A kind of p-type cumino amorphous oxide semiconductor film and preparation method thereof
A technology of amorphous oxide and semiconductor, applied in semiconductor/solid-state device manufacturing, semiconductor devices, transistors, etc., to achieve the effect of promoting development, good material characteristics, and good performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0028] (1) with high-purity Cu 2 O, Al 2 o 3 and In 2 o 3 The powder is used as the raw material, mixed, ground, and sintered in an Ar atmosphere at 1000°C to make a CuAlInO ceramic sheet as the target, where the atomic ratio of Cu, Al, and In is 1:0.2:0.8;
[0029] (2) Using the pulsed laser deposition (PLD) method, install the substrate and the target in the PLD reaction chamber, and evacuate to a vacuum degree of 9×10 -4 Pa;
[0030] (3) Pass into O 2 As the working gas, the gas pressure is 7Pa, the substrate temperature is 25°C, the target is bombarded with pulsed laser, the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film, and p-type CuAl is obtained. 0.2 In 0.8 o 2 Amorphous thin film.
[0031] Using quartz as the substrate, p-type CuAl was prepared according to the above growth steps 0.2 In 0.8 o 2 The film was tested for its structure, electrical and optical properties. The test results are: the ...
Embodiment 2
[0034] (1) with high-purity Cu 2 O, Al 2 o 3 and In 2 o 3 The powder is used as the raw material, mixed, ground, and sintered in an Ar atmosphere at 1050°C to make a CuAlInO ceramic sheet as the target, where the atomic ratio of Cu, Al, and In is 1:0.5:0.5;
[0035] (2) Using the pulsed laser deposition (PLD) method, install the substrate and the target in the PLD reaction chamber, and evacuate to a vacuum degree of 9×10 -4 Pa;
[0036] (3) Pass into O 2 As the working gas, the gas pressure is 10Pa, the substrate temperature is 300°C, the target is bombarded with pulsed laser, and the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film. 2 Naturally cooled to room temperature in the atmosphere to obtain p-type CuAl 0.5 In 0.5 o 2 Amorphous thin film.
[0037] Using quartz as the substrate, p-type CuAl was prepared according to the above growth steps 0.5 In 0.5 o 2 The film was tested for its structure, elec...
Embodiment 3
[0040] (1) with high-purity Cu 2 O, Al 2 o 3 and In 2 o 3 The powder is used as the raw material, mixed, ground, and sintered in an Ar atmosphere at 1100°C to make a CuAlInO ceramic sheet as the target, where the atomic ratio of Cu, Al, and In is 1:0.8:0.2;
[0041] (2) Using the pulsed laser deposition (PLD) method, install the substrate and the target in the PLD reaction chamber, and evacuate to a vacuum degree of 9×10 -4 Pa;
[0042] (3) Pass into O 2 As the working gas, the gas pressure is 13Pa, and the substrate temperature is 600°C. The target is bombarded with pulsed laser, and the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film. 2 Naturally cooled to room temperature in the atmosphere to obtain p-type CuAl 0.8 In 0.2 o 2 Amorphous thin film.
[0043] Using quartz as the substrate, p-type CuAl was prepared according to the above growth steps 0.8 In 0.2 o 2 The film was tested for its structure, ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com


