Molybdenum disulfide nanosheet and preparation method thereof
A technology of molybdenum disulfide and nanosheets, which is applied in the direction of molybdenum sulfide, ion implantation plating, coating, etc., can solve the problems of process condition control conditions, high cost, and long time consumption, so as to improve the charge and discharge cycle performance, reduce the Effect of Small Polarization Resistance
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Embodiment 1
[0016] With the polished aluminum sheet as the substrate, the aluminum sheet is ultrasonically cleaned with acetone, ethanol, and distilled water in sequence
[0017] And after drying, put it into the vacuum chamber of the magnetron sputtering apparatus, adjust the base distance of the target to about 6cm, use metal molybdenum material as the target material, and the purity of the target material is above 99.99%, vacuumize to 8* 10 -4 Pa, and then heated the substrate stage, the temperature was raised to 100°C, and the flow rate of argon gas was 10.0 ml min -1 , the hydrogen sulfide flow rate is 1.0 ml min -1 , with a sputtering power of 9 W cm -2 , the sputtering pressure is 0.5Pa, the rotation speed of the substrate table is set to 5 cycles / min, the sputtering time is about 2 minutes, and the thickness is about 3 nm. After the MoS 2 After sputtering of the thin film, MoS will be sputter deposited with 2 The aluminum substrate of the film is immersed in a 10% hydrochloric...
Embodiment 2
[0019] With the polished copper sheet as the substrate, the aluminum sheet was ultrasonically cleaned with acetone, ethanol, and distilled water in sequence
[0020] And after drying, put it into the vacuum chamber of the magnetron sputtering apparatus, adjust the base distance of the target to about 7cm, use metal molybdenum material as the target material, and the purity of the target material is above 99.99%, vacuumize to 8* 10 -4 Pa, the flow rate of argon gas is 40.0 ml min -1 , the hydrogen sulfide flow rate is 3.0 ml min -1 , with a sputtering power of 8 W cm -2 , the sputtering pressure is 0.8Pa, the rotation speed of the substrate table is set to 10 cycles / min, the sputtering time is about 3 minutes, and the thickness is about 5 nm. After the MoS 2 After sputtering of the thin film, MoS will be sputter deposited with 2 The aluminum substrate of the thin film is immersed in a nitric acid solution with a mass fraction of 30% to remove the aluminum substrate, and MoS...
example 3
[0022] With the polished nickel sheet as the substrate, the aluminum sheet was ultrasonically cleaned with acetone, ethanol, and distilled water in sequence
[0023] And after drying, put it into the vacuum chamber of the magnetron sputtering apparatus, adjust the base distance of the target to about 7cm, use metal molybdenum material as the target material, and the purity of the target material is above 99.99%, vacuumize to 8* 10 -4 Pa, the flow rate of argon gas is 30.0 ml min -1 , the hydrogen sulfide flow rate is 1.5 ml min -1 , with a sputtering power of 5 W cm -2 , the sputtering pressure is 0.5 Pa, the rotation speed of the substrate table is set to 10 cycles / min, the sputtering time is about 3 minutes, and the thickness is about 3 nm, the MoS 2 Thin film sputtering. Sputtered with MoS 2 Nanosheet metal nickel sheets are used as catalytic hydrogen evolution electrodes, at 1mol L -1 Hydrogen is produced by electrolysis of water in a sulfuric acid medium, and the el...
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