Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polymer film, and preparation method and application thereof

A technology of polymer film and resin film, which is applied in the field of polymer film and its preparation, can solve the problems of poor heat sealing performance, complicated process and poor abrasion resistance of packaging materials

Inactive Publication Date: 2017-09-12
SHANGHAI TECHSUN ANTI COUNTERFEITING TECH HLDG
View PDF3 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the weak porous layer of the three-dimensional network structure formed by the hydrophobic oxide particles in the prior art, which is easily damaged during use and loses hydrophobicity and extremely poor abrasion resistance, " Filling particles" cannot well protect the three-dimensional network structure formed by hydrophobic oxide particles, and the process is complicated, the cost is high, and the defects of the obtained packaging material are poor in heat sealing, and a polymer film and its preparation method and application are provided.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polymer film, and preparation method and application thereof
  • Polymer film, and preparation method and application thereof
  • Polymer film, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Use a laser engraving machine to engrave a spherical concave spherical array with a micron-scale convex spacing w=100 μm, a bottom surface diameter D=450 μm, a spherical height d=80 μm, and a honeycomb arrangement on a cylindrical steel roller to obtain an embossing roller .

[0068] The substrate is aluminum foil with a thickness of 16 μm; the molding resin is thermoplastic polyethylene film with a thickness of 60 μm, and the film raw material is Daqing Petrochemical 18D low-density polyethylene resin; the nanoparticles are fumed silica particles AEROSIL R812, with an average particle size of 7nm .

[0069] The polymer film was prepared as follows:

[0070] (1) After the base material and molding resin are compounded with polyurethane adhesive, they are cured in a drying room at 50°C for 24 hours to obtain a composite film; the embossing roller is heated to 120°C, and the obtained composite film is pressed at 5MPa Printing, get spherical body micron-scale projection ...

Embodiment 2

[0074] Use the mechanical scribing method to engrave a regular quadrangular pyramid on the cylindrical steel roller with a micron-scale convex spacing w=30μm, a bottom side length D=150μm, a cone height d=50μm, and a concave regular quadrangular pyramid structure arranged in a square. printing roller.

[0075] The substrate is aluminum foil with a thickness of 12 μm; the thermoplastic resin is polypropylene with a thickness of 70 μm; the nanoparticles are fumed silica particles AEROSIL R812S with an average particle size of 7 nm.

[0076] The polymer film was prepared as follows:

[0077] (1) Polypropylene is cast on the base material, and at the same time, the above-mentioned embossing roller is used to emboss the surface of the composite film cast, and the casting speed is controlled to make the total thickness of the polypropylene with micron-scale convex structure Be 70 μm, get the microstructure concave-convex film (see figure 2 );

[0078] (2) Disperse the fumed sili...

Embodiment 3

[0081] Use a photolithography machine to photoetch a spherical micro-scale convex micro-spherical lens array with a pitch w=10 μm, a bottom surface diameter D=50 μm, and a spherical height d=20 μm arranged in a honeycomb shape on a planar photoresist plate, and then use The LIGA technology replicates the structure on a metal nickel plate with a thickness of 80 microns, and pastes the metal nickel plate on a steel roller with double-sided adhesive to obtain an embossing roller.

[0082]The substrate is aluminum foil with a thickness of 16 μm; the thermoplastic resin is a polyethylene film with a thickness of 30 μm; the nanoparticles are fumed silica particles AEROSIL R812S with an average particle size of 7 nm.

[0083] The polymer film was prepared as follows:

[0084] (1) After the base material and molding resin are compounded with polyurethane adhesive, they are cured in a drying room at 50°C for 24 hours to obtain a composite film; the embossing roller is heated to 120°C a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
heightaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a polymer film, a preparation method and application thereof. The polymer film comprises a substrate layer and a molding resin layer, the molding resin layer is attached to the substrate layer; the side of the molding resin layer away from the substrate layer has several micron-scale protrusions, and the width of the bottom surface of the micron-scale protrusions is 50 μm to 2000 μm , the height of the micron-scale protrusions is 20 μm to 1000 μm, and the distance between two adjacent micron-scale protrusions is 10 μm to 500 μm; the polymer film also includes a nanoparticle layer, and the average particle size of the nanoparticles in the nanoparticle layer is 3 to 150nm ; The nanoparticle layer is attached to the surface of the molding resin layer having micron-scale protrusions. The three-dimensional network structure formed by the nanoparticles of the polymer film between micron-scale protrusions has good stability and fastness. The polymer film has good hydrophobicity, good touch resistance and abrasion resistance, and is heat-sealable. Good features. The preparation method has simple process and low cost.

Description

technical field [0001] The invention relates to a polymer film and its preparation method and application. Background technique [0002] In our daily life, we often come into contact with items with relatively high viscosity, such as salad dressing, tomato sauce, and facial cleanser. The biggest annoyance of using these items is that they cannot be fully utilized, and a large part will remain on the packaging materials due to stickiness, causing unnecessary waste. Taking the common liquid sauce as an example, the waste caused by sticky residue accounts for 10% to 20% of the total. Developing a packaging material that allows these items to not stick to its surface and reduce waste has become a common goal in the packaging industry. [0003] Chinese patent document CN102317067A proposes a packaging material, which uses a layer of hydrophobic oxide particles with an average particle size of 3-100 nm attached to a thermal adhesive layer of the packaging material to achieve non...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/30B32B7/12B32B15/09B32B15/20B32B33/00B32B38/06B32B37/02B32B38/16
CPCB32B3/30B32B5/16B32B7/12B32B15/09B32B15/20B32B33/00B32B37/02B32B38/06B32B38/164B32B2255/06B32B2255/26B32B2307/73B32B2439/70
Inventor 庄孝磊张杰周枫青谭伟杰刘歆
Owner SHANGHAI TECHSUN ANTI COUNTERFEITING TECH HLDG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com