Preparation method of W-Cu electrical contact

A technology for electrical contacts and electrical contact materials, which is applied to circuits, electrical switches, electrical components, etc., can solve the problems of cumbersome operation, high consumption and high cost, and achieve the effect of reducing costs.
CN101667498AInactive Publication Date: 2010-03-10KUNMING UNIV OF SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNMING UNIV OF SCI & TECH
Publication Date
2010-03-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a preparation method of a tungsten-copper electrical contact which adopts the injection moulding process. The method comprises the following steps: placing tungsten powder, copper powder and trace element Ni, Co, Mn and Mo according to a certain ratio in a ball mill to perform ball milling, mixing the prepared alloy powders and binder to smelt, injecting to prepare the green body with an injection machine, defating and finally sintering to obtain the electrical contact. The consistency (relative theoretical density) of the contact which is sintered through the liquid phase sintering is more than 98%. The tungsten-copper electrical contact of the invention has the advantage that the contact has high conductivity, low contact resistance and good fusion welding resistance, electric arc burning loss resistance and thermal stability, the electrical contact with a complicated shape can be prepared through one-step forming process, no subsequent machining is needed, the continuous production can be realized, and the production cost can be greatly reduced.
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Description

technical field

[0001] The invention relates to a tungsten-copper composite material and an injection molding technology for preparing electric contacts. Background technique

[0002] Tungsten-copper composite materials not only have the characteristics of high plasticity, good electrical conductivity, and thermal conductivity of copper, but also have the characteristics of high strength, high hardness, and low expansion coefficient of tungsten. These unique comprehensive properties make tungsten-copper alloy widely used in electrical contacts, especially in the field of contacts and electrode materials of high-voltage and ultra-high-voltage switching appliances, and in microelectronics technology as microwave amplifier substrates, heat dissipation components and other electronic packages. Materials for thermal deposition of materials.

[0003] However, W-Cu is a typical non-miscible system, and the solubility of tungsten in liquid copper is extremely low, 10 at 1200 °C. 5...

Claims

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