A compound texturizing liquid additive formula for preparing fine and dense pyramid monocrystalline silicon texture
A technology of texturing liquid and additives, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve the problems of environmental pollution, volatile alcohol substances, unsatisfactory texture, etc., and achieve no harm to the human body and the environment. , No danger of burning and explosion, the effect of improved texturing effect
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Embodiment 1
[0026] Take the following steps in the texturing process: 1) Additive preparation: with 1L deionized water as solvent, add 3.0g of imidazolinyl urea, 5.0g of glucose, 12.0g of PEG600, 3.0g of benzoic acid, 2.0g of NaBr and Na 2 SiO 34.0g was fully stirred and dissolved; 2) Preparation of texturing solution: 40.0 mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 15.0 mL of additives were added to obtain an alkaline texturing solution; 3) the cut After the monocrystalline silicon wafer is pre-cleaned, immerse it in the texturing solution, the temperature of the texturing solution is 85°C, and the texturing time is 12 minutes; Wash in water, dry the product in a drying oven to obtain a textured monocrystalline silicon wafer. The size of the pyramids formed on the surface of the monocrystalline silicon wafer is between 0.5-2 μm. The amount of silicon wafers is 3.5%.
Embodiment 2
[0028] Take the following steps in the texturing process: 1) Additive preparation: with 1L deionized water as solvent, add 2-phenylimidazoline 4.0g, fructose 3.0g, PEG800 14.0g, terephthalic acid 4.0g, NaCl 3.0g and Na 2 SiO 3 5.0g was fully stirred and dissolved; 2) preparation of texturing solution: 35.0mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 20.0mL of additives were added to obtain an alkaline texturing solution; 3) the cut After pre-cleaning the monocrystalline silicon wafer, immerse it in the texturing solution, the temperature of the texturing solution is 82°C, and the texturing time is 15 minutes; 4) Clean the monocrystalline silicon wafer after texturing with mixed acid and then use deionized Washing in water, drying the product in a drying oven to obtain a textured monocrystalline silicon wafer.
Embodiment 3
[0030] Take the following steps in the texturing process: 1) Additive preparation: with 1L deionized water as solvent, add 5.0g of 2-benzyl imidazoline, 4.0g of galactose, 10.0g of PEG10000, 2.0g of benzenesulfonic acid, 3.0g of NaI and NaI 2 SiO 3 3.0g was fully stirred and dissolved; 2) preparation of texturing solution: 42.0mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 22.0mL of additives were added to obtain an alkaline texturing solution; 3) the cut After the monocrystalline silicon wafer is pre-cleaned, immerse it in the texturing solution. The temperature of the texturing solution is 87°C, and the texturing time is 10 minutes; Washing in water, drying the product in a drying oven to obtain a textured monocrystalline silicon wafer.
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