Recycling processing technology for waste circuit board

A waste circuit board and process technology, which is applied in the field of waste resource treatment, recycling and reuse technology, can solve the problems of non-recycling, low output, long leaching time, etc., to achieve resource regeneration and recycling, reduce energy consumption and pollution, Reduce the effect of mining

Active Publication Date: 2012-09-19
NINGBO HUILONG MACHINERY CO LTD
View PDF6 Cites 43 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are two main methods for processing circuit boards. One is chemical method, which is to remove plastic components and other organic substances in waste circuit boards through combustion, roasting, sintering, melting, thermal analysis and reaction in high temperature gas phase. common method for extracting precious metals and base metals, but the organic components in this chemical method are lost due to volatilization and slagging, while the recovery of metals such as tin, platinum, aluminum and zinc is very low or almost impossible Recycle
In addition, this chemical treatment method has a low degree of automation, and the high-temperature metallurgical process involved will generate a large amount of waste gas, waste residue a

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Recycling processing technology for waste circuit board
  • Recycling processing technology for waste circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be described in detail below with reference to the above-mentioned drawings and specific embodiments.

[0024] Such as figure 1 As shown, the waste circuit board treatment and recycling process mainly includes the following steps:

[0025] ⑴Scrap cutting: use a semi-automatic cutting machine to cut waste circuit boards, and initially separate electronic components from the substrate;

[0026] ⑵Manual sorting: the substrates with some electronic components left after the preliminary separation in step 1 are manually removed;

[0027] (3) Degolding: The electronic components collected in step 1 and step 2 are separated into gold, silver, aluminum, plastic and resin for preservation through degolding equipment, and platinum and palladium will also be separated from them according to the composition of electronic components , zinc and other precious metals;

[0028] (4) Detinning: Put the substrate after removing the electronic components in st...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a recycling processing technology for a waste circuit board and relates to the recycling processing technology for waste resources. The recycling processing technology comprises the following steps of: cutting wastes; manually separating; removing gold; removing tin; primarily crushing; magnetically separating; secondarily crushing; separating by vibrating; separating through airflow; crushing pellets; separating according to specific gravity; compounding plastic and wood; and lastly, respectively recycling the matters, such as gold, silver, aluminum, iron, tin, copper, lead, plastic and resins, thereby reusing the matters. The recycling processing technology has the advantages that: (1) the flow line production operation is realized, the degree of automation is high and the yield is high; (2) compared with the traditional processing method, the recycling processing technology effectively reduces the emission of toxic gas and water and improves the environmental protection index; and (3) various matters in the waste circuit board are more effectively separated, the noble metal is recycled, the recycling of resources is realized, the mineral resource exploitation and wood felling are indirectly reduced, and the energy consumption and pollution during the processes of mineral resource exploitation and metallurgy processing are reduced.

Description

technical field [0001] The invention relates to a process for processing, recycling and reusing waste resources, in particular to a process for processing and recycling waste circuit boards. Background technique [0002] At present, the replacement cycle of electronic products is continuously shortened. A large number of electronic products are scrapped after reaching the end of their service life and become electronic waste. Among them, circuit boards are the most difficult parts to handle. pollute. The composition of circuit boards usually contains a large amount of renewable metals, such as copper, iron, lead, tin, nickel, etc., as well as precious and rare metals such as gold, silver, platinum, palladium, non-metallic plastics, rings, etc. Oxygen resin, phenolic resin, glass fiber, etc. At present, there are two main methods for processing circuit boards. One is chemical method, which is to remove plastic components and other organic substances in waste circuit boards ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B09B3/00B09B5/00B07B15/00
CPCY02W30/20Y02W30/78Y02W30/82
Inventor 陈戍寅
Owner NINGBO HUILONG MACHINERY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products