High-thermal-conductivity composite PCB substrate and preparation method thereof

A high thermal conductivity, substrate technology, used in circuit substrate materials, circuit thermal devices, printed circuit manufacturing, etc., can solve problems such as poor compatibility, high interface thermal resistance, and reduced thermal conductivity efficiency, so as to reduce electrical performance differences, reduce The effect of dielectric loss and simple operation process

Active Publication Date: 2021-01-26
SHAANXI UNIV OF SCI & TECH
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface of GF contains a lot of silanol, which is very easy to absorb water.
However, the compatibility between GF and PTFE itself is poor. On the one hand, it will lead to higher water absorption of its composite PCB substrate; on the other hand, poor interface compatibility will introduce defects into the composite material and lead to high interface thermal resistance, thus Reduced thermal conductivity improves efficiency
At the same time, the water absorption of the composite PCB substrate will aggravate the difference in electrical properties between the filler and the polymer matrix, resulting in stronger interfacial polarization, thereby increasing its dielectric constant and dielectric loss.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0027] The invention provides a method for preparing a high thermal conductivity composite PCB substrate, the process steps of which are as follows:

[0028] (1) Surface treatment of BN and GF

[0029] First, disperse 0.1-5 parts of fluorine-containing coupling agent and 5-20 parts of BN in 100-5000 parts of good solvent, adjust the pH to 2-5 to fully hydrolyze the coupling agent, and stir until mixed evenly. Next, at 50-100°C, completely immerse the GF cloth in the above mixture and let it stand for a certain period of time, then slowly lift it out. Secondly, the impregnated GF cloth is quickly dipped in alkali solution with pH=10-12 to accelerate the condensation of fluorine-containing coupling agent on the surface of BN and GF. Finally, dry the alkali-treated GF cloth at 60-150°C for 10 min-2 h to further promote the complete polymerization of the fluorine-containing coupling agent, thereby preparing a modified BN / GF composite cloth.

[0030] (2) Preparation of boron nitr...

Embodiment 1

[0038] (1) Surface treatment of BN and GF

[0039] First, disperse 0.1 part of KH-1331, 2 parts of 300nm h-BN and 3 parts of 1μm h-BN in 1000 parts of ethanol, adjust the pH to 3 to fully hydrolyze KH-1331, and stir until the mixture is uniform. Next, at 78°C, the GF cloth with a diameter of 5 μm was completely immersed in the above mixture and allowed to stand for 30 minutes, and then slowly lifted out. Secondly, the impregnated GF cloth was quickly dipped in the alkali solution with pH=12, so that the KH-1331 containing KH-1331 could be rapidly condensed on the surface of BN and GF. Finally, the alkali-treated GF cloth was dried at 100°C for 30 min to further promote the complete polymerization of KH-1331, thereby preparing a modified BN / GF composite cloth.

[0040] (2) Preparation of boron nitride / glass fiber / polytetrafluoroethylene composite PCB substrate

[0041] Firstly, 50 copies of modified BN / GF composite cloth are dipped in PTFE glue by a dipping machine, then dried ...

Embodiment 2

[0044] (1) Surface treatment of BN and GF

[0045] First, 1.5 parts of KH-1332, 5 parts of h-BN with a particle size of 3 μm and 2 parts of BNNS with a lateral size of 70 nm were dispersed in 800 parts of acetone, the pH was adjusted to 2 to fully hydrolyze KH-1332, and stirred until well mixed. Next, at 60°C, GF cloth with a diameter of 2 μm was completely immersed in the above mixture and left for 45 minutes, then slowly lifted out. Secondly, the impregnated GF cloth was quickly dipped in alkaline solution with pH=10 to accelerate the condensation of KH-1332 on the surface of BN and GF. Finally, the alkali-treated GF cloth was dried at 80°C for 1 h to further promote the complete polymerization of KH-1332, thereby preparing a modified BN / GF composite cloth.

[0046] (2) Preparation of boron nitride / glass fiber / polytetrafluoroethylene composite PCB substrate

[0047] Firstly, 30 copies of modified BN / GF composite cloth are dipped in PTFE glue by a dipping machine, then dri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
peel strengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a high-thermal-conductivity composite PCB substrate and a preparation method thereof. The preparation method comprises the following steps: step 1, dispersing a fluorine-containing coupling agent and boron nitride into a good solvent to obtain an impregnation liquid, adjusting the impregnation liquid to be acidic, then immersing glass fiber cloth into the impregnation liquid, taking out the glass fiber cloth from the impregnation liquid, carrying out alkali treatment, and drying to obtain boron nitride/glass fiber composite cloth; and step 2, dipping the boron nitride/glass fiber composite cloth in a polytetrafluoroethylene glue solution, drying to obtain a boron nitride/glass fiber/polytetrafluoroethylene prepreg, and carrying out curing treatment on the multilayerboron nitride/glass fiber/polytetrafluoroethylene prepreg to obtain the composite PCB substrate. The method is suitable for large-scale production of the high-thermal-conductivity PCB substrate for high-frequency and high-speed data transmission, and has important practical significance and popularization value in the field of high-frequency and high-speed PCB substrates.

Description

technical field [0001] The invention belongs to the scientific and technical field of advanced composite materials, in particular to a high thermal conductivity composite PCB substrate and a preparation method thereof. Background technique [0002] With the rapid development of 5G communication, the volume of integrated circuit chips and electronic components continues to shrink, while the integration and assembly density continue to increase, resulting in a sharp increase in power consumption and heat generation. Therefore, PCB substrate materials require high thermal conductivity. To dissipate heat to prolong the life of electronic equipment. At the same time, with the increase of operating frequency, it is necessary to use electronic packaging and substrates with low dielectric constant and low dielectric loss to increase the signal transmission speed and reduce the loss of signal strength. Therefore, in addition to strict requirements on dielectric properties, PCB subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02H05K1/03C08L27/18C08K9/06C08K3/38C08K7/14C08K7/00C08K7/24C08J5/24
CPCH05K3/0011H05K1/0366H05K1/0373H05K1/0203C08J5/24C08J2327/18C08K9/06C08K2003/385C08K7/14C08K7/00C08K7/24C08K2201/011C08K2201/003H05K2201/015
Inventor 刘超殷青李茜袁启明
Owner SHAANXI UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap