Ultrahigh-hardness silicon resin film as well as preparation method and application thereof

Abstract

The invention belongs to the technical field of mini LED packaging, and particularly discloses an ultrahigh-hardness silicon resin film as well as a preparation method and application thereof. The method comprises the following steps: preparing vinyl silicone resin: carrying out sol-gel reaction on hydroxyl vinyl silicone resin and methyltrimethoxysilane to obtain the vinyl silicone resin; preparing hydrogen-containing silicon resin: carrying out hydrolytic condensation on hydroxyl silicon resin, tetramethylcyclotetrasiloxane and hydrogen-containing double end sockets to obtain the hydrogen-containing silicon resin; and preparing the silicon resin film: uniformly mixing vinyl silicon resin, hydrogen-containing silicon resin, vinyl MQ silicon resin, vinyl silicone oil, a Pt catalyst and a tackifier according to a certain mass ratio, leveling on a flat plate, and curing to obtain the ultrahigh-hardness silicon resin film. The silicon resin film prepared by the method is extremely high in hardness, good in light transmission performance, good in flexibility, high-temperature-resistant and yellowing-resistant, the preparation process is simple to operate, no organic solvent is used, the prepared film is good in repeatability and controllability, and industrialization is easy to realize.

Description

technical field [0001] The invention relates to the technical field of mini LED packaging, in particular to an ultra-high hardness silicone resin film and a preparation method and application thereof. Background technique [0002] Mini LED refers to an LED device with a chip size between 50 and 200 μm. Mini LED combines the characteristics of light-emitting diodes (LEDs) such as low power consumption, low calorific value, high brightness, and long life. The advantages of miniLED display are high brightness, high contrast, fast response time, excellent color performance, and precise dimming, making it a display technology sought after by many manufacturers. [0003] Due to the small chip size and small chip pitch of mini LED, the traditional surface mount (SMD) can no longer meet the small pitch process requirements of mini LED due to the way of packaging first and then patching. Chip on board package (COB) ) saves the packaging of a single LED chip, and directly adheres the...

AI Technical Summary

Problems solved by technology

[0004] Mini LED encapsulants mainly include epoxy resin and silica gel. Epoxy resin has high hardness and good air tightness, but it is poor in temperature resistance and anti-yellowing. Silicone has low mechanical strength and weak air tightness. The temperature and anti-yellowing performance are good. Since the COB package is a large-scale package of the whole board module, and the thermal expansion coefficient difference between the epoxy resin and the substrate is large, the package warpage is obvious, and the flatness of the COB package cannot be guaranteed, especially the whole screen. It is more obvious when splicing, and at the same time, the color temperature and color rendering index of each packaged LED vary greatly, which makes epoxy resin unfavorable for large-sized mini LED packaging, and silicone materials become the first choice for mini LED

[0005] The low mechanical strength of silica gel limits its application in mini LED packaging. The method to improve the mechanical strength of silica gel is usually to increase the vinyl content of vinyl silicone resin and the hydrogen content of hydrogen-containing curing agent. The cured silica gel has a higher The crosslinking density and hardness are usually difficult to exceed 70shore D. At the same time, due to the high crosslinking density, the internal stress of the silica gel is large and the toughness is poor. Therefore, the preparation of a high hardness and good flexibility silica gel is of great importance for mini LED packaging. significance

[0006] Aiming at the problem of low mechanical strength of silica gel, the present invention proposes a method for preparing an ultra-high hardness silicone resin film suitable for mini LED packaging. The prepared silicone resin film has high hardness, up to 80shore D, smooth surface and good flexibility. , suitable for large-size mini LED display packaging, and its preparation process is simple, easy to operate, does not use organic solvents, the prepared film has good repeatability and controllability, and is easy to realize industrialization

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