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Solder resist ink composition

An ink composition and resist technology, which is applied in the manufacturing of instruments, electrical components, printed circuits, etc., can solve the problem of poor adhesion between conductor pads and chemical plating layers, and poor adhesion between conductor pads and solder bodies. problems such as poor compatibility, to achieve the effect of improving photocuring properties, good impregnation, and improving operability

Inactive Publication Date: 2006-08-23
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a solder resist film of a related composition is used, when a solder body such as a solder ball is supplied to a conductor pad (solder pad) formed on the solder resist film, the adhesion between the conductor pad and the solder body may be poor. Good, especially need to improve
Especially in order to improve the adhesion of the solder body to the conductor pad, after the formation of the solder resist film (or before the formation of the solder resist film), when an electroless plating layer (undercoat layer) is formed on the surface of the conductor pad, it is obviously inclined to produce a conductor Poor adhesion between pads and electroless plating and / or between electroless plating and solder body, especially between conductor pads and electroless plating

Method used

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  • Solder resist ink composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0058] Synthesis example 1 (synthesis example of photosensitive prepolymer (A)):

[0059] 220 parts of Epiclon N-695 (epoxy equivalent = 220 produced by Dainippon Ink Chemical Industry Co., Ltd.) of cresol novolac epoxy resin was placed in a four-necked flask with a stirrer and a reflux cooler, and 206 parts Carbitol acetate, heated to dissolve. Then add 0.1 parts of polymerization inhibitor hydroquinone and 2.0 parts of reaction catalyst triphenylphosphine. This mixture was heated to 95-105 degreeC, and 72 parts of acrylic acid were dripped slowly, and it was made to react for 16 hours. The obtained reaction product was cooled to 80-90 degreeC, 91.2 parts of tetrahydrophthalic anhydrides were added, it was made to react for 8 hours, and it took out after cooling. The photosensitive prepolymer thus obtained having an ethylenically unsaturated bond and a carboxylic acid group had a nonvolatile content of 65%, and an acid value of solid matter of 87.8 mgKOH / g. Hereinafter, th...

Embodiment 1～4

[0061] Using the varnish A obtained in Synthesis Example 1, the ingredients shown in Table 2 were kneaded with a 3-roll mill to obtain a solder resist ink composition.

[0062] Match raw materials

Synthetic example 2

[0116] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, add methyl methacrylate, ethyl methacrylate, and methacrylic acid in a molar ratio of 1:1:2, and use dipropylene glycol as a solvent Monoethyl ether, using azobisisobutyronitrile (AIBN) as a catalyst, stirring at 80° C. for 4 hours under a nitrogen atmosphere to obtain a resin solution.

[0117] Cool the resin solution, use methyl hydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and carry out an addition reaction corresponding to 20 mol% of the carboxylic acid groups of the resin at 95 to 105 ° C and 16 hours, Remove after cooling.

[0118] The thus obtained photosensitive prepolymer having an ethyl carboxyl group having an ethylenically unsaturated bond had a non-volatile content of 65%, an acid value of solid content of 120 mgKOH / g, and a Mw of approximately 15,000. This resin solution is hereinafter referred to as B varnish.

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Abstract

A solder resist ink composition for printed circuit boards which is suitable for forming, with satisfactory adhesion, a primer deposit layer, e.g., an Ni-Au deposit layer, having satisfactory wettability by a solder. The composition comprises (A) a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated bonds per molecule and having an acid value of 50 to 150 mg-KOH / g on a solid basis, (B) a photopolymerization initiator having a melting point of 100 DEG C or higher, (C) a diluent, and (D) a thermosetting ingredient comprising as the main component an epoxy compound having two or more epoxy groups per molecule.

Description

[0001] This application is a divisional application of the Chinese invention patent application No. 00807254.X with the current invention title of "Printed Circuit Board". The original international application number is PCT / JP00 / 02936. technical field [0002] The present invention relates to a solder resist ink composition. More specifically, it relates to a solder resist ink composition that satisfies the original required characteristics of a solder resist film, such as solder heat resistance and adhesion to a wiring board, while maintaining good adhesion. A solder resist ink composition suitable for stably supplied printed wiring boards, which forms a conductor pad (conductor pad) having a good bottom plating layer with good solder wettability. technical background [0003] Recently, with the rapid development of semiconductor components, electronic equipment tends to be smaller and lighter, more functional, and more functional. Along with this trend, higher densificati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/033C08G59/14H05K3/28
CPCG03F7/033H05K3/287G03F7/027C08G59/14
Inventor 松村正美小川勇太
Owner TAIYO HLDG CO LTD
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