Copper conductor slurry, conductor circuit board and electronic elements

Abstract

A copper conductor sizing agent is able to form a copper conductor film which the atmosphere be controlled to obtain a high density force while not strictly sintering, and less reduction of the density force because of the plating process. The copper conductor sizing agent contains conductive powder with the core of the copper powder, the first glass melting material which is helpful for enhancing the wetting quality, the second glass melting material which is helpful for enhancing resistance to chemical reagents, organic medium. (1) the first glass melting material, the softening point is below 800 centigrade, in the nitrogen atmosphere at 900 centigrade, the contact angle corresponding to the copper powder which is not oxidized superficially is below 60 degrees; (2) the solubility of the second glass melting material is below 1mg / cm2hr corresponding to the 10 quality% sulphuric acid aqueous solution at 25 centigrade; (3) the difference between the softening point of the first glass melting material and the softening point of the second glass melting material is below 150 centigrade; (4) relevant to the total quantity of the glass melting material, the content of the first glass melting material is 10-70 quality%; the content of the second glass melting material is 30-90 quality%.

Description

technical field [0001] The present invention relates to a Cu-centric copper conductor paste used for forming a conductor circuit of a circuit board of an electronic component or an external electrode of a laminated capacitor, etc., and to a conductor film or an electrode formed using the copper conductor paste Conductor circuit boards, electronic components. Background technique [0002] Conductive pastes are widely used to form conductive films or circuits such as wiring, conductive patterns, and electrodes of laminated ceramic capacitors on the surface or inside of insulating substrates such as ceramic substrates. [0003] The conductive paste usually contains conductive metal powder and glass frit as solid components, and is prepared by adding a vehicle composed of a suitable resin or solvent to impart coatability, and then kneading it. Then, after the conductive paste is coated on the surface of the insulating substrate by screen printing, etc., it is heated at a high t...

AI Technical Summary

Problems solved by technology

However, it is difficult to obtain a copper conductor film with good adhesion due to poor wettability to copper powder and high softening point of this glass.

[0012] In addition, the glass-based frit containing a large amount of zinc oxide (ZnO) as disclosed in the above-mentioned Patent Document 4 has good wettability with respect to copper, so a copper conductor film with high initial adhesion can be obtained, which can solve the above-mentioned problem. The first problem, but because of the poor acid resistance of this kind of glass, there is a problem that the adhesion force is greatly reduced during electroplating, and the second problem cannot be solved.