Flexible zinc oxide schottky diode and its preparation method
A technology of Schottky diodes and zinc oxide, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, semiconductor devices, etc., can solve problems such as multi-crystal grains and interfaces, device stability consistency, and poor flexibility. Achieve the effects of less intercrystalline interface, avoid device working stability, and simple process
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Embodiment 1
[0023] This embodiment provides a method for preparing a flexible zinc oxide Schottky diode, comprising the following steps:
[0024] Dissolving zinc nitrate hexahydrate in methoxyethanol to prepare a zinc nitrate organic solution with a zinc ion molar concentration of 0.1 mol / L; then slowly adding acetylacetone of the same molar amount as the zinc ion to the zinc nitrate organic solution for magnetic stirring After 2 hours, a clear and transparent solution A was formed;
[0025] Dissolve polytetravinylphenol in 2-methoxyethanol solution and magnetically stir for 2 hours to form a polytetravinylphenol organic solution with a mass concentration of 20 g / L; Adding the polytetravinylphenol organic solution to the clear and transparent solution A for magnetic stirring for 4 hours to obtain the precursor solution;
[0026] The precursor solution is dropped on the ITO conductive layer with a polyethylene flexible substrate, spin-coated with a desktop coater for 30 seconds, the rotat...
Embodiment 2
[0032] This embodiment provides a method for preparing a flexible zinc oxide Schottky diode. The specific steps are roughly the same as those in Embodiment 1, except that:
[0033] In this embodiment, zinc nitrate is used as a solute and methoxyethanol as a solvent to configure a zinc nitrate organic solution with a zinc ion concentration of 0.15 mol / L, and then glycine and The urea was magnetically stirred for 3 hours to form the clear and transparent solution A.
[0034] The structure of the flexible ZnO Schottky diode prepared by the above preparation method in this embodiment is the same as that in Embodiment 1.
Embodiment 3
[0036] This embodiment provides a method for preparing a flexible zinc oxide Schottky diode. The specific steps are roughly the same as those in Embodiment 1, except that:
[0037] In this embodiment, the precursor solution is spin-coated on the ITO conductive layer of the flexible substrate, heat treated at 250° C. for 15 minutes, and the above steps of spin coating and heat treatment are repeated to form a 200-nm-thick polycarbonate layer on the ITO conductive layer. Vinylphenol hybrid ZnO films were annealed at 250°C for 5 hours.
[0038]The structure of the flexible ZnO Schottky diode prepared by the above preparation method in this embodiment is the same as that in Embodiment 1.
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