Water-based high-temperature-resistant epoxy resin and preparation method thereof

An epoxy resin and high-temperature-resistant technology, applied in the direction of organic chemistry, can solve the problems of the final cured product’s comprehensive performance, affect the uniformity of curing, and cumbersome preparation steps, so as to improve the operability of construction and facilitate industrial production and preparation. The effect of simple process

Active Publication Date: 2021-03-09
深圳飞扬兴业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the BMI double bond has high activity, it is difficult to directly react with the epoxy group. Therefore, when using BMI to modify the epoxy resin, aromatic diamines (DAm) and diallyl bisphenol are generally required. A (DABPA) or cyanate (CE) is used as an intermediate structure for connection, and the preparati

Method used

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  • Water-based high-temperature-resistant epoxy resin and preparation method thereof
  • Water-based high-temperature-resistant epoxy resin and preparation method thereof
  • Water-based high-temperature-resistant epoxy resin and preparation method thereof

Examples

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Example Embodiment

[0063]Preferably, the preparation method of the bispany of the present invention comprises the steps of:

[0064]The double maleimide, solvent, and oxidation catalyst were mixed, and the oxidant solution was dropped at 10 to 40 ° C, and the dropwater was 1 to 3 h, and the reaction was reacted for 10 to 30 hours, washed, dried to give the bispanyone oxygen. .

[0065]The present invention does not specifically limit the solvent, which may be mentioned, water, ethyl acetate, butyl acetate, toluene, xylene, dichloromethane, acetone, N, N-dimethylformamide, N-methylpyrrolidone. .

[0066]The present invention does not specifically limit the oxidation catalyst, and may be mentioned, phosphate tungsten polyacids H.3PW12O40, Phosphate tungsten polyacid H6P2W18O64, Methyl trioxide, O2In one embodiment, the oxidation catalyst of the present invention accounts for 0.05 to 3% by weight of the double maleimide weight.

[0067]The present invention does not specifically limit the oxidant, and may be mention...

Example Embodiment

[0086]Example 1

[0087]In this case, an epoxy resin is provided, and the structural formula of the high temperature epoxy resin isR isR 'is ethyl, N is 0.08.

[0088]This example also provides a method of preparing an epoxy resin as described above, including:

[0089]S1. Add 179 g of a double maleimide structure in a 500 ml four-port flask equipped with a thermometer and a stirrer and reflow condenser.72 g of toluene and 1.8 g of catalyst H3PW12O40 were well stirred and dissolved, and 17.2 g of toluene, 0.9 g of oxidant, chlorine peroxybenzoic acid solution, 2H drop, 2 h, and the oxidation reaction time was added, and aqueous solution of sodium hydrogencarbonate was added. Wash with saturated brine, distillation of the solvent under reduced pressure to obtain a bicyclic epoxy compound

[0090]S2. Add a bicyclic oxide compound in a four-mouth flask equipped with a thermometer and a stirrer, 5.3 g of dihydroxymethyl propionic acid (n = 0.08) 80 ° C is dissolved in 8.5 GN-methylpyrrolidone, and...

Example Embodiment

[0091]Example 2

[0092]In this case, an epoxy resin is provided, and the structural formula of the high temperature epoxy resin isR isR 'is ethyl, N is 0.054.

[0093]This example also provides a method of preparing an epoxy resin as described above, including:

[0094]S1. In the 500 ml four-mouth flask equipped with a thermometer and a stirrer and reflow condenser, 134 g of a double maleimide structure is used.54 g of toluene and 2 g of catalyst methyl trilycal toltrium oxide after dissolving, 0.5 g of a 0.5 g of oxidant tert-butyl sineicloxic chloride solution of 13 g of toluene was added dropwise at 25 ° C, and 2H drop was added, and the oxidation reaction time was 25 h, and hydrogen carbonate was sequentially added. Sodium aqueous solution and saturated brine, remove the solvent under reduced pressure, resulting in a product bisphenyle

[0095]S2. Add a bicyclic oxide compound in a four-mouth flask equipped with a thermometer and a stirrer, and 3.6 g of dihydroxymethyl proppropionic acid ...

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Abstract

The invention relates to the technical field of epoxy resin, and in particular, relates to water-based high-temperature-resistant epoxy resin and a preparation method thereof. The high-temperature-resistant epoxy resin is composed of the preparation raw materials: a diepoxy compound and dihydroxy ammonium carboxylate. According to the prepared polyfunctional glycidyl amine epoxy resin, a certain amount of hydrophilic groups are introduced, and then water is added for high-speed shearing to obtain the water-based high-temperature-resistant epoxy resin; the water-based high-temperature-resistantepoxy resin can be cured with an amine curing agent, the thermal deformation temperature is obviously increased, the solubility in water is improved, uniform dispersion is promoted, and a dispersionsystem with proper viscosity is formed; water-based treatment is realized, a uniform cross-linked network can be formed with an amine curing agent, increasingly strict environmental protection standards are met, and the constructability of imide is improved; the epoxy resin containing the epoxy group is directly prepared by utilizing the imide structure, so that the high temperature resistance isremarkably improved, and meanwhile, good tensile and bending strength and high temperature resistance stability are ensured.

Description

technical field [0001] The invention relates to the technical field of epoxy resin, more specifically, the invention relates to a water-based high temperature resistant epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin has become the most important and the most used resin because of its excellent mechanical properties, chemical properties and good insulation. With the continuous development of science and technology, more stringent requirements are put forward for the high temperature resistance and mechanical properties of resin materials. . Ordinary epoxy resins are difficult to meet the technical specifications of materials under harsh conditions to a certain extent, so it is very necessary to develop water-based high-temperature resistant epoxy resins. [0003] At present, the method for improving the heat resistance of the resin matrix is ​​to introduce rigid structures such as fused rings, biphenyls, and imides into the epoxy main...

Claims

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Application Information

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IPC IPC(8): C07D519/00C08G59/26C08G59/30C08L63/00
CPCC07D519/00C08G59/26C08G59/302C08L63/00C08L2201/08
Inventor 龙绪俭鲁晓东陈林生李斌仁熊东路肖增钧杨轩许超平
Owner 深圳飞扬兴业科技有限公司
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