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Preparation method for nano silicon dioxide modified organic silicon sealant for packaging of light emitting diode (LED)

A technology of nano-silicon dioxide and LED packaging, which is applied in the direction of chemical instruments and methods, adhesives, and other chemical processes, can solve the problems of brightness attenuation, high price, poor bonding force, etc., and achieve the improvement of refractive index and light transmittance, The operating conditions are easy to control and the effect of improving compatibility

Inactive Publication Date: 2014-10-01
江苏华程光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But combined with the three mainstream LED packaging materials in the current market, although epoxy resin packaging materials have advantages in light transmission and cost, they are slightly insufficient in terms of brightness attenuation, UV resistance, and heat resistance.
Silicone resin is better than epoxy resin in terms of heat resistance, UV resistance and brightness attenuation, and it is better combined with epoxy resin without interface problems. It is more suitable for white light and some low-attenuation packages (such as display screen, circuit board, junction box, etc.), the price is relatively expensive
Compared with the former two, silica gel has great advantages in anti-UV, heat resistance and brightness attenuation. It is especially suitable for high-power LED products and some low-attenuation and white light products, but the disadvantage is that the bonding force is poor, and Epoxy bonding is prone to interface problems, easy to absorb moisture, and poor dust resistance
[0004] In a high temperature environment, the packaging material may cause carbonization and form a brown coating on the surface of the device, resulting in device failure

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A preparation method of nano silicon dioxide modified silicone sealant for LED packaging, the specific steps of the method are as follows:

[0025] 1) Nano-silica modification treatment: Dissolve a certain amount of silica and γ-aminopropyltriethoxysilane in an appropriate amount of benzene at a mass ratio of 100:1.00, and heat it at 110°C-150°C under constant stirring. Heating to reflux at ℃ for 3-8h, then cooling, and drying in an oven to volatilize the remaining benzene;

[0026] 2) Preparation of modified silicone silica gel: Add the mixture of methylphenyldichlorosilane and modified silicon dioxide to a mixed solvent composed of toluene and water, and hydrolyze it for 24 hours at a temperature of T=40°C. After the reaction, , standing and layering to get the upper layer liquid, washing the upper layer liquid with deionized water to neutrality to obtain a hydrolyzate silanol toluene solution;

[0027] 3) Add a certain amount of toluene solution to dilute the silano...

Embodiment 2

[0030] A preparation method of nano silicon dioxide modified silicone sealant for LED packaging, the specific steps of the method are as follows:

[0031] 1) Nano-silica modification treatment: mix a certain amount of silica with γ-aminopropyltrimethoxysilane and N-β-aminoethyl-γ-aminopropylmethyltrimethoxysilane in mass ratio 100:1.00 was dissolved in an appropriate amount of toluene, heated and refluxed at 110°C-150°C for 3-8h under constant stirring, then cooled, and dried in an oven to evaporate the remaining toluene;

[0032] 2) Preparation of modified silicone silica: Add the mixture of phenyltrichlorosilane and modified silicon dioxide to a mixed solvent composed of toluene and water, and hydrolyze it for 24 hours at a temperature of T=40°C. After the reaction, statically Put the layers and take the upper layer liquid, wash the upper layer liquid with deionized water to neutrality, and obtain the hydrolyzate silanol toluene solution;

[0033] 3) Add a certain amount of...

Embodiment 3

[0036] A preparation method of nano silicon dioxide modified silicone sealant for LED packaging, the specific steps of the method are as follows:

[0037] 1) Nano-silica modification treatment: a certain amount of silicon dioxide, 2-ethyltrimethoxysilane and 3-ethyltrimethoxysilane are dissolved in an appropriate amount of xylene at a mass ratio of 100:1.00. Heat and reflux at 110°C-150°C for 3-8h under constant stirring, then cool and dry in an oven to evaporate the remaining xylene;

[0038]2) Preparation of modified silicone silica gel: add a mixture of methylphenyldichlorosilane, phenyltrichlorosilane, methylvinyldichlorosilane, dimethyldichlorosilane and modified silicon dioxide to toluene and In a mixed solvent composed of water, hydrolyze for 24 hours under the condition of temperature T=40°C, after the reaction is completed, stand and separate layers to take the upper liquid, wash the upper liquid with deionized water until neutral, and obtain the hydrolyzed product si...

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PUM

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Abstract

The invention relates to a preparation method for a nano silicon dioxide modified organic silicon sealant for packaging of a light emitting diode (LED). As silane coupling agent modified nano silicon dioxide is added into chlorosilane hydrolysis and polycondensation system, the compatibility of the nano silicon dioxide and organic silicon resin is sharply improved; a small quantity of curing agent, catalyst and defoaming agent are added, the mixture is mixed uniformly and then is cured at room temperature so as to prepare the nano silicon dioxide modified organic silicon sealant. The preparation method is simple, has low cost, and can prepare a series of high refractive index and high transmittance packaging sealants for multiple LED electron components, and the operation conditions are easy to control.

Description

technical field [0001] The invention relates to a preparation method of an organosilicon sealant, in particular to a preparation method of a nano-silicon dioxide-modified organosilicon sealant for LED packaging. Background technique [0002] After decades of development, power light-emitting diodes (Light Emitting Diode, LED) are widely used in large-area graphic display full-color screens, status indication, sign lighting, signal display, backlight of liquid crystal displays, automobile combination taillights and vehicle Internal lighting etc. LED has the advantages of energy saving, environmental protection, safety, long life, low consumption, low heat, shockproof, waterproof, miniature, high brightness, easy dimming, concentrated beam and reduced maintenance, etc. After the fourth generation of light source. [0003] Generally speaking, LED packaging materials are as follows: epoxy resin, silica gel, silicone resin. However, considering the three mainstream LED packagi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J11/04C08L83/04C08K9/06C08K3/36C09K3/10H01L33/56
Inventor 严加彬
Owner 江苏华程光电科技有限公司
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