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A kind of copper-aluminum composite material and preparation method thereof

A copper-aluminum composite material and copper ion technology, which is applied in the field of nanomaterials, can solve the problems of weak interface bonding strength, weakened bonding strength of copper-aluminum composite connectors, and difficult assembly and processing, and achieves reduction of rolling force and heat treatment annealing temperature. The effect of improving the interface bonding strength and mechanical properties, shortening the production cycle and energy cost

Active Publication Date: 2022-06-07
WENZHOU HONGFENG ELECTRICAL ALLOY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above connection technologies have certain defects in the preparation process, connection performance and manufacturing cost of copper-aluminum (Cu / Al) composite connectors. For example, copper-aluminum composite connectors produced by friction welding (FW) technology are mainly limited by The special processing conditions of friction welding and the cylindricity of copper-aluminum composite columns that cannot be precisely controlled lead to difficulties in subsequent assembly and processing, increased manufacturing costs, and cannot meet the development needs of future industrialization.
Copper-aluminum composite connectors prepared by brazing technology are prone to defects such as virtual welding and overflow soldering due to the introduction of the third component solder, resulting in increased internal resistance and poor stability of the connector, resulting in local areas of the connector Excessive temperature rise can cause safety accidents; and in the composite process of copper-aluminum composite connectors prepared by casting forming (Casting Forming), a higher casting temperature (>650°C) is conducive to the formation of a good interface between the two phases of copper and aluminum Bonding strength, but it is easy to form copper-aluminum intermediate compounds Cu / Al, Cu at the interface during the subsequent heat treatment process regulation 4 Al 3 and Au 3 Al 2 Such hard and brittle phases severely weaken the bonding strength of copper-aluminum composite connectors; in addition, the pouring temperature higher than the melting point of aluminum, an oxygen-free environment, and special surface treatment methods lead to large energy consumption for the preparation of connectors. The process conditions are harsh, and on the other hand, it is easy to have defects such as straightness deviation and high interface internal resistance between the copper pole and the connecting plate
[0003] Therefore, traditional copper-aluminum (Cu / Al) composite materials have performance defects such as weak interfacial bonding strength, high interfacial internal resistance, and poor mechanical properties. At present, the market needs to propose a composite material that can overcome the above defects

Method used

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  • A kind of copper-aluminum composite material and preparation method thereof

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Embodiment 1

[0029] This embodiment provides a copper-aluminum composite material, including a Cu metal plate and an Al metal plate, and the Cu metal plate and the Al metal plate are combined into one body through cold rolling, wherein, before the cold rolling combination, the Cu metal plate and the Al metal plate are combined into one body. The surface of the metal plate is uniformly sprayed with Cu nanosol particles, and in-situ etching forms abundant active sites, and a three-dimensional rough structure is constructed on the surface of Cu and / or Al metal. Formation of Cu nanosol particles for etching-assisted solid-state connection of copper-aluminum composites.

[0030] In the above embodiment, the sol technology and surface nano-etching technology are introduced to controllably prepare Cu nano-sol particles with uniform size and controllable shape, and the Cu nano-sol particles are sprayed onto the surface of Cu and / or Al metal, and in-situ etching is performed. Erosion builds a three...

Embodiment 2

[0038] This embodiment provides a copper-aluminum composite material, a Cu metal plate and an Al metal plate, and the Cu metal plate and the Al metal plate are composited into one body through cold rolling, wherein, before the cold rolling composite, the surface of the Cu metal plate is uniformly sprayed Cu nano-sol particles are etched in-situ to form abundant active sites, and a three-dimensional rough structure is constructed on the surface of Cu metal to form Cu nano-sol particles assisted by solid-state connection of copper-aluminum composite materials. Promote the interlocking of the Cu metal surface, and form a dual high-strength metallurgical bond between the Cu / Al interface and the side through the atomic diffusion and migration through the abundant active sites in the interface under the action of lower stress, avoiding the formation of intermediate phases and reducing the composite material. Interface internal resistance; effectively improve the interface bonding str...

Embodiment 3

[0048] This embodiment provides a copper-aluminum composite material, including: a Cu metal plate and an Al metal plate, and the Cu metal plate and the Al metal plate are composited into one body by cold rolling, wherein, before the cold rolling composite, on the surface of the Al metal plate The Cu nano-sol particles are uniformly sprayed, and abundant active sites are formed by in-situ etching, and a three-dimensional rough structure is constructed on the surface of the Al metal to form a Cu nano-sol particle etching-assisted solid-state connection of copper-aluminum composite materials. Promote the interlocking of Cu and Al metal surfaces, and form a high-strength metallurgical bond between the Cu / Al interface and the side surfaces through atomic diffusion and migration through the abundant active sites at the interface under lower stress, avoiding the formation of intermediate phases and reducing the recombination. The interface internal resistance of the material; effectiv...

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Abstract

The invention provides a copper-aluminum composite material and a preparation method thereof, comprising a Cu metal plate and an Al metal plate, the two are combined into one body through cold rolling, and before the cold rolling and compounding, Cu nano-sol is uniformly sprayed on the surface of the metal plate Particles are etched in situ to form abundant active sites, and a three-dimensional rough structure is constructed on the surface of Cu and / or Al metal to form a copper-aluminum composite material. The method comprises synthesizing Cu nano sol particles by a sol-gel method; uniformly spraying the Cu nano sol particles onto the surface of Cu and / or Al metal sheets, forming abundant active sites through in-situ etching, and forming a rich active site on the Cu and / or Al metal surface Construct a three-dimensional rough structure to obtain Cu and / or Al metal sheets with in-situ active etching on the surface; then connect the Cu and Al metal sheets after in-situ active etching on the surface to obtain copper-aluminum composite through cold rolling composite solid-state connection Material. The invention has the advantages of simple process, high production efficiency and low production cost.

Description

technical field [0001] The invention relates to the technical field of nanomaterials, in particular to a Cu nanosol particle etching-assisted solid-state connection copper-aluminum composite material and a preparation method. Background technique [0002] The battery pack system of a new energy vehicle is the main core component of the vehicle, and its performance is directly related to the electrical connection data / signal transmission of the power vehicle. The advantages of high electrical conductivity and thermal conductivity, light weight and low price of aluminum have been greatly developed in the field of electric vehicles as a battery electrode connector. In terms of manufacturing process, domestic electric vehicle battery electrode connectors mainly use conventional connection technologies such as friction welding, brazing, and casting to prepare copper-aluminum (Cu / Al) composite connectors for electrode connection, so as to obtain high reliability and good consisten...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/04B22F9/24B22F1/054C21D9/00C22F1/08C22F1/04B21B37/46B21B37/58H01M50/522B32B15/01B32B15/20B32B33/00B82Y30/00B82Y40/00
CPCC23C24/04B22F9/24C21D9/0081C22F1/08C22F1/04B21B37/46B21B37/58B32B15/012B32B15/016B32B33/00B82Y30/00B82Y40/00B21B2265/12B32B2605/08H01M50/50B22F1/054Y02E60/10
Inventor 陈晓祁更新穆成法沈涛张玲洁
Owner WENZHOU HONGFENG ELECTRICAL ALLOY
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