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Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of high melting point and high reflow temperature of lead-free solder

Inactive Publication Date: 2017-11-28
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in recent years, from the viewpoint of environmental protection, the use of lead-free solder that does not contain lead is developing. However, the melting point of lead-free solder is high, so the reflow temperature is also increased. For the resin film used in semiconductors, it is required to withstand Adhesiveness subject to higher or equivalent high temperature than before

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0123] Hereinafter, although an Example etc. are given and this invention is demonstrated, this invention is not limited to these examples. In addition, the evaluation of the esterification rate of the synthesized quinonediazide compound and the positive photosensitive resin composition in an Example was performed by the following method.

[0124]

[0125] Using Lambda Ace STM-602 manufactured by Dainippon Screen Mfg. Co., Ltd., the respective film thicknesses were measured at a refractive index of 1.629 based on polyimide for the films after prebaking and development.

[0126]

[0127] Regarding (a-2) the imidization rate of polyimide, N-formazan with a solid content concentration of polyimide resin of 50% by mass was coated on a 6-inch silicon wafer by the spin coating method. Base pyrrolidone (NMP) solution, and then bake it with a 120°C hot plate (SKW-636 manufactured by Dainippon Screen Mfg. Co., Ltd.) for 3 minutes to make a pre-baked film with a thickness of 10 μm ±...

Synthetic example 1

[0142]

[0143] Under a stream of dry nitrogen, 18.3 g (0.05 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF) and 34.g (0.3 mol) of allyl glycidyl ether were dissolved In 100 g of γ-butyrolactone (GBL), cool to -15°C. 22.1 g (0.11 mol) of trimellitic anhydride acid chloride dissolved in 50 g of GBL was added dropwise thereto so that the temperature of the reaction liquid did not exceed 0°C. After completion of the dropwise addition, reaction was performed at 0°C for 4 hours. This solution was concentrated with a rotary evaporator and poured into 1 L of toluene to obtain a hydroxyl-containing acid anhydride (a) represented by the following formula.

[0144] [chemical formula 14]

[0145]

[0146] Hydroxyl-containing anhydrides (a)

Synthetic example 2

[0147]

[0148] Dissolve 18.3g (0.05 moles) of BAHF in 100 mL of acetone and 17.4 g (0.3 moles) of propylene oxide, and cool to -15°C. A solution obtained by dissolving 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride in 100 mL of acetone was added dropwise thereto. After completion of the dropwise addition, the reaction was performed at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was filtered and vacuum-dried at 50°C.

[0149] 30 g of the obtained solid was put into a 300 mL stainless steel autoclave, dispersed in 250 mL of methyl cellosolve, and 2 g of 5% palladium-carbon was added. Hydrogen was introduced thereinto with a balloon and vigorously stirred. After about 2 hours, it was confirmed that the balloon did not deflate further, and the reaction was terminated. After completion of the reaction, the catalyst palladium compound was removed by filtration, and concentrated with a rotary evaporator to obtain a hydroxyl group-contain...

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Abstract

Provided is a photosensitive resin composition that, despite having high sensitivity, can improve cohesion between a pattern curing film and metal wiring subsequent to a reflow process in a pattern curing film of a semiconductor device. This photosensitive resin composition is characterized by containing: at least one alkali-soluble resin selected from (a-1) resins principally containing a structure represented by general formula (1), (a-2) polyimides, and copolymers of these; and (c) a compound principally containing a structure represented by general formula (2).

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, it relates to a positive-type photosensitive resin composition suitable for a surface protection film on the surface of a semiconductor element, an interlayer insulating film, an insulating layer of an organic electroluminescent element, and the like. Background technique [0002] Resins represented by polyimide and polybenzoxazole have excellent heat resistance and electrical insulation properties, so they have been used for surface protection films of semiconductor devices, interlayer insulating films, and insulation of organic electroluminescent devices. layers etc. In recent years, along with the miniaturization of semiconductor elements, resolutions on the order of several μm are also required for surface protection films, interlayer insulating films, and the like. Therefore, in such applications, finely processed positive photosensitive polyimide resin compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023C08G8/10C08G73/14C08G73/22G03F7/004H10K99/00
CPCC08G73/14C08G73/22G03F7/0226C08G8/12C09D179/08C08G73/1042C08G73/105C08G73/106C08G73/1082C08G8/24G03F7/0233G03F7/0236H01L23/5329H10K71/233C08L61/06G03F7/004G03F7/023G03F7/037C08G8/10G03F7/26G03F7/2012G03F7/32G03F7/40H10K85/111H10K85/151H10K50/80G03F7/0046G03F7/039G03F7/0757G03F7/162G03F7/168G03F7/2004G03F7/322H01L23/53228
Inventor 池田芳史
Owner TORAY IND INC
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