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Epoxy resin composite material and preparation method thereof

A technology of epoxy resin and composite materials, which is applied in the field of advanced composite materials, can solve the problems of poor wettability, high brittleness, and poor toughness of composite materials, and achieve the effects of high interface bonding strength, improved surface state, and enhanced interface strength

Pending Publication Date: 2021-11-26
广东华彩复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermosetting bisphenol A or F-type epoxy resin has poor wettability with carbon fiber and high brittleness after curing, which makes it difficult to give full play to the characteristics of epoxy resin composite materials and limits its application field; at the same time, the existing epoxy resin / carbon fiber-based The manufacturing process of composite materials is not perfect enough, and there are common problems of poor toughness and low interface shear strength of composite materials

Method used

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  • Epoxy resin composite material and preparation method thereof
  • Epoxy resin composite material and preparation method thereof
  • Epoxy resin composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0036] A kind of epoxy resin composite material, comprise the epoxy resin matrix and carbon fiber that weight ratio is 2:3, wherein, described epoxy resin matrix comprises the raw material of following weight portion:

[0037] 100 parts of organosilicon-modified cardanol-based epoxy resins, 40 parts of lignin-based epoxy resins, 5 parts of interface modifiers, 30 parts of reactive diluents, 15 parts of curing agents, and 40 parts of solvents;

[0038]The interface modifier is a polymer particle with a core-shell structure, the shell layer has an amino group, and the particle size is 150nm; the reactive diluent is ethylene glycol diglycidyl ether and butyl glycidyl ether according to the weight ratio 1:1 mixture; the curing agent is a mixture of polyetheramine and 2-methylimidazole according to a weight ratio of 1:2; the solvent is isopropanol;

[0039] The epoxy equivalent of the organosilicon-modified cardanol-based epoxy resin is 300g / eq, which is prepared by the following p...

Embodiment 2

[0050] A kind of epoxy resin composite material, comprise the epoxy resin matrix and carbon fiber that weight ratio is 2:2, wherein, described epoxy resin matrix comprises the raw material of following weight portion:

[0051] 50 parts of organosilicon-modified cardanol-based epoxy resins, 50 parts of lignin-based epoxy resins, 5 parts of interface modifiers, 30 parts of reactive diluents, 10 parts of curing agents, and 60 parts of solvents;

[0052] The interface modifier is a polymer particle with a core-shell structure, the particle size is 300nm, and the shell layer of the interface modifier has a carboxyl group, which is used to crosslink the epoxy group in the epoxy resin reaction.

[0053] The reactive diluent is a mixture of propylene glycol diglycidyl ether and benzyl glycidyl ether in a weight ratio of 2:1; the curing agent is isophorone diamine and 1,2-dimethylimidazole in a weight ratio 1:1 mixture; The solvent is diethylene glycol methyl ether;

[0054] The epox...

Embodiment 3

[0069] A kind of epoxy resin composite material, comprise the epoxy resin matrix and carbon fiber that weight ratio is 3:2, wherein, described epoxy resin matrix comprises the raw material of following weight portion:

[0070] 80 parts of organosilicon-modified cardanol-based epoxy resins, 30 parts of lignin-based epoxy resins, 2 parts of interface modifiers, 25 parts of reactive diluents, 14 parts of curing agents, and 50 parts of solvents;

[0071] The interface modifier is a polymer particle with a core-shell structure, the particle size is 200nm, and the shell layer of the interface modifier has amino groups, which are used for crosslinking the epoxy groups in the epoxy resin reaction.

[0072] The reactive diluent is a mixture of propylene glycol diglycidyl ether and C8 alkyl glycidyl ether in a weight ratio of 2:3; the curing agent is octyldiamine and 1,2-dimethylimidazole in a weight ratio of 1:1 The mixture; The solvent is ethylene glycol methyl ether acetate;

[007...

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Abstract

The invention provides an epoxy resin composite material and a preparation method thereof. Organosilicon-modified cardanol-based epoxy resin and lignin-based epoxy resin are selected as resin matrixes, the preparation method is adjusted, and auxiliary components such as an interface modifier are added at the same time; thereby, the epoxy resin composite material is good in wettability to carbon fibers and high in interface bonding strength, good mechanical performance can be kept in a low-temperature or high-temperature environment; meanwhile, a carbon fiber surface modification method is adjusted, the carbon fibers are subjected to surface treatment through pretreatment of plasma, a silane coupling agent and silica sol, so that the surface state of the carbon fiber is greatly improved, and the interface strength of the carbon fiber and a resin matrix and the mechanical property of the epoxy resin composite material are improved.

Description

technical field [0001] The invention belongs to the field of advanced composite materials, in particular to an epoxy resin composite material and a preparation method thereof. Background technique [0002] Epoxy resin / carbon fiber composite materials have high specific strength, high specific modulus and light weight characteristics, and are widely used in aerospace, transportation, sports equipment and other fields. However, the surface of carbon fiber is inert and has a high degree of graphitization , there are few polar groups, the interface bonding strength with epoxy resin is low, and it cannot be fully infiltrated; moreover, there is a difference in thermal expansion coefficient between carbon fiber and epoxy resin, and it is easy to cause carbon fiber and epoxy resin during use in high or low temperature environments. Debonding and microcracks appear at the interface of epoxy resin, which affect the mechanical properties of composite materials. [0003] At present, m...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L51/00C08K9/00C08K9/06C08K9/02C08K7/06
CPCC08L63/00C08L2207/53C08L51/00C08K9/00C08K9/06C08K9/02C08K7/06
Inventor 郑斯祥林文丹李刚黄必文邓辉尧邱诗砚
Owner 广东华彩复合材料有限公司
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