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A kind of high toughness, heat and humidity resistant ultraviolet light-curing conductive adhesive and preparation method thereof

A technology of ultraviolet light and heat and humidity resistance, applied in the field of conductive adhesives, to achieve good flexibility and aging resistance, long service life and simple operation

Active Publication Date: 2022-05-13
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solvent toluene is used in the preparation process, and heat curing is required

Method used

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  • A kind of high toughness, heat and humidity resistant ultraviolet light-curing conductive adhesive and preparation method thereof
  • A kind of high toughness, heat and humidity resistant ultraviolet light-curing conductive adhesive and preparation method thereof
  • A kind of high toughness, heat and humidity resistant ultraviolet light-curing conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 40 parts of self-made epoxy acrylate containing silicone long chain, 15 parts of KR-513, 20 parts of 1,6-hexanediol diacrylate, 3 parts of 1-hydroxycyclohexyl benzophenone, 1.5 parts Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 0.1 part of hydroquinone, and 1 part of silane coupling agent KH172 were added to the stirring tank, and the 30r / min, under the condition of rotation 800r / min, stir for 30min; add 15 parts of Ag nanowires, 5 parts of Ag nanoparticles, and stir for 30min under the condition of revolution 30r / min under the condition of vacuum and dark; add gas phase silica 1 Parts, under the condition of vacuum and light protection, revolution 20r / min, rotation 300r / min, stir for 30min to obtain high toughness, heat and humidity resistant UV-curable conductive adhesive.

[0034] The described self-made epoxy acrylate containing long-chain organic silicon is prepared according to the following steps:

[0035] Weigh 100g of bisphenol A epoxy acrylate, put it in...

Embodiment 2

[0037] Mix 45 parts of self-made epoxy acrylate containing silicone long chain, 10 parts of X-40-2672B, 20 parts of tetrahydrofuran methacrylate, 4 parts of 1-hydroxycyclohexyl benzophenone, 1.8 parts of 2-methyl Base-1-(4-methylthiophenyl)-2-morpholine-1-propanone, 0.05 parts of p-hydroxyanisole, and 1.5 parts of silane coupling agent KH560 were added to the stirring tank, and the Under the conditions of 40r / min revolution and 600r / min autorotation, stir for 30min; add 17 parts of Ag nanowires and 5 parts of Ag nanoparticles, and stir for 30min under the condition of revolution 30r / min in vacuum and dark; add gas phase white Carbon black, under the conditions of revolution 20r / min and rotation 300r / min under the condition of vacuum and light protection, stir for 30min to obtain high toughness, heat and humidity resistant UV-curable conductive adhesive.

[0038] The described self-made epoxy acrylate containing long-chain organic silicon is prepared according to the following ...

Embodiment 3

[0041] 50 parts of self-made epoxy acrylate containing silicone long chain, 5 parts of X-40-9272B, 25 parts of isooctyl methacrylate, 4 parts of 2-hydroxy-2-methyl-1-phenyl Add acetone, 2 parts of 2,4,6-trimethylbenzoylbenzene-diphenylphosphine oxide, 0.05 parts of 2,6-di-tert-butyl-p-cresol, and 2 parts of silane coupling agent KH570 to the stirring tank In the condition of avoiding light in vacuum, revolution 40r / min, rotation 600r / min, stir for 30min; add 20 parts of Ag nanowires, 5 parts of Ag nanoparticles, in vacuum and avoid light, revolution 30r / min , and stirred for 30 minutes; add 1 part of fumed silica, under the conditions of revolution 20r / min and rotation 300r / min, stir for 30 minutes to obtain high toughness, heat and humidity resistance UV-curable conductive adhesive.

[0042] The described self-made epoxy acrylate containing long-chain organic silicon is prepared according to the following steps:

[0043] Weigh 100g of bisphenol A epoxy acrylate, put it into ...

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Abstract

The invention relates to a high-toughness, heat-and-humidity-resistant ultraviolet light-cured conductive adhesive and a preparation method thereof, relating to the field of conductive adhesives. The adhesive is composed of the following raw materials in parts by weight: 30-50 parts of self-made epoxy acrylate containing long-chain silicone, 10-20 parts of silicone reactive diluent, 15-35 parts of acrylic monomer, 3-8 parts of photoinitiator 0.05-0.2 parts of polymerization inhibitor, 1-3 parts of silane coupling agent, 0-5 parts of thixotropic agent and 12-25 parts of conductive filler. In the present invention, the conductive adhesive based on the present invention has good transparency, good toughness, bending resistance, and excellent moisture and heat resistance by adding self-made epoxy acrylate containing long-chain silicones and conductive fillers with high transparency to the colloid. And high temperature resistance, a wide range of applications.

Description

technical field [0001] The invention relates to the field of conductive adhesives, in particular to a high-toughness, heat-and-humidity-resistant UV-curable conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with both bonding and conductive properties. In recent years, the use of conductive adhesives to replace Pb / Sn solder connection materials has been used more and more in the fields of microelectronic packaging, printed circuit boards, conductive circuit bonding, and electromagnetic shielding. [0003] At present, the conductive adhesives that appear on the market are basically made by filling conductive powder into the adhesive. The conductive adhesive system can be divided into acrylic system, epoxy system and silicone system. Among them, the acrylic system has the advantages of fast curing, high adhesion, and wide Tg adjustment range, but its moisture resistance and aging resistance are poor, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J9/02C08G77/38
CPCC09J183/04C09J9/02C08G77/38C08K2003/0806C08K2201/011C08K2201/001C08K7/06C08K3/08
Inventor 魏芳芳李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD