Application of thermal evaporated film deposition process of ferric oxide

Abstract

The invention discloses an application of thermal evaporated film deposition process of ferric oxide. The application mainly adopts thermal evaporation principle and devices to plate various elements such as titanium, nickel, silver, tin, copper, iron, and the like on the surface of iron oxide (FeO2) by thin film deposition; in the process, each thermal evaporation parameters such as deposition rate, vacuum degree, heating current / time, preheating time / temperature and the like are defined according to the physical properties of each elements; finally, the best thermal evaporation parameters are obtained which can meet each requirement of the film such as surface characteristics, thickness, texture, adhesiveness, soldering resistance, uniformity and the like so as to reach the effect of improving the coating film quality and reducing the cost.

Description

technical field [0001] The invention relates to the application of a thermal evaporation thin film deposition process to iron oxide, especially the application of the thermal evaporation thin film deposition process to iron oxide, which can improve the quality of thin film deposition and reduce costs under better efficiency utilization. Background technique [0002] In the field of mechanical industry, electronic industry or semiconductor industry, in order to give certain characteristics to the material used, it is often used to form a film (a thin film) on the surface of the material by various methods. If the film passes through the atomic layer When the process is formed, such thin film deposition is generally called evaporation treatment. When evaporation treatment is used, the evaporation particles are controlled at the atomic or molecular level to form a "film", so it is possible to obtain properties that cannot be obtained in a thermal equilibrium state. "Film" with ...

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Problems solved by technology

[0007] The soft magnetic core is surrounded by a shielding jig, only the position where the welding end needs to be coated is exposed, and then the soft magnetic core and jig are placed on the position of the vacuum sputtering substrate, and the raw material is bombarded with an electron beam, and the raw material is formed in a vacuum state. Multi-directional molecular movement to form metal layers of various raw materials on the surface of the shielding fixture and the welding end of the soft magnetic core. The film obtained by this electron beam sputtering has high uniformity and meets the requirements of environmental protection. To form three types of film, it is necessary Carry out the vacuuming process separately, that is to say, the number of processing processes is determined according to the number of coating layers, and cannot be completed at one time, resulting in prolonged processing time and increased manufacturing costs. At the same time, the overall equipment investment is high, raw material utilization rate is low, and production Low output efficiency and high fixture investment

[0008] The main raw material used in the soft magnetic core is formed by stamping and sintering of iron oxide powder. With the miniaturization requirements of electronic items in recent years, the miniaturization of the soft magnetic core is necessary, so the adhesion on the PCB substrate is very important. , the common soft magnetic core iron oxide is to plate silver (Ag) and nickel (Ni) elements on the surface of the soft magnetic core by wet electroplating and thin film deposition. The common problems are: peeling of the coating layer, poor Pad bonding, coating Some people use sputtering devices to improve the cost and other issues, but due to the long coating time and material costs, there are many problems in sputtering that are unacceptable

[0009] Since the production cost of vapor deposition is lower than that of sputtering, it is the focus and direction of future development, but the general adhesion of vapor deposition is weaker than that of sputtering, so if you are not familiar with the characteristics and process parameters of vapor deposition, it is very difficult. Difficult to achieve reduction in manufacturing costs

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