Steel back press-fit pretreatment process method
A process method and pre-treatment technology, applied in hot-dip plating process, metal material coating process, manufacturing tools, etc., can solve problems such as the lack of proper protection of the surface of the steel back, the inability to continue the manufacture of parts, and the pitting in the processing process. , to achieve the effect of improving the bonding effect, good performance and improving the fixing strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0021] The first step, annealing, the annealing process is to keep warm at 625°C for 20 minutes; the second step, polishing, the polishing process is sandblasting, and the sandblasting process of FC2-8 sandblasting machine is: nozzle diameter 0.5m, pressure 0.5MPa, distance It is 500mm, the gun speed is 0.5m / s, and the particle size of quartz sand is 80 mesh; the third step, electroless plating, the plating solution composition used in electroless plating is copper pyrophosphate 20g / L, sodium citrate 135g / L, tartaric acid Potassium sodium 42g / L, sodium dihydrogen phosphate 15g / L, potassium nitrate 5g / L, pH9, bath temperature 40°C, current density 1.5A / dm 2 , electroplating at 25°C with a stirring speed of 15r / min for 10min, the reagents used in the plating solution are analytically pure, the water used is deionized water, and the thickness is 5.8μm; the fourth step is hot-dip copper plating, the hot-dip copper plating process is steel back pre- The heating temperature is 700°C...
Embodiment 2
[0024]First, annealing, the annealing process is 640 ℃ heat preservation for 60 minutes; second, polishing, the polishing process is sandblasting polishing, in which the FC2-8 sandblasting machine sandblasting process is: nozzle diameter 0.6cm, pressure 0.6MPa, distance 600mm, walk The speed of the gun is 0.6m / s, and the particle size of quartz sand is 100 mesh; then, electroless plating, the plating solution composition that electroless plating adopts is copper pyrophosphate 20gL, sodium citrate 140g / L, potassium sodium tartrate 43g / L, diphosphate Sodium hydrogen 20g / L, potassium nitrate 4g / L, pH 12, bath temperature 80°C, current density 1.5A / dm 2 , 25 ℃ stirring speed 20r / min electroplating 20min, the reagents used in the plating solution are all analytically pure, the water used is deionized water, the thickness is 5.7μm; then, hot-dip copper plating, the hot-dip copper plating process is the preheating temperature of the steel back 800°C, copper bath immersion temperature...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Adhesive strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More