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Acrylate hot melt adhesive composition and preparation method of hot melt adhesive by UV (ultraviolet) crosslinking

An acrylate and acrylate technology, which is applied in the preparation of UV cross-linked acrylate hot melt adhesives and the composition field of acrylate hot melt adhesives, can solve the problem of insufficient crosslinking degree, poor temperature resistance, and bonding strength. Less problems, to achieve the effect of good weather resistance, high heat resistance, excellent bonding performance

Active Publication Date: 2012-09-12
中新联科环境科技(安徽)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyacrylate neither crystallizes, nor does it have a large cohesive strength when cooled like traditional hot melt adhesives. At present, acrylate hot melt adhesives have insufficient crosslinking degree, low bonding strength, poor temperature resistance and high temperature. It is difficult to popularize and apply in the electronics industry due to defects such as hot pressing and easy overflow of glue.

Method used

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  • Acrylate hot melt adhesive composition and preparation method of hot melt adhesive by UV (ultraviolet) crosslinking
  • Acrylate hot melt adhesive composition and preparation method of hot melt adhesive by UV (ultraviolet) crosslinking
  • Acrylate hot melt adhesive composition and preparation method of hot melt adhesive by UV (ultraviolet) crosslinking

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preparation example Construction

[0023] The preparation method of UV cross-linked acrylate hot melt adhesive is characterized in that: in the method, the acrylate copolymer with ultraviolet photoinitiating functional group and copolyester are compounded to obtain a hot melt adhesive composition, and the composition is hot melt coated Partially cross-linked hot-melt adhesives are obtained by ultraviolet cross-linking.

[0024] The structural unit glycidyl methacrylate in the acrylate copolymer is 1-10%, the optimal ratio is 3-5%; the p-benzophenone containing vinyl group or (meth)acrylate group is 0.5-5% , the optimal ratio is 1-3%, the vinyl or (meth)acrylate group is mainly in the para position, and the (meth)acrylate group is connected to the benzene ring through a phenolic oxygen bond; other copolymerized structural units of the acrylate copolymer Also includes one or more of the following monomers, (meth) hydroxyethyl acrylate, (meth) hydroxypropyl acrylate, (meth) methyl acrylate, (meth) ethyl acrylate, ...

Embodiment 1

[0027] Take 42 parts of ethyl acrylate, 49 parts of butyl acrylate, and 3 parts of glycidyl methacrylate by weight percentage (the epoxy group is used to carry out chain extension reaction with the carboxyl group of the copolyester, and at the same time reduce the hydrolysis of the copolyester), 1 part of 4-vinyl-4-methoxybenzophenone (UV initiating group, generating free radicals after cleavage), 5 parts of isooctyl acrylate, 150 parts of solvent ethyl acetate and initiator azobisisobutyl Nitrile 0.5 parts. Put the materials into a four-necked flask, which is equipped with a thermometer, reflux condenser, agitator and nitrogen conduit temperature, and the system is copolymerized at 62°C for 6 hours under the protection of nitrogen, and then copolymerized at 76°C for 8 hours to obtain 40% solid content of the acrylate copolymer solution. Then, the copolymer solution was coated to a thickness of 0.150 mm with a spatula under dark conditions, and then the solvent and residual m...

Embodiment 2

[0029] Take 42 parts of ethyl acrylate, 47 parts of butyl acrylate, 3 parts of glycidyl methacrylate, 3 parts of 4-vinyl-4-methoxybenzophenone, 5 parts of isooctyl acrylate, solvent 150 parts of ethyl acetate and 0.4 parts of initiator azobisisobutyronitrile. Adopt the technique of embodiment 1 to make copolymer adhesive film. The measured weight-average molecular weight of the acrylate copolymer was 290,000 g / mol, the glass transition temperature was -25°C, and the melt viscosity was 31 Pa.S at 160°C. Wherein in the solid, the weight content of glycidyl methacrylate is 3%, the weight content of 4-vinyl-4-methoxybenzophenone is 3%, and the weight content of initiator azobisisobutyronitrile is 0.4%.

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Abstract

The invention belongs to the technical field of a hot melt adhesive, and particularly relates to an acrylate hot melt adhesive composition and a preparation method of a hot melt adhesive by UV (ultraviolet) crosslinking. The composition of the acrylate hot melt adhesives comprises the following components based on weight content ratio: 9-90% of acrylate copolymer, 9-90% of copolyester and 0.1-1% of antioxidant. The preparation method of the hot melt adhesive by UV crosslinking comprises the following specific steps of: polymerizing at least one of acrylate monomer bodies; and adding the composition into a double-screw extruder to carry out high-speed mixing, in-situ grafting, compatibilization and chain extension, coating a base material by means of hot melting at the temperature of 130-160 DEG C, carrying out ultraviolet light crosslinking, and packing in a rolling way. The preparation method has the benefit effects that part of hot melt adhesive is crosslinked by means of UV crosslinking, so that the cohesive strength of the hot melt adhesive can be improved, and the glue-overflowing performance can be resistant, and the joint strength can be improved. Meanwhile, the hot melt adhesive provided by the invention is further added with copolyester with equivalent quantity besides the main body resin, and the higher wettability, cohesive strength and heat resistance, and good weather fastness can be obtained due to the introduction of the copolyester.

Description

technical field [0001] The invention belongs to the technical field of hot-melt adhesives, and in particular relates to a composition of acrylate hot-melt adhesives and a preparation method of UV cross-linked acrylate hot-melt adhesives. Background technique [0002] Hot Melt Adhesive (Hot Melt Adhesive) is a multi-component mixture based on thermoplastics. It is applied to the surface of the substrate in the form of melt for bonding. It is solid at room temperature and melts into a liquid state after heating. Coating , After being wetted and bonded, after pressing and cooling, the bonding can be achieved in a few seconds or even less. Unlike thermosetting, solvent-based, and water-based adhesives, hot-melt adhesives do not contain any solvents, will not cause pollution due to solvent volatilization, do not need heating and cross-linking, and have no drying process. They are easy to use and can be made into blocks, films, Strip or granular form makes packaging, storage, tra...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J133/10C09J167/06C09J7/00
Inventor 任耀彬刘学习张立伟吴文明
Owner 中新联科环境科技(安徽)有限公司
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