Floating and sinking type heat conduction coating for LED lamp and preparation method of floating and sinking type heat conduction coating

Abstract

The invention discloses a floating and sinking type heat conduction coating for an LED lamp and a preparation method of the floating and sinking type heat conduction coating, and belongs to the technical field of heat conduction paints.The raw materials of the coating can be improved, floating and sinking heat dissipation rods are innovatively introduced to be pre-buried in the coating and extend to the surface of the coating, and the floating and sinking heat dissipation rods can fully absorb heat and then trigger floating and sinking actions; after the internal movable rod absorbs enough heat, the cooling liquid in the thermal trigger ball is heated and evaporated, so that the internal air pressure is gradually increased until the closed state of the control pipe is broken through, and a large amount of gaseous cooling liquid and air enter the thermal floating ball to form impact and force the thermal floating ball to expand; under the dual action of impact force and buoyancy, the hot floating ball forces the movable rod to integrally rise to increase the contact area with the outside, so that rapid heat dissipation is realized, air flow near a coating is caused, accumulated dust on the coating is blown off while the heat exchange efficiency is accelerated, high heat conductivity is always kept, and then the movable rod automatically resets after being cooled, so that the service life of the coating is prolonged. And an efficient dynamic heat dissipation effect can be realized.

Description

Technical field [0001] The present invention relates to the technical field of thermally conductive coating, and more particularly to a floating thermal conductive coating for an LED lamp and a preparation method thereof. Background technique [0002] The LED display is a flat panel display consisting of a small LED module panel that displays a device such as a variety of information such as text, video, video signal, which requires a backplane to truly display. The aluminum magnesium alloy is generally used in the prior art as an LED backplane. [0003] According to the aluminum magnesium alloy properties, the advantages of the LED backplane are: 1, corrosion resistance; 2, high strength; 3, electromagnetic shielding performance is excellent; 4, color is more easier to other aluminum-based materials; 5, good thermal conductivity Performance; 6, has certain impact resistance. [0004] However, the limitations of the material itself have: 1, the thermal conductivity is lower than ...

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Problems solved by technology

[0004] But it has limitations brought by the material itself: 1. The thermal conductivity is lower than that of pure aluminum, magnesium-based alloys and other materials. When applied to cold light LEDs, there is a problem of heat dissipation when the LEDs are in a high-temperature environment (because the aluminum-magnesium alloy contains Not resistant to heat, easy to fail or even burned); 2. High brittleness, poor fatigue performance, and easy to break under the action of large impact force or cyclical stress; 3. The most important heat dissipation of LED materials is through air conduction (Instead of radiation and light energy conversion in the conventional sense, because most of the radiant heat still exists in the LED element, and the same is true for light energy conversion), and the poor formability of aluminum-magnesium alloys makes it suitable for The structure of micro-fins that convect with the air is more costly

[0005] In the prior art, a heat-conducting coating is used to assist the backplane to efficiently dissipate heat, but the heat dissipation effect is very limited, and it is far from reaching the heat generation efficiency of the backplane, especially for LED lamps that are sealed and packaged, the heat dissipation is even greater. The heat dissipation is limited, and the surface is easy to accumulate dust to hinder heat dissipation, resulting in poor heat dissipation, which cannot meet the heat dissipation requirements of the aluminum-magnesium alloy backplane

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