Gallium-nitride-based light emitting diode epitaxial wafer and manufacturing method thereof
A light-emitting diode, gallium nitride-based technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as low luminous efficiency, and achieve the effects of improving luminous efficiency, improving crystal quality, and reducing stress polarization effects.
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Embodiment 1
[0028] An embodiment of the present invention provides a GaN-based light-emitting diode epitaxial wafer, figure 1 It is a schematic structural diagram of a gallium nitride-based light-emitting diode epitaxial wafer provided by an embodiment of the present invention, as shown in figure 1 As shown, the gallium nitride-based light-emitting diode includes a substrate 1, and a superlattice buffer layer 2, a high-temperature buffer layer 3, an N-type layer 4, a shallow well layer 5, and a multi-quantum well layer stacked on the substrate 1 in sequence. 6. Low-temperature P-type layer 7 , P-type electron blocking layer 8 , high-temperature P-type layer 9 , and P-type contact layer 10 .
[0029] Wherein, the superlattice buffer layer 2 is a superlattice structure including N periods, and each period of the superlattice structure includes a first sublayer 21, a second sublayer 22, and a third sublayer 22 stacked on the substrate 1. Sublayer 23, N is an integer greater than or equal to...
Embodiment 2
[0042] An embodiment of the present invention provides a method for manufacturing a gallium nitride-based light-emitting diode epitaxial wafer, which is suitable for the gallium nitride-based light-emitting diode epitaxial wafer provided in Embodiment 1. figure 2 It is a flow chart of a method for preparing a gallium nitride-based light-emitting diode epitaxial wafer provided by an embodiment of the present invention, as shown in figure 2 As shown, the manufacturing method includes:
[0043] Step 201, performing pretreatment on the substrate.
[0044] Optionally, the substrate is sapphire with a thickness of 630-650um.
[0045] In this embodiment, Veeco K465i or C4MOCVD (Metal Organic Chemical Vapor Deposition, metal organic compound chemical vapor deposition) equipment is used to realize the LED growth method. Using high-purity H 2 (hydrogen) or high-purity N 2 (nitrogen) or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As the...
Embodiment 3
[0070] An embodiment of the present invention provides a method for manufacturing a gallium nitride-based light-emitting diode epitaxial wafer. In this embodiment, the superlattice buffer layer is a superlattice structure including N periods, and the superlattice structure of each period It includes the first sublayer, the second sublayer and the third sublayer stacked on the substrate, 1x Ga 1-x N layer, 0.4y Ga 1-y N layer composition, 0.6z Ga 1-z N layer, 0.3
[0071] After finishing the growth of GaN-based light-emitting diode epitaxial wafers, lower the temperature of the reaction chamber to 600-900°C, in PN 2 The atmosphere is annealed for 10-30 minutes, and then gradually lowered to room temperature. Afterwards, a single 9*27mil chip is manufactured through cleaning, deposition, photolithography and etching follow-up processes.
[0072] After XRD (X-ray diffraction, X-ray diffraction) test, it is found that the LED chip provided by the embodiment of the presen...
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