Halogen-free high-impedance soldering flux and preparation method

A high-impedance, flux technology, applied in the direction of welding equipment, welding media, manufacturing tools, etc., can solve the problem of reducing the surface insulation resistance of circuit boards and component pins, which cannot meet the high reliability requirements of high-end electronic products, and is difficult to meet the requirements of wireless Lead process brazing requirements and other issues to achieve the effect of improving spreading ability, non-conductive performance, promoting flow and spreading

Inactive Publication Date: 2012-07-11
广东中实金属有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, due to the increasing awareness of human environmental protection and the successive promulgation of lead prohibition laws, electronic packaging solder has gradually transitioned from traditional leaded solder to lead-free solder, of which Sn-Cu and Sn-Ag- Cu-based solders are recognized in the industry as better and commercialized lead-free solders. However, their melting point is 30-45°C higher than the 183°C of traditional Sn-Pb eutectic solders. Traditional Sn-Pb Flux for solder wire is difficult to meet the soldering requirements of lead-free process
[0004] To this end, major electronics manufacturing companies and solder manufacturers have devoted themselves to the research of highly active fluxes for lead-free solder, and have achieved remarkable results. They have developed a variety of fluxes for lead-free solder wires, but comprehensive analysis and research The patents for fluxes for lead-free solder wires that have appeared in China today found that most of the fluxes for lead-free solder wires in China currently use halogen-containing compounds or salts. However, this type of flux has a lot of halogen residues after soldering. The reliability of the use has brought great safety hazards, especially in the case of high temperature and high humidity, such as the high ambient temperature and high air humidity

Method used

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  • Halogen-free high-impedance soldering flux and preparation method
  • Halogen-free high-impedance soldering flux and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] raw material:

[0025] Polymerized rosin 92.70g, palmitic acid 2g, alkylphenol polyoxyethylene ether 0.5g, nonylphenol polyoxyethylene ether 0.5g,

[0026] Isooctylphenol polyoxyethylene ether 1g, hydroxybenzotriazole 0.1g, methylbenzotriazole 0.1g, triethylamine 0.1g and triethyl carbitol ether 3g.

[0027] Add 92.70g of polymerized rosin into the container, heat and stir until completely melted, then add 2g of hexadecanic acid, 0.5g of alkylphenol polyoxyethylene ether, 0.5g of nonylphenol polyoxyethylene ether, 1g of iso Octylphenol polyoxyethylene ether, 0.1g hydroxybenzotriazole, 0.1g methylbenzotriazole, 0.1g triethylamine and 3g triethyl carbitol ether, continue to stir for 30 minutes to make halogen-free high resistive flux.

Embodiment 2

[0029] raw material:

[0030] 48.5g of polymerized rosin, 40g of hydrogenated rosin, 2g of glutaric acid, 2g of adipic acid, 1g of dodecanoic acid, 0.5g of fatty alcohol polyoxyethylene ether, 0.5g of polyethylene glycol monoester, 0.5g of triethylamine, Triethylene glycol monobutyl ether 2g and triethyl carbitol ether 3g,

[0031] Add 48.5g of polymerized rosin and 40g of hydrogenated rosin into the container, heat and stir until completely melted, then add 2g of glutaric acid, 2g of adipic acid, 1g of dodecanoic acid, and 0.5g of fatty alcohol polyoxyethylene ether in sequence at 140°C , 0.5g polyethylene glycol monoester, 0.5g triethylamine, 2g triethylene glycol monobutyl ether and 3g triethyl carbitol ether, and continue to stir for 25 minutes to prepare a halogen-free high-impedance flux.

Embodiment 3

[0033] raw material:

[0034] Water white rosin 42.4g, polymerized rosin 20g, hydrogenated rosin 25g, suberic acid 3g, sebacic acid 3g, alkylphenol polyoxyethylene ether 0.2g, nonylphenol polyoxyethylene ether 0.3g, benzotriazole 0.05 g, 0.05 g of hydroxybenzotriazole, and 6 g of triethylene glycol ethyl ether.

[0035] Add 42.4g of water-white rosin, 20g of polymerized rosin, and 25g of hydrogenated rosin into the container, heat and stir until completely melted, and then add 3g of suberic acid, 3g of sebacic acid, and 0.2g of alkylphenol polyoxyethylene at a temperature of 150°C. ether, 0.3g nonylphenol polyoxyethylene ether, 0.05g benzotriazole, 0.05g hydroxybenzotriazole, 6g triethylene glycol ethyl ether, and continue to stir for 20 minutes to prepare a halogen-free high-impedance flux.

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Abstract

The invention relates to a halogen-free high-impedance soldering flux and a preparation method. The halogen-free high-impedance soldering flux is characterized by containing the following components according to weight: 2-8% of organic acid activating agent, 0.1-2% of non-ionic surface active agent, 3-8% of organic solvent having a high boiling point, 0.01-0.5% corrosion inhibitor and the balance of modified rosin. The preparation method comprises the following steps: adding modified rosin into a container for heating and stirring until the modified rosin is completely fused; adding the organic acid activating agent, the non-ionic surface active agent, the corrosion inhibitor and the organic solvent having a high boiling point in sequence at a temperature of 130-150 DEG C, and continuing to stir for 20-30 minutes to obtain the soldering flux. The halogen-free high-impedance soldering flux has excellent welding assisting effect to lead-free solder, is halogen-free, has no harm to health and environment, causes little splashing, has less residue after welding, has high insulation resistance on the surface, and ensures the advantage and effect of reliability of electronic products after welding.

Description

technical field [0001] The invention relates to a halogen-free high-impedance soldering flux, in particular to a halogen-free high-impedance soldering flux for lead-free solder wires, and belongs to the field of soldering materials for electronic and electrical products. [0002] The invention also relates to a preparation method of the halogen-free high-resistance soldering flux. Background technique [0003] In recent years, due to the increasing awareness of human environmental protection and the successive promulgation of lead prohibition laws, electronic packaging solder has gradually transitioned from traditional leaded solder to lead-free solder, of which Sn-Cu and Sn-Ag- Cu-based solders are recognized in the industry as better and commercialized lead-free solders. However, their melting point is 30-45°C higher than the 183°C of traditional Sn-Pb eutectic solders. Traditional Sn-Pb It is difficult for the flux used for solder wire to meet the soldering requirements ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 张新平黄家强马骁方喜波梁静珊陈锋
Owner 广东中实金属有限公司
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