The invention discloses a transparent electronic carrier tape co-
extrusion molding production method of a PC modified material, and belongs to the technical field of
high polymer materials, and the method comprises the following steps: step 1, preparing an antistatic PC modified material, step 2, preparing an adsorption PC modified material, and step 3, co-
extrusion molding. The transparent electronic carrier tape with the double-layer structure and the anti-static layer and the adsorption layer is prepared through the co-
extrusion molding technology, the anti-static layer on one side of the carrier tape has the permanent anti-static characteristic, the surface resistance is stable, the carrier tape does not depend on the environment
humidity, is resistant to abrasion and does not separate out, reliable electrostatic protection is provided for electronic components, and the adsorption layer on the other side can actively adsorb
oxygen and
moisture; according to the carrier tape, the components are effectively prevented from being oxidized and rusted due to
package damage in the storage process, the requirement for the storage environment is greatly lowered, the overall light
transmittance of the carrier tape is high,
visual inspection of the packaged components is achieved, the whole product is
environmentally friendly and free of
pollution, and materials are stable, free of degradation and excellent in comprehensive performance in the production process.