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Bonding conductor paste

A technology for bonding and bonding structures, used in cable/conductor manufacturing, conductive adhesives, inorganic adhesives, etc., which can solve the problems of easy viscosity fluctuation, exudation of conductor paste, and fast volatilization speed, so as to reduce deterioration. or damage, less bleeding, and the effect of preventing deterioration of electrical properties

Pending Publication Date: 2022-04-01
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, unplated copper, nickel substrates, and wiring in semiconductor modules are easily oxidized by oxygen, and must be sintered in an atmosphere of inert gases such as nitrogen. For the conductive paste of silver particles, the sintering will not proceed in the nitrogen atmosphere, and it is difficult to join
In addition, the conductive paste using the above-mentioned alcohol solvent is prone to "bleeding", and methanol and ethanol volatilize quickly at the printing temperature. Form fine patterns with precision
In addition, there is a problem that it is difficult to obtain conductor wiring with excellent bonding strength with the substrate in the conductor paste using ethylene glycol.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0193] 50 g of diethylene glycol monobutyl ether was added as a solvent (C1) to 10 g of methanol slurry of nAg, and it separated into the solvent part and the wet powder of nAg by centrifugation.

[0194] The solvent portion was discarded, and 50 g of diethylene glycol monobutyl ether was added to the wet powder to disperse it, and then centrifuged to separate into a solvent portion and a wet powder of nAg. This operation was repeated three times to obtain nAg diethylene glycol monobutyl ether wet powder. Heat the wet powder to 400°C in TG-DTA, and calculate the weight of diethylene glycol monobutyl ether contained according to the weight loss. The diethylene glycol monobutyl ether content in the wet powder was 14.5 wt%.

[0195] Then, 80 parts of AgC-239, 23.4 parts of nAg wet powder (20 parts of nAg, 3.4 parts of diethylene glycol monobutyl ether: according to the calculated value obtained by the above-mentioned TG-DTA), as a solvent (C2 ) were mixed with 8 parts of tripro...

Embodiment 1～40

[0197] Adhesion was obtained in the same manner as in Example 1 except that the compounding amounts of silver particles (A), silver particles (B), solvent (C1), and solvent (C2) were set as shown in Tables 1 to 6. conductor paste.

Embodiment 32～35

[0209] ・Gold-plated substrate (manufactured by Nippon Testpanel Co., Ltd.) (Examples 32 to 35 and Comparative Example 5 only)

[0210] Substrate: Copper (1.0mm×9mm×60mm)

[0211] Substrate: Electroless Nickel (5μm)

[0212] Surface: semi-gloss silver plating (1.0μm)

[0213] ・Silicon chip (manufactured by YAMANAKA HUTEC Co., Ltd.)

[0214] Silicon (0.525mm×3mm×3mm)

[0215] Substrate: Titanium 500nm sputtering

[0216] Most surface: Silver 2μm sputtering

[0217] [mask]

[0218] ・Metal mask (manufactured by TOWA-TECH Co., Ltd.)

[0219] 3mm×3mm, mesh thickness 100μm

[0220] [equipment]

[0221] · Mounter

[0222] SMT-64H (manufactured by Okuhara Electric Co., Ltd.)

[0223] ·Sintering furnace (reflow furnace)

[0224] RSS-450-210-FA (manufactured by UNITEMP)

[0225] The bonding conductor paste obtained in the above-mentioned Examples and Comparative Examples was applied on the substrate (1) by a metal mask printing method to form a coating film (coating film thic...

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Abstract

The purpose of the present invention is to provide a paste which is capable of achieving printing without unevenness by suppressing variations in viscosity at a printing temperature, and which can be rapidly sintered even in an inert gas atmosphere such as nitrogen gas to form a high-precision conductor wiring and bonded structure having excellent bonding strength. Provided is a bonding conductor paste for forming a bonding structure and / or a conductor wiring for connecting an electronic component, the bonding conductor paste containing conductive particles and a solvent. The adhesive conductor paste contains, as conductive particles, silver particles (A) having an average particle diameter of 1 nm or more and less than 100 nm and silver particles (B) having an average particle diameter of 0.1 [mu] m or more and 10 [mu] m or less, the silver particles (A) being silver nanoparticles having a configuration in which the surfaces are coated with a protective agent containing an amine. The adhesive conductor paste contains, as a solvent, a compound (C) represented by formula (I): Ra-O-(X-O) n-Rb (I) (wherein Ra represents a monovalent group selected from a hydrocarbon group having 1-6 carbon atoms and an acyl group; and X represents a divalent group selected from hydrocarbon groups having 2-6 carbon atoms. And Rb represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having 1-6 carbon atoms and an acyl group. Ra and Rb may be the same group. And n represents an integer of 1-3).

Description

technical field [0001] The present invention relates to a bonding conductor paste used for forming conductor wiring and bonding structures for connecting electronic components such as power semiconductor elements and LED elements. This application claims the priority of Japanese Patent Application No. 2019-145510 for which it applied to Japan on August 7, 2019, and uses the content here. Background technique [0002] When mounting electronic components such as power semiconductor elements and LED elements, it is necessary to bond multiple materials with high strength. For this purpose, conductor wiring, bonded structures, or wiring boards equipped with them are used. [0003] As a method of forming the above conductor wiring, for example, a method of producing copper wiring by etching copper foil adhered to an insulating substrate is known. However, in the above method, there is a problem that a large amount of waste is generated by etching. [0004] As another method, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/24H01B13/00H05K1/09H05K3/10
CPCH01B1/22H05K1/097H05K2201/0224H05K2201/0272H05K3/12H05K3/321H05K2203/0783H01B13/0036H05K3/10C09J1/00C09J9/02C09J11/06C09J2203/326
Inventor 小畑贵慎江川智哉赤井泰之
Owner DAICEL CHEM IND LTD