Inorganic salt additive for surface roughening treatment of low-profile electrolytic copper foil and its treatment process

Abstract

The invention relates to the technical field of electronic materials, in particular to an inorganic salt additive for roughening the surface of low-profile electrolytic copper foil and a treatment process thereof. The roughening solution contains copper sulfate, concentrated sulfuric acid, water, soluble fluorosilicate and soluble sulfur tungstate, wherein, based on the total amount of the roughening solution, the amount of soluble fluorosilicate in the roughening solution The content is 5‑200mg / L, and the content of soluble sulfur tungstate is 5‑100mg / L. The roughening solution containing soluble fluorosilicate and soluble sulfur tungstate provided by the invention can significantly improve the throwing ability of the roughening treatment and the tightness of surface crystallization in the electrolytic copper foil process; at the same time, the electrolytic copper foil provided by the invention Copper foil, with good throwing ability, can form a dense roughened layer, improve oxidation resistance and anti-stripping ability, and has little effect on surface roughness. After treatment, the surface roughness of 35μm copper foil is 6‑8μm, which is anti-stripping Strength ≥ 1.8kg / cm.

Description

Technical field [0001] The present invention relates to the field of electronic materials, and more particularly to a low contour electrolytic copper foil surface trungestration inorganic salt additive and its processing processes thereof. Background technique [0002] Electronic copper foil is one of the important raw materials in PCB manufacturing. The main role in PCB is electrically conductive, heat dissipation, etc., the performance index of the overall, quality, manufacturing level, manufacturing cost, product processability and reliability, etc. of PCB is huge. With the development of information technology, the application of electronic equipment has continued to expand, and the total development of the 5G network base station, the vigorous development of the new energy industry, puts higher technical requirements for copper foil. In the use of electronic devices, high-frequency signal transmission is often required, which is affected by the skin effect. The electrical si...

AI Technical Summary

Problems solved by technology

[0005] However, in the actual production process, the commonly used organic additives still have two very serious defects. On the one hand, the organic additives are hydrolyzed into functional groups with different chemical properties, which are difficult to pass conventional and simple analysis tests such as titration and direct reading spectroscopy. method to determine the exact content of this component in the plating solution, the difficulty of real-time monitoring of the additive content during production is obviously increased, and it can only be judged by the quality inspection of the product, which is very lagging; on the other hand, the validity period of organic additives is generally 3- 5 days, it is very easy to deteriorate and is easily absorbed by the activated carbon filter element in the plating solution purification system, making the content of organic additives in the plating solution even more uncontrollable

These two serious defects will reduce the yield rate of copper foil, and seriously affect the production efficiency and economic benefits.

In contrast, inorganic additives have the advantages of simple composition analysis, long duration of effect, stable plating solution and not easy to deteriorate, but generally have disadvantages such as low peel strength and poor throwing effect

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