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Thermosetting resin composition as well as prepreg and laminated board manufactured by utilizing same

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., and can solve the problems of decreased moisture and heat resistance and dielectric properties, increased water absorption of cured products, poor anhydride reactivity, etc. problem, to achieve the effect of reducing the dielectric constant and dielectric loss, increasing the glass transition temperature, and excellent dielectric properties

Active Publication Date: 2014-08-20
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such as amines, phenolic resins and other curing agents containing active hydrogen in their molecular structure, there are a large number of hydroxyl groups in the cured epoxy resin, which will lead to an increase in the water absorption rate of the cured product, and a decrease in moisture and heat resistance and dielectric properties.
Although there is no hydroxyl group in the epoxy resin cured by acid anhydride, the reactivity of the anhydride is poor, and the curing conditions required are harsh.

Method used

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  • Thermosetting resin composition as well as prepreg and laminated board manufactured by utilizing same
  • Thermosetting resin composition as well as prepreg and laminated board manufactured by utilizing same
  • Thermosetting resin composition as well as prepreg and laminated board manufactured by utilizing same

Examples

Experimental program
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Effect test

Embodiment and

[0034] Examples and comparative examples:

[0035] Examples 1 to 3 are the synthesis of the active ester resin of the present invention, Comparative Examples 1 to 2 are the synthesis of ordinary phenolic type active ester resins, Examples 4 to 8 and Comparative Examples 3 to 4 are the preparation and physical property evaluation of thermosetting resin compositions . Unless otherwise specified below, "parts" means "parts by weight", and "%" means "% by weight".

Embodiment 1

[0037] Put N-(4-hydroxyphenyl)maleimide (40g, 0.21mol), phenol (160g, 1.70mol) and oxalic acid (10g) into the flask equipped with thermometer, condenser and stirrer, mix and stir After uniformity, place it in a constant temperature water bath at 70°C; then, with stirring, add formaldehyde solution (125 mL, phenol / aldehyde ratio 1 / 0.8) to the flask dropwise over 0.5 hours. After the formaldehyde is added, the temperature and stirring conditions are maintained at 70°C to react for 15 hours. Then, the reaction product was dissolved and diluted with 400 mL of acetone, and then the reaction product was precipitated with a 40% methanol aqueous solution. Repeat the above dissolution-precipitation operation 3 to 5 times, filter, separate, and dry to obtain a pure nitrogen-containing polyfunctional phenol compound.

[0038] Take 130 g of the polyfunctional phenol compound prepared by the above method and 500 g of the methyl isobutyl ketone solvent and put them in a flask to fully mix and...

Embodiment 2

[0043] Put N-(4-hydroxyphenyl)maleimide (80g, 0.42mol), phenol (120g, 1.28mol) and oxalic acid (10g) into a flask equipped with thermometer, fractionator, condenser, and stirrer , After mixing and stirring, place in a constant temperature water bath at 70°C. Then, under stirring, a formaldehyde solution (110 mL, 37% aqueous formaldehyde solution, phenol / aldehyde ratio 1 / 0.8) was added dropwise to the flask over 0.5 hours. After the formaldehyde is added, the temperature and stirring conditions are maintained at 60°C to react for 15 hours. Next, the reaction product was dissolved and diluted with 500 mL of acetone, and then the reaction product was precipitated with a 40% methanol aqueous solution. Repeat the above dissolution-precipitation operation 3 to 5 times, filter, separate, and dry to obtain a pure nitrogen-containing polyfunctional phenol compound.

[0044] Take 142 g of the polyfunctional phenol compound prepared by the above method and 600 g of the methyl isobutyl ket...

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PUM

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following components in parts by solid weight: (a) 20-40 parts of active ester resin; (b) 30-50 parts of epoxy resin; (c) 20-60 parts of cyanate ester resin. A laminated board manufactured by adopting the thermosetting resin composition has excellent dielectric property, dielectric constant and dielectric loss are greatly reduced compared with those in the prior art, and the laminated board can show extremely low dielectric constant and low dielectric loss tangent in a high-speed and high-frequency signal transmission process. The thermosetting resin composition has an obvious effect and positive practical significance.

Description

Technical field [0001] The invention relates to a thermosetting resin composition, and a semi-cured sheet and a laminate made of the resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of information processing and information transmission high-speed and high-frequency technology, higher and higher requirements have been placed on the dielectric properties of printed circuit board materials. To put it simply, the printed circuit board material needs to have a low dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, and interference between signals. Therefore, it is desirable to provide a thermosetting resin composition, a printed circuit board material made of this thermosetting resin composition can exhibit a sufficiently low low dielectric constant and low dielectric constant in the high-speed and high-fre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08G59/40C08J5/24B32B27/04B32B15/092
Inventor 何继亮崔春梅马建易强沈磊
Owner SHENGYI TECH SUZHOU
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