Copper conductor slurry, conductor circuit board and electronic elements

A technology for copper conductors and circuit boards, applied to printed circuit components, conductive materials dispersed in non-conductive inorganic materials, metal/alloy conductors, etc., can solve the problem of decreased adhesion during electroplating, poor wettability of copper powder, and copper conductor Problems such as film difficulty, achieve the effects of less adhesion loss, good plating resistance, and low price

Active Publication Date: 2008-08-06
MITSUBOSHI BELTING LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to obtain a copper conductor film with good adhesion due to poor wettability to copper powder and high softening point of this glass.
[0012] In addition, the glass-based frit containing a large amount of zinc oxide (ZnO) as disclosed in the above-mentioned Patent Document 4 has good wettability with respect t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0111] Use any copper conductor paste in "Paste 1" to "Paste 8" that satisfies the requirements (1) to (4) of the present invention. In addition, as a heat-resistant substrate, a 3 inch x 3 Inch x 0.635 mm thick 96% alumina substrate (manufactured by NIKKO Corporation).

[0112] Then, the copper conductor paste was screen-printed on the surface of the heat-resistant substrate using stainless steel mesh #250 (wire diameter 30 μm, emulsion thickness 10 μm) arranged in a pattern of 2 mm×2 mm. Next, dry the printed substrate with an air dryer at 150°C for 20 minutes, remove the solvent, put the printed substrate into a conveyor belt furnace, walk in the conveyor belt furnace for 60 minutes, and dry it at high temperature in the air. Organic binders are decomposed and removed. At this time, drying was carried out under three temperature conditions by using a conveyor belt furnace with peak temperatures set at 210°C, 220°C, and 230°C, respectively. Next, the above-mentioned dried ...

Embodiment 9～15

[0121] Use any copper conductor paste in "Paste 1" to "Paste 7" that satisfies the requirements (1) to (4) of the present invention. In addition, as a heat-resistant substrate, a 3 inch x 3 An aluminum nitride substrate (manufactured by MARUWA Corporation) of inch×0.635 mm thick.

[0122] Then, in the same manner as (Examples 1 to 8), screen printing of the copper conductor paste, high-temperature drying-firing, and electroless plating were performed to obtain a conductor circuit board. As in Examples 1 to 8, the adhesion between the copper conductor film and the substrate before and after plating was measured for this conductor circuit board, and the dependence on firing conditions was evaluated. The results are shown in Table 4.

[0123] [Table 4]

[0124] Example 9

Example 10

Example 11

Example 12

Example 13

Example 14

Example 15

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Embodiment 16～19

[0128] Use any of the copper conductor pastes from "Paste 9" to "Paste 12" in which the amount of glass frit to copper powder is changed, and 96% alumina is used as a heat-resistant substrate substrate.

[0129] Then, in the same manner as (Examples 1 to 8), screen printing of the copper conductor paste, high-temperature drying-firing, and electroless plating were performed to obtain a conductor circuit board. With respect to this conductor circuit board, similarly to (Examples 1 to 8), the adhesion between the copper conductor film and the substrate before and after plating was measured, and the dependence on firing conditions was evaluated. The results are shown in Table 5.

[0130] [table 5]

[0131] Example 16

[0132] As can be seen from Table 5, the copper conductor pastes of Examples 18 and 19 have a small blending amount of glass frit, which are respectively 3.0% by mass and 2.0% by mass, so the adhesion is slightly reduced due to electroplating. Adhesive ...

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Abstract

A copper conductor sizing agent is able to form a copper conductor film which the atmosphere be controlled to obtain a high density force while not strictly sintering, and less reduction of the density force because of the plating process. The copper conductor sizing agent contains conductive powder with the core of the copper powder, the first glass melting material which is helpful for enhancing the wetting quality, the second glass melting material which is helpful for enhancing resistance to chemical reagents, organic medium. (1) the first glass melting material, the softening point is below 800 centigrade, in the nitrogen atmosphere at 900 centigrade, the contact angle corresponding to the copper powder which is not oxidized superficially is below 60 degrees; (2) the solubility of the second glass melting material is below 1mg/cm2hr corresponding to the 10 quality% sulphuric acid aqueous solution at 25 centigrade; (3) the difference between the softening point of the first glass melting material and the softening point of the second glass melting material is below 150 centigrade; (4) relevant to the total quantity of the glass melting material, the content of the first glass melting material is 10-70 quality%; the content of the second glass melting material is 30-90 quality%.

Description

technical field [0001] The present invention relates to a Cu-centric copper conductor paste used for forming a conductor circuit of a circuit board of an electronic component or an external electrode of a laminated capacitor, etc., and to a conductor film or an electrode formed using the copper conductor paste Conductor circuit boards, electronic components. Background technique [0002] Conductive pastes are widely used to form conductive films or circuits such as wiring, conductive patterns, and electrodes of laminated ceramic capacitors on the surface or inside of insulating substrates such as ceramic substrates. [0003] The conductive paste usually contains conductive metal powder and glass frit as solid components, and is prepared by adding a vehicle composed of a suitable resin or solvent to impart coatability, and then kneading it. Then, after the conductive paste is coated on the surface of the insulating substrate by screen printing, etc., it is heated at a high t...

Claims

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Application Information

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IPC IPC(8): H01B1/16H05K1/09
CPCH01B1/02H01B1/22H01G4/005
Inventor 林耀广
Owner MITSUBOSHI BELTING LTD
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