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Resin for water developing photoresist and preparation method of resin

A photoresist and water development technology, applied in the field of photoresist resin oligomers, can solve the problems of poor physical and mechanical properties, low hydrolysis speed, low activity, etc., and achieve improved quality, good stability, and small group volume Effect

Pending Publication Date: 2022-01-21
江苏集萃光敏电子材料研究所有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the defects of photoresist resin in the prior art, such as low activity, low hydrolysis rate, and poor physical and mechanical properties in the photoreaction process, the present invention provides a resin for water-developed photoresist and its preparation method , the present invention adjusts the photoreactivity, ester hydrolysis speed, development speed and physical and mechanical properties of the resin by adjusting the concentration of different polymerized monomers in the process of preparing the resin; by adjusting the polymerization temperature, polymerization time and initiator during the polymerization reaction The amount used to control the speed of the polymerization reaction, the weight average molecular weight and molecular weight distribution index of the obtained resin, etc., so as to prepare a vinyl resin that meets the requirements of water-developable photoresist

Method used

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  • Resin for water developing photoresist and preparation method of resin
  • Resin for water developing photoresist and preparation method of resin

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation method of a water developed photoresist is as follows:

[0027] 500 grams of the following polymerization monomer: 150 grams of maleicate (30% of the total mass of the polymer monomer), 200 grams of acetal polyhydroxycyclohexylidene (40% of the total mass of the polymerization monomer) 150 g of tert-butyl methacrylate (30% of total mass of the polymer monomer), 6 grams of pendide, 2000 g of solvent propylene glycol methyl ether, as a chain transfer agent as a chain transfer agent 0.3 g of dithiol was added to the polymerization reactor, and the oxygen in the system was removed from the nitrogen gas, followed by temperature to 120 ° C for free radical polymerization, then three times (30 minutes per spacer), heat free radical initiator peroxidation Benzoyl each 0.3 grams, continued to react 200 minutes, cool down to room temperature, ie the desired water showed photoresist.

[0028] The obtained product resin has a molecular weight of 12,000, and the molecula...

Embodiment 2

[0031] 600 g of the following polymerization monomer: 300 grams of maleic acid (50% of the total mass of the polymer monomer), acetal polyhydroxycyclohexylideylene 240 grams (40% of total mass of the polymer monomer) ) 0.8 grams of dythiol of the agent, added to the polymerization reactor, and the oxygen in the system was removed by nitrogen gas, followed by raw to 90 degrees ° C for free radical polymerization, and three times (30 minutes every 30 minutes) supplement heat free radical The initiator was oxidized to tert-butyl each 0.4 grams, and the reaction was 120 minutes, and the desired water showed photoresist was obtained.

[0032] After a feature, the obtained product resin has a molecular weight of 19,000, and the molecular weight distribution index is 1.83.

[0033] The resin prepared by the present embodiment is based on the base material, and 1.5% is added to the acidic acid (iodonium salt), 3000 rpm, rotary coating, dry film thickness 3 microns, high pressure mercury l...

Embodiment 3

[0035] 800 g of the following polymerization monomer: 560 grams of maleic acid (70% of the total mass of the polymer monomer), 240 grams of acetal polyhydroxycyclohexylidene (30% of total mass of the polymer monomer) , As a azo diisobuty cyanine 10 grams of thermal radical initiator, 2800 g of salted propylene glycol methyl ether acetate, 1 gram of tetracene as a chain transfer agent, added to the polymerization reactor, remove nitrogen gas for 20 minutes The oxygen in the system was subsequently warmed to 130 ° C for free radical polymerization, and it was divided into 0.1 grams of thermal initiator coupling or 2,000 minutes, reaction for 480 minutes, cooling to room temperature, ie The water is used for the water.

[0036] After a manner, the obtained product resin has a molecular weight of 30000, and the molecular weight distribution index is 1.76.

[0037] The resin prepared by the present embodiment is based on the base material, and 1.55% of the high-yield acid (thiol), 2000...

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Abstract

The invention belongs to the technical field of photoresist resin oligomers, and particularly relates to resin for a water developing photoresist and a preparation method of the resin. The preparation method comprises the following steps: dissolving maleic acid diester, acetalated polyhydroxy cyclohexyl ethylene and methacrylate as polymeric monomers in an organic solvent, and carrying out free radical polymerization reaction under the condition of a thermal free radical initiator and a chain transfer agent to prepare the resin for the water developing photoresist. According to the preparation method, acetalated polyhydroxy cyclohexyl ethylene is adopted as a polymerization monomer, in the photoetching reaction process, the decomposition speed of a ether bond by formed acetal acid is higher, and a large number of hydroxyl groups are generated in an exposure area, so that the developing speed of the photoresist is increased, and meanwhile, due to the existence of a cyclohexane structure, the etching resistance of the photoresist can be improved.

Description

Technical field [0001] The present invention belongs to the field of photoresist resin oligomer technology, and more particularly to a water developed photoresist resin and a preparation method thereof, belonging to a vinyl resin which can be developed with an aqueous solution. Background technique [0002] UV photoresist is mainly composed of resins, monomers, photosensitizers, other additives, under illumination, the photosensitive agent cracking produces active substance, which causes the chemical reaction of the resin to change the properties of the resin, resulting in a resin in a solvent or alkali aqueous solution. The change in solubility is prepared by developing. [0003] The resin of the photoresist mainly has two types, one is a polymerization reaction initiated, and the resin is no longer dissolved in a solvent or water, and is generally referred to as a negative photoresist; After that, the photosensitive agent produces a strong acid, and the structural change of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F224/00C08F222/14C08F220/18G03F7/004
CPCC08F224/00C08F222/14G03F7/004C08F220/1804C08F220/1802
Inventor 聂俊朱晓群张宇蔚张向阳张雪琴孙芳
Owner 江苏集萃光敏电子材料研究所有限公司