Filler modifying method and application thereof
A modified and thermally conductive filler technology, which is applied in the field of filler modification, can solve the problems of unstable quality of modified filler, complicated modification process, and low production efficiency, and achieve uniform modification effect, simple process, and low cost Effect
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Embodiment 1
[0024] Add 5.0g of polydimethylsiloxane to a 25mL crucible; then place the above crucible in a stainless steel reaction kettle with a diameter of 4cm and a height of 8cm; then, place a crucible with an area of 3×3cm 2 1. A stainless steel mesh with a mesh number of 1000, spread 1g of graphene evenly on the stainless steel mesh; cover the lid of the stainless steel reaction kettle, put the reaction kettle in a muffle furnace at 300°C for 5 hours, and wait for the reaction system to cool to room temperature The organosilicon-modified graphene powder can be obtained.
[0025] Experiments further show that the organosilicon-modified graphene prepared by this method is basically consistent with the appearance of unmodified graphene, and has good hydrophobicity. Compared with pure graphene, modified graphene can be more stable. Dispersed in ethanol, isopropanol, acetone, 1,2-dichlorotoluene, N-methylpyrrolidone, dimethyl sulfoxide, N,N-dimethylformamide and other organic solvents,...
Embodiment 2
[0027] In the vacuum evaporation equipment, 100g of poly-p-phenylene imide ester is heated to 370°C for sublimation to form p-hydroxyisocyanate gas. Ceramics, reacted for 12 hours, during the process of cooling the reaction system to room temperature, part of the p-hydroxyisocyanate adsorbed on the surface of aluminum nitride and then polymerized to form poly-p-phenylene imide ester, thus obtaining poly-p-phenylene imide ester Modified aluminum nitride powder.
[0028] The experiment further shows that: the poly-p-phenylene imide modified aluminum nitride prepared by this method has good hydrolysis resistance; the composite material prepared by mixing 50vol.% modified aluminum nitride in the epoxy resin has the thermal conductivity The coefficient is as high as 2.03W / (m K), which is slightly smaller than the aluminum nitride / epoxy resin composite material (2.26W / (m K)) prepared under the same conditions. It can be seen that the thermal conductivity of boron nitride modified by...
Embodiment 3
[0030] Dissolve 10wt.% polyoxymethylene in dimethyl sulfoxide at 150°C, and spray the polyoxymethylene solution evenly on the porous alumina loaded with 1g of montmorillonite in a vacuum spraying device, and wait for the dimethyl sulfoxide to After the evaporation is complete, heat the polyoxymethylene to 280°C to depolymerize and form high-concentration formaldehyde gas. React for 30 minutes. When the reaction system is cooled to room temperature, part of the formaldehyde gas is adsorbed to the surface of the montmorillonite powder and polymerized to form polyoxymethylene, namely Polyoxymethylene modified montmorillonite powder can be obtained.
[0031] The experiment further shows that the water permeability of the composite material prepared by mixing 1wt.% modified montmorillonite in the epoxy resin is 1.72g m -2 the day -1 , the waterproof performance is better than that of the montmorillonite / epoxy resin composite prepared under the same conditions (2.91g m -2 the day ...
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