 2 As shown, the method includes the following steps:

[0066] Anodizing process is used to color the frame structure;

[0067] cleaning and drying the colored frame structure;

[0068] A cladding layer covering the framework structure is formed on the surface of the framework structure after cleaning and drying, wherein the cladding layer is formed of chromium or titanium dioxide.

[0069] In this embodiment, the frame structure is made by general processing technology, for example, according to the size required by the photolithography machine, more precisely, the aluminum alloy plate is cut according to the size of the photomask, and the frame structure is cut out. , and then perform mechanical polishing, alkali cleaning, pickling, and chemical polishing on the aluminum alloy frame structure. The chemically polished frame structure is anodized to refine it and color the frame s...

Embodiment 3

[0077] This embodiment provides a protective film assembly, also refer to the attached figure 1 , the protective film assembly includes a protective film frame and a protective film 120 . The protective film frame includes the protective film frame described in Embodiment 1, and the protective film frame also includes a frame structure 110 and a cladding layer coated on the surface of the frame structure, and the cladding layer is formed of chromium or titanium dioxide. The protective film 120 is adhered and supported on the frame structure 110 . For example, the protective film 120 can be adhered to the frame structure 110 by an adhesive and stretched tightly on the frame structure 110 .

[0078] Since the protective film assembly also includes the protective film frame described in Embodiment 1, during the exposure process, the acid radical / ammonium ion (SO 4 2- 、PO 4 3- and NH 4+ ) will not be released from the frame structure, thereby avoiding white haze (Haze) gener...

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Abstract

The invention provides a protective film frame, a preparation method thereof and a protective film assembly. The protective film frame comprises a frame structure and a coating layer coating the surface of the frame structure, and the coating layer comprises a chromium layer or a titanium dioxide layer. The coating layer coats the surface of the frame structure, so that acid radical/ammonia radical ions (SO4<2->, PO4<3-> and NH<4+>) in the frame structure are coated and isolated from the outside, the release of the acid radical/ammonia radical ions (SO4<2->, PO4<3-> and NH<4+>) in the exposureor after-exposure storage period of a photoetching machine is avoided, and the irregular generation of white fog (Haze) by a photomask is avoided. According to the protective film frame, the photomask is prevented from generating the white fog, so that the repeatability defect of the photomask with the white fog on a formed substrate can be effectively avoided, and the yield of the substrate canbe further improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit preparation, in particular to a protective film frame, a preparation method thereof, and a protective film assembly. Background technique [0002] In the manufacture of IC (Integrated Circuit), semiconductor integrated circuits such as LSI (Large Scale Integration), or liquid crystal display devices such as LCD (Liquid Crystal Display), patterning is usually performed by exposure process photolithography. A protective film frame and a protective film frame supporting the protective film are pasted on the photomask used for photolithography. In the prior art, the protective film frame is cut and processed by using an aluminum plate according to the size required by the photolithography machine, and then the surface of the frame is refined and dyed by chemical anodic treatment. Acid / ammonium ions (SO 4 2- 、PO 4 3- and NH 4+ ). These residual acid / ammonium ions will cause a series o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/64C23C14/16C23C14/08C23C14/24C23C14/34
CPCC23C14/083C23C14/16C23C14/165C23C14/24C23C14/34G03F1/64
Inventor 高丁山
Owner SIEN QINGDAO INTEGRATED CIRCUITS CO LTD
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