High-performance resin-based adhesive as well as preparation method and application thereof
A resin-based and adhesive technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problem of reduced fracture energy and fracture toughness of cured products, poor water resistance, salt spray resistance and high temperature resistance, and metal substrates Solve problems such as low bonding strength, achieve the effect of improving scratch resistance and wear resistance, temperature stability, good compatibility, and reducing curing shrinkage
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Embodiment 1
[0020] A high-performance resin-based adhesive, including the following components calculated in parts by mass: 25 parts of bismaleimide resin, 30 parts of polyimide modified epoxy resin, hydroxyl-terminated liquid polybutadiene 30 parts of rubber, 10 parts of silicone rubber, 12 parts of isocyanate-terminated polyurethane, 20 parts of diphenylmethane diamine, 20 parts of dicyandiamine, 1 part of 2-phenyl-4-methylimidazole, vinyl trimethoxy 2.5 parts of silane, 5 parts of sericite powder, 5 parts of boron nitride, and 10 parts of carbon fiber.
Embodiment 2
[0022] A high-performance resin-based adhesive, including the following components calculated in parts by mass: 25 parts of bismaleimide resin, 30 parts of polyimide modified epoxy resin, hydroxyl-terminated liquid polybutadiene 30 parts of rubber, 10 parts of silicone rubber, 12 parts of isocyanate-terminated polyurethane, 20 parts of hexamethylenediamine, 20 parts of methylguanidine, 1 part of 2-phenyl-4-methylimidazole, 2.5 parts of vinyltrimethoxysilane , bentonite 5, calcium carbonate 5, carbon fiber 10 parts.
Embodiment 3
[0024] A high-performance resin-based adhesive, including the following components calculated in parts by mass: 30 parts of bismaleimide resin, 45 parts of polyimide modified epoxy resin, hydroxyl-terminated liquid polybutadiene 45 parts of rubber, 10 parts of silicone rubber, 15 parts of isocyanate-terminated polyurethane, 60 parts of diphenylmethanediamine and dicyandiamide, 1.5 parts of 2-phenyl-4-methylimidazole, 5 parts of vinyltrimethoxysilane 10 parts, 10 parts of sericite powder, 10 parts of boron nitride, 10 parts of carbon fiber.
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