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A kind of high temperature resistant cyanate ester conductive adhesive and preparation method thereof

A technology of cyanate ester and conductive adhesive, which is applied in the direction of conductive adhesives, adhesives, polymer adhesive additives, etc., can solve the problems of reduced electrical conductivity and impact on service life, and achieves reduced gas production, excellent high temperature resistance, The effect of low mass loss

Active Publication Date: 2021-12-31
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, the metal filler will produce electromigration phenomenon under the action of electric field, which will reduce the conductivity and affect its service life.

Method used

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  • A kind of high temperature resistant cyanate ester conductive adhesive and preparation method thereof
  • A kind of high temperature resistant cyanate ester conductive adhesive and preparation method thereof
  • A kind of high temperature resistant cyanate ester conductive adhesive and preparation method thereof

Examples

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preparation example Construction

[0055] A preparation method of the above-mentioned high temperature resistant cyanate ester conductive adhesive, the method may further comprise the steps:

[0056] (1) In parts by mass, disperse conductive filler and / or low-potential metal filler into low-boiling point solvent by ultrasonic or stirring method, add high-temperature-resistant chelating agent, continue ultrasonic or stirring, filter and dry to obtain mixed material A; wherein , low-boiling point solvents include one or more of ethanol, acetone, and isopropanol; the time for continuing to sonicate or stir is 6-12h;

[0057] (2) In parts by mass, the corrosion inhibitor and / or curing agent and / or reactive diluent and / or toughening agent and / or adhesion promoter are added to the cyanate resin and mixed uniformly to obtain the mixed material B;

[0058] (3) After mixing the mixed material A and the mixed material B, vacuum mixing and degassing to obtain a high temperature resistant cyanate ester conductive adhesive,...

Embodiment 1

[0060] A preparation method of high temperature resistant cyanate ester conductive adhesive, the method comprises the following steps:

[0061] (1) Weigh 78 parts of silver powder and 1 part of indium powder, ultrasonically disperse them into a sufficient amount of acetone / isopropanol mixed solvent, filter and vacuum dry the powders.

[0062] (2) Weigh 0.15 parts of nonylphenol, 0.05 parts of copper acetylacetonate, 0.1 parts of DTPA dianhydride, 2 parts of tripropylene glycol diacrylate, 0.7 parts of nitrile rubber, 1 part of polyvinyl butyral, and disperse to 5 parts bisphenol A and 12 parts bisphenol E mixed resin.

[0063] (3) Put all the obtained materials into a double planetary ball mill, stir and vacuum defoam at 100-120° C. to obtain a high-temperature-resistant cyanate ester conductive adhesive with a total number of 100 parts.

[0064] According to GJB548B, verify the bonding performance of the high-temperature-resistant cyanate ester conductive adhesive prepared i...

Embodiment 2

[0067] A preparation method of high temperature resistant cyanate ester conductive adhesive, the method comprises the following steps:

[0068] (1) Weigh 79 parts of silver powder and 2 parts of indium powder, ultrasonically disperse them into a sufficient amount of acetone / isopropanol mixed solvent, filter and dry the powder in vacuum.

[0069] (2) Weigh 0.15 parts of nonylphenol, 0.05 parts of cobalt acetylacetonate, 0.1 part of DTPA dianhydride, 1.6 parts of nitrile rubber, and 0.1 part of polyvinyl butyral, and disperse them into 17 parts of bisphenol E resin.

[0070] (3) Put all the obtained materials into a double planetary ball mill, stir and vacuum defoam at 100-120° C. to obtain a high-temperature-resistant cyanate ester conductive adhesive with a total number of 100 parts.

[0071] According to GJB548B, verify the bonding performance of the high-temperature-resistant cyanate ester conductive adhesive prepared in this example, use the conductive adhesive of this exam...

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Abstract

The invention relates to a high-temperature-resistant cyanate ester conductive adhesive and a preparation method thereof. The conductive adhesive comprises the following components in parts by mass: 10-40 parts of cyanate resin, 50-90 parts of conductive filler, and 0-6 parts of low-potential metal , 0-3 parts of corrosion inhibitor, 0.01-2 parts of curing agent, 0.01-2 parts of high temperature resistant chelating agent, 0-20 parts of reactive diluent, 0.1-6 parts of toughening agent, and 0.1-5 parts of adhesion promoter; , at least one of the low-potential metal and the corrosion inhibitor is added in a non-zero amount. Compared with the existing technology, the high-temperature-resistant conductive adhesive of the present invention achieves excellent high-temperature resistance and low outgassing characteristics, and the prepared high-temperature-resistant cyanate ester conductive adhesive has extremely low mass loss during the curing process and thermal stability far higher than 300°C and more than 2 times the chip shear strength required by the standard.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a high-temperature-resistant cyanate ester conductive adhesive and a preparation method thereof. Background technique [0002] As an important part of electronic packaging, die bonding plays a vital role in the sealing, stability, and heat dissipation of packaged chips. As an important method of chip bonding, high temperature resistant conductive adhesive does not require special equipment. In addition to meeting the two basic requirements of conductivity and bonding, it can also be cured at a lower temperature to avoid stress concentration of riveting and interference of electromagnetic signals. Loss, leakage, etc., especially in the electronics industry that is developing towards miniaturization and integration, its minimum line resolution can reach 25.4μm, which is only 1 / 15 of traditional brazing, suitable for fine-pitch manufacturing. [0003] A significant pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J179/04C09J4/06C09J11/04C09J11/06C09J11/08
CPCC09J9/02C09J179/04C09J4/06C09J11/04C09J11/06C09J11/08C08K2003/0806C08L2205/025C08L2205/035C08L2205/03C08L2201/04C08L2203/206C08L2201/08C08L79/04C08L9/02C08L29/14C08K13/02C08K3/08C08K5/13C08K5/544C08K5/092
Inventor 孙怡坤龙东辉朱召贤
Owner EAST CHINA UNIV OF SCI & TECH