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Nanometer rare earth thick-film electronic paste and preparing method thereof

A technology of electronic paste and nano-rare earth, which is applied in metal processing equipment, transportation and packaging, etc., can solve the problems of inconvenient application, poor product performance stability, long sintering time, etc., and achieve good conductive heating effect and good solderability , the effect of short sintering time

Active Publication Date: 2016-06-01
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional electric heating sources are generally large in size, low in energy efficiency utilization, and inconvenient in application, making it difficult to meet the needs of modern industry and life
[0003] The use of thick film heating technology is gradually being promoted in China, but it can only be conducted and convected as the main heat transfer method, and the product performance stability is poor, and the temperature of the heating element itself is very high, so there are great limitations in the application range and base material selection.
[0004] As the core material of thick film heating technology, thick film electronic paste plays a very important role in thick film heating technology; however, for the existing thick film electronic paste, it generally has high sintering temperature and sintering time. Defects with long length, high square resistance, poor adhesion and poor weldability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment 1, a nano-rare earth thick film electronic paste, including the following materials by weight, specifically:

[0048] Inorganic binder phase 3%

[0049] Organic solvent carrier 20%

[0050] Ruthenium dioxide 4%

[0051] Lanthanum oxide or Yttrium oxide 3%

[0052] 70% high-purity nano-silver powder;

[0053] The inorganic binder phase includes the following materials by weight, specifically:

[0054]Bismuth trioxide 35%

[0055] Silica 50%

[0056] Aluminum oxide 15%;

[0057] The organic solvent carrier includes the following materials by weight, specifically:

[0058] Ethyl cellulose mixture 90%

[0059] Thickener 5%

[0060] Thixotropic agent 3%

[0061] Defoamer 2%;

[0062] Ethyl cellulose mixed liquor comprises the following materials by weight, specifically:

[0063] Organic solvent 50%

[0064] Ethylcellulose 50%.

[0065] It should be further pointed out that the particle size of the inorganic binder phase is 500nm-900nm, and the organi...

Embodiment 2

[0067] Embodiment 2, a nano-rare earth thick film electronic paste, including the following materials by weight, specifically:

[0068] Inorganic binder phase 5%

[0069] Organic solvent carrier 30%

[0070] Ruthenium dioxide 5%

[0071] Lanthanum oxide or Yttrium oxide 5%

[0072] High-purity nano-silver powder 55%;

[0073] The inorganic binder phase includes the following materials by weight, specifically:

[0074] Bismuth trioxide 40%

[0075] Silica 40%

[0076] Aluminum oxide 20%;

[0077] The organic solvent carrier includes the following materials by weight, specifically:

[0078] Ethyl cellulose mixture 95%

[0079] Thickener 2%

[0080] Thixotropic agent 2%

[0081] Defoamer 1%;

[0082] Ethyl cellulose mixed liquor comprises the following materials by weight, specifically:

[0083] Organic solvent 60%

[0084] Ethylcellulose 40%.

[0085] It should be further pointed out that the particle size of the inorganic binder phase is 500nm-900nm, and the organ...

Embodiment 3

[0087] Embodiment 3, a method for preparing nano-rare earth thick film electronic paste, including the following process steps, specifically:

[0088] a. Preparation of inorganic bonding phase: put bismuth trioxide, silicon dioxide, and aluminum oxide in a planetary ball mill for grinding. The grinding time is 10 hours to 12 hours. After the inorganic bonding phase After the mixed material is ground, pass the inorganic binder phase mixture through a 1000-mesh ultrasonic vibrating sieve to obtain an inorganic binder phase with a particle size of 500nm-900nm, wherein bismuth trioxide, silicon dioxide, aluminum oxide The parts by weight of the three materials are 20%-40%, 40%-60%, 10%-20%;

[0089] b. Preparation of ethyl cellulose mixture: dissolve the organic solvent and ethyl cellulose in a water bath at 60°C-80°C for 2 hours to 5 hours. After the dissolution is completed, the ethyl cellulose mixture is obtained. Among them, the organic solvent The parts by weight of the two ...

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Abstract

The invention discloses nanometer rare earth thick-film electronic paste and a preparing method thereof. The nanometer rare earth thick-film electronic paste comprises an inorganic bonding phase, an organic solvent carrier, ruthenium dioxide, lanthanum oxide or yttrium oxide and high-purity nanometer silver powder. The inorganic bonding phase comprises bismuth trioxide, silica and aluminum oxide. The organic solvent carrier comprises an ethyl cellulose mixed solution, a thickening agent, a thixotropic agent and an antifoaming agent. The ethyl cellulose mixed solution comprises an organic solvent and ethyl cellulose. By means of the above material ratio, the nanometer rare earth thick-film electronic paste is low in sintering temperature, short in sintering time, low in resistance per square, good in adhesive force, good in electric conduction heating effect and good in weldability. The preparing method of the nanometer rare earth thick-film electronic paste includes the following technological steps that firstly, the inorganic bonding phase is prepared; secondly, the ethyl cellulose mixed solution is prepared; thirdly, the organic solvent carrier is prepared; and fourthly, the nanometer rare earth thick-film electronic paste is prepared. By means of the preparing method, the nanometer rare earth thick-film electronic paste can be effectively prepared.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a nanometer rare earth thick-film electronic paste and a preparation method thereof. Background technique [0002] Electric heating materials are materials that utilize the thermal effect of electric current. Metal electric heating materials mainly include noble metals (Pt), high-temperature melting point metals (W, Mo, Ta, Nb) and their alloys, nickel-based alloys and iron-aluminum alloys. The most widely used metal electric heating The materials are mainly nickel-chromium alloy and iron-aluminum alloy. Metal electric heating materials mainly include silicon carbide, lanthanum chromate, zirconia, molybdenum disilicide, etc. It has the advantages of high temperature resistance, corrosion resistance, oxidation resistance, and high electrothermal conversion efficiency, and is gradually replacing metal electrothermal materials. Traditional electric heat sources are ge...

Claims

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Application Information

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IPC IPC(8): B22F1/00B22F9/04
CPCB22F9/04B22F2009/041B22F1/105B22F1/054
Inventor 苏冠贤张念柏
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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