Graphene electrothermal film for floor heating
A graphene and electric heating film technology, applied in electric heating devices, ohmic resistance heating, applications, etc., can solve the problems of easy ignition and automatic connection of floor heating electric heating film, and achieve strong adhesion, good electrical connection performance, and anti-peeling performance. strong effect
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Embodiment 1
[0086] 1. Coarsening treatment
[0087] Put the roll-type copper foil (strip) to be treated into the wet etching equipment, adopt the roll-to-roll micro-etching process, and use the micro-etching solution to micro-etch the copper foil, that is, immerse the copper foil (strip) in the micro-etching solution, and the copper The foil (strip) is subjected to micro-etching treatment, the copper foil (strip) passes through the micro-etching solution at a constant speed, the surface of the copper foil (strip) is corroded by the micro-etching solution, and the copper foil (strip) is under the action of a strong oxidant to form copper oxide, which is then combined with Acid reaction, resulting in etching, the total chemical equation is: H 2 o 2 +Cu+H 2 SO 4 →CuSO 4 +2H 2 O, where:
[0088] The surface of the bridging silver paste electrode and the copper current-carrying electrode in the floor heating electrothermal film prepared by the method of the present invention is fully cov...
Embodiment 2
[0110] 1. Coarsening treatment
[0111] In addition to the microetching solution, the hydrogen peroxide-sulfuric acid system is used, in which the total concentration of hydrogen peroxide and sulfuric acid is 105g / L, the concentration ratio of hydrogen peroxide and sulfuric acid is: 1:2.5, the concentration of hydrogen peroxide is 30g / L, the concentration of sulfuric acid is 75g / L, and the reaction temperature is 25°C, the moving speed of the copper foil is 3m / min, the etching time is 100s, and the surface roughness Ra of the roughened copper foil is 2.5±0.5μm, the rest is the same as that of the embodiment 1.
[0112] 2. Implantation of copper electrodes
[0113] Except that the first adhesive is epoxy resin adhesive, the baking temperature is 100°C (usually 50-200°C, preferably 50-140°C); bake for 5 minutes (usually 1-20min); 2 symmetrically placed The roughened copper foil (strip) is 1.5cm away from the edge of the PET film of the first insulating substrate; the distance b...
Embodiment 3
[0122] 1. Coarsening treatment
[0123] In addition to the microetching solution, the hydrogen peroxide-sulfuric acid system is selected, in which the total concentration of hydrogen peroxide and sulfuric acid is 135g / L, the concentration ratio of hydrogen peroxide and sulfuric acid is: 1:3.5, the concentration of hydrogen peroxide is 30g / L, the concentration of sulfuric acid is 105g / L, and the reaction temperature is 30 °C, the moving speed of the copper foil (strip) is 2.5m / min, the etching time is 100s, and the roughness Ra of the surface of the roughened copper foil is 3.5±0.5μm, the rest are the same as in Example 1.
[0124] 2. Implantation of copper electrodes
[0125] Except that the first adhesive is an acrylic resin adhesive; the baking temperature in the oven is 80°C (usually 50-200°C, preferably 50-140°C); bake for 10min (usually 1-20min); symmetrical The distance between the two roughened copper foils (bars) placed is 0.5cm from the edge of the PET film of the fi...
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