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Double-sided metal grid flexible conductive film and manufacturing method thereof

A flexible conductive, double-sided metal technology, used in cable/conductor manufacturing, conductive layers on insulating carriers, circuits, etc., can solve problems such as thick photoresist coating, reduced touch sensitivity, and large thickness of metal grids , to achieve the effect of clear and accurate circuit pattern, improved touch sensitivity, and easy flexible expression

Active Publication Date: 2020-11-13
江苏软讯科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The conductive film is a thin film with conductive function. The most commonly used conductive film material for preparing transparent electrodes such as liquid crystal displays, plasma displays, electroluminescent displays, and touch screens on the market is ITO (indium tin oxide), and ITO contains about 75% indium Metal, indium is one of the rare metals with the lowest storage capacity in nature, which makes the cost of ITO conductive film higher, and its industrial sustainability is doubtful. In addition, ITO conductive film has problems such as color, fragility, toxicity, and difficulty in recycling. And in its preparation, the evaporation process will be used, the equipment cost is high, the material waste is large, and the cost pressure of large size is high. The flexible display is due to its strong plasticity and low square resistance of the metal grid, roll-to-roll printing process, low cost, and good quality. The advantages of optical penetration and flexibility can be bent to realize the replacement of ITO conductive film. In the patent "Metal Grid Single Film Double-sided Capacitive Screen Functional Sheet and Its Manufacturing Method" with the prior art publication number CN105335034A, the metal mesh The grid is realized by integrating etching technology and yellow light exposure technology. First, a layer of chromium oxide is plated on both sides of the PET film, and then copper is plated by vacuum magnetron sputtering, and a layer of photoresist is coated. After yellow light exposure technology and etching Technology, get the required lines, and finally blacken the copper lines, and integrate the metal and photoresist, which requires a lot of energy, which will lead to low line accuracy, and two adjacent parallel metal lines The distance between them is large, which reduces the touch sensitivity; the photoresist coating is thick and will be completely removed in the end, resulting in waste of raw materials; the thickness of the metal grid is large, the finished product is not light and thin, and it is all made of metal, which is not flexible enough. Therefore, we propose a double-sided metal grid flexible conductive film and its manufacturing method

Method used

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  • Double-sided metal grid flexible conductive film and manufacturing method thereof
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  • Double-sided metal grid flexible conductive film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Take a flexible transparent substrate, apply photoresist on its upper surface and lower surface respectively, and then cure at 70°C for 10s to form a photoresist layer; then take 65% pure water, 5% palladium Catalyst, 5% solvent and 5% active agent are mixed and heated to 100 ° C, stirred for 1 hour to prepare a catalyst solution, take the catalyst solution to coat the surface of the photoresist layer, and dry to form a catalyst layer to prepare a base film A, wherein the base material is polyimide, the palladium catalyst is palladium oxide, the solvent is ethyl lactate, and the active agent is fluorosurfactant FC-4430;

[0054] Take the base film A, and irradiate its upper surface and lower surface with ultraviolet light, the wavelength of ultraviolet light is 314nm, and the exposure energy is 50mJ / cm 2 , at this time, the photoresist layer and the photoresist layer and the photoresist layer are cured in the light-receiving area, and the base film B is prepared;

[00...

Embodiment 2

[0060] Take a flexible transparent substrate, apply photoresist on its upper surface and lower surface respectively, and then cure at 83°C for 35s to form a photoresist layer; then take 75% pure water, 7% palladium Catalyst, 10% solvent and 7% activator are mixed and heated to 115 ℃, stirred for 2.5 hours to prepare a catalyst solution, take the catalyst solution to coat the surface of the photoresist layer, and form a catalyst layer after drying to prepare the substrate Film A, wherein the base material is polyethylene terephthalate, the palladium catalyst is palladium hydroxide, the solvent is isopropanol, and the active agent is silicon-based surfactant BYK-3450;

[0061] Take the base film A, and irradiate the upper surface and the lower surface with ultraviolet light, the wavelength of ultraviolet light is 365nm, and the exposure energy is 65mJ / cm 2 , at this time, the photoresist layer and the photoresist layer and the photoresist layer are cured in the light-receiving a...

Embodiment 3

[0067] Take a flexible transparent substrate, apply photoresist on its upper surface and lower surface respectively, and then cure at 95°C for 60s to form a photoresist layer; then take 85% pure water, 10% palladium Catalyst, 15% solvent and 10% active agent are mixed and heated to 130 ° C, stirred for 4 hours to prepare a catalyst solution, take the catalyst solution to coat the surface of the photoresist layer, and dry to form a catalyst layer to prepare a base film A, wherein the base material is polycarbonate, the palladium catalyst is palladium chloride, the solvent is butanol, and the active agent is fluorosurfactant FS-3100;

[0068] Take the base film A, and irradiate its upper surface and lower surface with ultraviolet light, the wavelength of ultraviolet light is 314nm, and the exposure energy is 80mJ / cm 2 , at this time, the photoresist layer and the photoresist layer and the photoresist layer are cured in the light-receiving area, and the base film B is prepared; ...

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Abstract

The invention discloses a double-sided metal grid flexible conductive film and a manufacturing method thereof. The double-sided metal grid flexible conductive film comprises a base material, metal grids and a protective layer, wherein the metal grids are arranged on the upper side and the lower side of the base material, and the protective layer is arranged on the side, which deviates from the base material, of each metal grid. According to the manufacturing method of the conductive film, firstly a photoresist layer and a catalyst layer are exposed and developed to form a circuit pattern, thenmetal plating and blackening are carried out, only the photoresist needs to be etched, the required exposure energy is relatively low, the circuit pattern is clearer and more accurate, the distance between two adjacent parallel metal wires is reduced, and the touch sensitivity of the conductive film is improved. According to the manufacturing method, the thicknesses of the photoresist layer, thecatalyst layer, the metal layer, the blackening layer and the protective layer are limited, the overall thickness of the conductive film is reduced, the finished product is light and thin, flexible expression of the conductive film is more convenient, the needed photoresist amount is smaller, the processing technology is simple, the cost is lower, and the manufacturing method is suitable for wideapplication and popularization.

Description

technical field [0001] The invention relates to the field of conductive films, in particular to a double-sided metal grid flexible conductive film and a manufacturing method thereof. Background technique [0002] The conductive film is a thin film with conductive function. The most commonly used conductive film material for preparing transparent electrodes such as liquid crystal displays, plasma displays, electroluminescent displays, and touch screens on the market is ITO (indium tin oxide), and ITO contains about 75% indium Metal, indium is one of the rare metals with the lowest storage capacity in nature, which makes the cost of ITO conductive film higher, and its industrial sustainability is doubtful. In addition, ITO conductive film has problems such as color, fragility, toxicity, and difficulty in recycling. And in its preparation, the evaporation process will be used, the equipment cost is high, the material waste is large, and the cost pressure of large size is high. ...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B13/00
CPCH01B5/14H01B13/00H01B13/003
Inventor 谢才兴丁力郑时恒
Owner 江苏软讯科技有限公司
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