Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate

A technology of silver powder and conductivity, which is applied in the fields of silver-containing powder and its preparation method, conductive paste using it and plastic substrates, which can solve the problem of poor adhesion, inability to provide universal and simple conductive paste, High surface energy, excellent storage stability, and excellent reproducibility

Active Publication Date: 2011-05-18
DIC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to express conductivity, all of them have a process of removing the protective agent that becomes an obstacle, so the application to relatively heat-resistant plastic substrates is limited.
In addition, since the interlayer adhesion between the plastic substrate and the metal is inherently poor, especially in order to extend to a flexible plastic wiring substrate, it is necessary to surface-treat the substrate or use a third component that functions as an anchor. However, it is not yet possible to provide a conductive paste with an excellent balance of properties including versatility and simplicity.

Method used

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  • Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate
  • Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate
  • Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0124] Hereinafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these Examples. In addition, unless otherwise specified, "%" means "mass %".

[0125] In the following examples, the instruments used are as follows.

[0126] 1 H-NMR: manufactured by JEOL Ltd., AL300, 300Hz

[0127] Particle size measurement: FPAR-1000 manufactured by Otsuka Electronics Co., Ltd.

[0128] TEM observation: manufactured by JEOL Ltd., JEM-2200FS

[0129] TGA measurement: manufactured by SII NANOTECHNOLOGY INC., TG / DTA6300

[0130] Plasma absorption spectrum: UV-3500 manufactured by Hitachi, Ltd.

[0131] Optical microscope: Fluorescence microscope BX60, manufactured by Olympus Optical Industries, Ltd.

[0132] Light scattering digital dust meter: REX Co., Ltd., M-3423

[0133] Volume resistivity: manufactured by Mitsubishi Chemical Corporation, low resistivity meter Loresta EP

[0134] DSC measurement: DSC7200 manufactured ...

Synthetic example 1

[0135] Synthesis Example 1 [Synthesis Example of Compound (X-1)]

[0136] In a nitrogen atmosphere, in a mixed solution of 20.0 g (10.0 mmol) of methoxypolyethylene glycol [Mn=2,000], 8.0 g (100.0 mmol) of pyridine, and 20 ml of chloroform, dropwise added methoxypolyethylene glycol [Mn=2,000] over 30 minutes while stirring on ice A chloroform (30 ml) solution containing 9.6 g (50.0 mmol) of p-toluenesulfonyl chloride was obtained. After completion of the dropwise addition, stirring was further performed at a bath temperature of 40° C. for 4 hours. After completion of the reaction, 50 ml of chloroform was added to dilute the reaction liquid. Next, it was washed successively with 100 ml of 5% aqueous hydrochloric acid solution, 100 ml of saturated aqueous sodium bicarbonate solution, and 100 ml of saturated saline solution, dried over magnesium sulfate, filtered, and concentrated under reduced pressure. The obtained solid was washed several times with hexane, filtered, and dri...

Embodiment 1

[0151] 10.0 g of silver oxide was added to 138.8 g of an aqueous solution using 0.592 g of the compound (X-1) obtained in Synthesis Example 1, and stirred at 25° C. for 30 minutes. Next, 46.0 g of dimethylethanolamine was gradually added with stirring. As a result, the reaction solution turned dark red and slightly exothermic, and was left to stand in this state and stirred at 25° C. for 30 minutes. Then, 15.2 g of a 10% ascorbic acid aqueous solution was gradually added with stirring. This temperature was maintained and stirring was continued for a further 20 hours, resulting in a dark red dispersion.

[0152] The obtained dispersion was sampled, and the peak of the plasmon absorption spectrum was confirmed at 400 nm by the visible absorption spectrum measurement of the 10-fold dilution liquid, and the formation of silver nanoparticles was confirmed. In addition, spherical silver nanoparticles were confirmed by TEM measurement. And when the silver content in the solid was m...

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Abstract

Disclosed are a powder containing not less than 95% by mass of silver nanoparticles having an average particle diameter of 2-50 nm and applications of the powder. The silver-containing powder containing silver nanoparticles is obtained by reducing a silver compound in the presence of a compound wherein a polyethylene glycol is bonded to a polyethylene imine having a specific molecular weight, and then condensing and drying the reduced product. A plastic substrate can be obtained by directly applying a conductive paste containing the powder onto a plastic base and then drying the resulting plastic base.

Description

technical field [0001] The present invention relates to a powder containing silver nanoparticles with an average particle diameter of 2 to 50 nm, and an application of the powder. Specifically, it relates to a silver compound obtained through reduction reaction, concentration, and drying steps of a silver compound in the presence of a specific compound. A silver-containing powder that is stable in a solid state, a conductive paste containing the silver powder, and a plastic substrate coated with the conductive paste are used. Background technique [0002] In order to develop high-integration, high-function, and small / thin information equipment, semiconductor microfabrication technology is further developed, and a highly reliable mounting technology that effectively utilizes and supports the microfabrication is required. Among the elemental technologies of this mounting technology are the production of metal microparticles and the fine wiring and connection technology used to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00B22F1/02B22F9/00C09C1/62C09C3/10H01B1/22H01B5/00B22F1/054B22F1/102
CPCB22F9/24H01B1/22B22F1/0062C01G5/00C01P2002/88C01P2004/64C01P2006/40C01P2004/03C01P2004/04C09C1/62B22F1/0018B82Y30/00C22C5/06B22F1/102B22F1/054
Inventor 高桥晓雄河村香李承泽金仁华松木光一郎梶井智代
Owner DIC CORPORATION
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