Electronic insulating encapsulating material and preparation method thereof

Abstract

The invention discloses an electronic insulating encapsulating material and a preparation method of the electronic insulating encapsulating material. The electronic insulating encapsulating material comprises, by weight, 10-15 parts of diamond, 20-30 parts of silicon carbide, 10-20 parts of carbon fiber, 15-30 parts of epoxy resin, 20-30 parts of heat conducting inorganic nanoparticles, 10-20 parts of anticorrosive agent, 10-15 parts flexibilizer, 20-25 parts of polyamide and 30-40 parts of matrix. According to the electronic insulating encapsulating material, the diamond, the silicon carbideand the carbon fiber all have high hardness, so that the composite prepared from the mixture of the diamond, the silicon carbide and the carbon fiber has quite high hardness, and compared with the hardness of an ordinary material, the hardness of the electronic insulating encapsulating material is improved by 20%-30%; meanwhile, the carbon fiber has quite strong heat conducting performance, so that heat dissipation of an electronic product is facilitated; due to addition of the flexibilizer, the tenacity of the material is improved by 37%-57%, an electronic element is protected against crackscaused by shake and impact, the electronic element is effectively protected, and the service life of the electronic element is prolonged by 2-3 times. The electronic insulating encapsulating materialis high in hardness and tenacity, the heat conducting performance and the insulating performance of the electronic insulating encapsulating material are greatly improved, and the electronic insulatingencapsulating material has great significance in development of heat conducting insulating materials.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to an electronic insulating packaging material and a preparation method thereof. Background technique [0002] In the electronics and information industries, many functional components need to be packaged as a whole after assembly to improve their performance and service life. As a packaging material, it can neither affect the performance of the component, but also play a protective role. At present, with the development of electronics, information industry and science and technology, people put forward requirements for packaging materials in terms of thermal conductivity, insulation, necessary mechanical properties and resistance to chemical environments. However, metal materials and polymer materials alone cannot satisfy the above properties at the same time. In the prior art, the two are often used in combination, and the metal or inorganic filler is used to fill t...

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Problems solved by technology

[0005] The purpose of the present invention is to provide an electronic insulation packaging material and its preparation method, which has the advantages of high processing efficiency, good thermal conductivity and insulation performance of the prepared material, ...

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